公开(公告)号：US08779561B2

公开(公告)日：2014-07-15

申请号：US12779695

申请日：2010-05-13

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L23/58

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US20070221942A1

公开(公告)日：2007-09-27

申请号：US11723235

申请日：2007-03-19

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US07795635B2

公开(公告)日：2010-09-14

申请号：US11714193

申请日：2007-03-06

申请人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

发明人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

IPC分类号： H01L33/64

CPC分类号： H05K1/0206 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

摘要翻译： 这里公开了配备有LED的背光单元。 背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。 绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。 上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。 下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。 上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

公开(公告)号：US20070221941A1

公开(公告)日：2007-09-27

申请号：US11714193

申请日：2007-03-06

申请人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

发明人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

IPC分类号： H01L33/00

CPC分类号： H05K1/0206 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

摘要翻译： 这里公开了配备有LED的背光单元。 背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。 绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。 上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。 下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。 上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

公开(公告)号：US08053804B2

公开(公告)日：2011-11-08

申请号：US12693994

申请日：2010-01-26

申请人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

发明人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

IPC分类号： H01L33/64

CPC分类号： H05K1/0206 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

摘要翻译： 这里公开了配备有LED的背光单元。 背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。 绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。 上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。 下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。 上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。