摘要:
An apparatus for measuring the positions of marks on a mask is provided, said apparatus comprising a mask holder for holding the mask, a recording unit for recording the marks of the mask held by the mask holder, an actuating module for moving the mask holder and the recording unit relative to each other, and an evaluating module, which numerically calculates the gravity-induced sagging of the mask in the mask holder and determines the positions of the marks on the mask, based on the calculated sagging, the recordings made by the recording unit and the relative movement between the mask holder and the recording unit, wherein, prior to calculating said sagging, the present position of the mask in the mask holder is determined and is taken into consideration in said numerical calculation, and/or the geometrical dimensions of the mask are taken into consideration in said numerical calculation of sagging.
摘要:
A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.
摘要:
A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.
摘要:
A scattered light measurement device includes an illumination mask providing measuring radiation on an entrance side (1a) of a test component (1) and a detection part (3-6) for detection of light scattered by the test component and disposed on an exit side (1b) of the test component. The illumination mask includes at least one scattered light measurement structure, wherein the scattered light measurement structure has a scattered light marker zone and wherein the scattered light marker zone has a rotationally non-symmetric shape.
摘要:
An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium. Applications include, for example, the range-resolved determination of scattered light of projection objectives in microlithography projection-exposure systems.
摘要:
An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium. Applications include, for example, the range-resolved determination of scattered light of projection objectives in microlithography projection-exposure systems.
摘要:
An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium. Applications include, for example, the range-resolved determination of scattered light of projection objectives in microlithography projection-exposure systems.
摘要:
The invention relates to a method for measuring structures on masks (1) for photolithography, wherein firstly the mask (1) is mounted on a spatially movable platform (2). The position of the platform (2) is controlled in this case. The structure on the mask (1) is illuminated with illumination light from an illumination light source which emits coherent light. The light coming from the mask (1) is imaged onto a detection device (6) by an imaging optical unit (4) and detected. The detected signals are evaluated in an evaluation device (7) and the positions and dimensions of the structures are determined. The invention also relates to an apparatus by which these method steps, in particular, can be carried out. In this case, the accuracy of the position and dimension determination is increased by the properties of the illumination light being coordinated with the structure to be measured. For this purpose, the illumination device (3, 3′) has setting means for coordinating the properties of the illumination light with the structure to be measured.
摘要:
The invention relates to a method for measuring structures on masks (1) for photolithography, wherein firstly the mask (1) is mounted on a spatially movable platform (2). The position of the platform (2) is controlled in this case. The structure on the mask (1) is illuminated with illumination light from an illumination light source which emits coherent light. The light coming from the mask (1) is imaged onto a detection device (6) by an imaging optical unit (4) and detected. The detected signals are evaluated in an evaluation device (7) and the positions and dimensions of the structures are determined. The invention also relates to an apparatus by which these method steps, in particular, can be carried out. In this case, the accuracy of the position and dimension determination is increased by the properties of the illumination light being coordinated with the structure to be measured. For this purpose, the illumination device (3, 3′) has setting means for coordinating the properties of the illumination light with the structure to be measured.
摘要:
A method is provided for determining the relative overlay shift of stacked layers, said method comprising the steps of: a) providing a reference image including a reference pattern that comprises first and second pattern elements; b) providing a measurement image of a measurement pattern, which comprises a first pattern element formed by a first one of the layers and a second pattern element formed by a second one of the layers; c) weighting the reference or measurement image such that a weighted first image is generated, in which the first pattern element is emphasized relative to the second pattern element; d) determining the relative shift of the first pattern element on the basis of the weighted first image and of the measurement or reference image not weighted in step c); e) weighting the reference or measurement image such that a weighted second image is generated, in which the second pattern element is emphasized relative to the first pattern element; f) determining the relative shift of the second pattern element on the basis of the weighted second image and of the measurement or reference image not weighted in step e); g) determining the relative overlay shift on the basis of the relative shifts determined in steps d) and f).