公开(公告)号：US20100227423A1

公开(公告)日：2010-09-09

申请号：US12779695

申请日：2010-05-13

申请人： Gi Ho JEONG ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho JEONG ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US08779561B2

公开(公告)日：2014-07-15

申请号：US12779695

申请日：2010-05-13

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L23/58

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US20070221942A1

公开(公告)日：2007-09-27

申请号：US11723235

申请日：2007-03-19

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US08198542B2

公开(公告)日：2012-06-12

申请号：US12213570

申请日：2008-06-20

申请人： Kyung Ho Lee ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

发明人： Kyung Ho Lee ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

IPC分类号： H05K1/02

CPC分类号： H05K1/028 ,  H05K1/0218 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/0715 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126

摘要： An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.

摘要翻译： FPCB及其制造方法，其中FPCB的电信号传导部分经受很小的应力，以便尽管FPCB的反复弯曲而不会被疲劳破坏，从而增加FPCB的寿命 。

公开(公告)号：US20120111618A1

公开(公告)日：2012-05-10

申请号：US13161760

申请日：2011-06-16

申请人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

发明人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC分类号： H05K1/02 ,  C08L63/04 ,  C08L63/10 ,  C08L63/00

CPC分类号： H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

摘要翻译： 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20120291272A1

公开(公告)日：2012-11-22

申请号：US13472937

申请日：2012-05-16

申请人： Kyung Ho LEE ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

发明人： Kyung Ho LEE ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

IPC分类号： H05K3/00

CPC分类号： H05K1/028 ,  H05K1/0218 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/0715 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126

摘要： An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.

公开(公告)号：US08309636B2

公开(公告)日：2012-11-13

申请号：US13161760

申请日：2011-06-16

申请人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

发明人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC分类号： C08K5/5397

CPC分类号： H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

摘要翻译： 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20120103507A1

公开(公告)日：2012-05-03

申请号：US13137937

申请日：2011-09-21

申请人： Jae Choon Cho ,  Hyung Mi Jung ,  Hwa Young Lee ,  Choon Keun Lee

发明人： Jae Choon Cho ,  Hyung Mi Jung ,  Hwa Young Lee ,  Choon Keun Lee

IPC分类号： B32B38/04 ,  G03F7/09 ,  B32B37/14 ,  H01L21/02 ,  B32B37/02 ,  G03F7/028 ,  G03F7/38

CPC分类号： H05K3/4676 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  H05K3/4661 ,  H05K2201/012 ,  Y10T156/1057

摘要： Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes.

摘要翻译： 本文公开了一种用于制造电路板的方法。 制造电路板的方法包括：制备光敏复合材料; 通过将光敏复合材料浇铸成由聚对苯二甲酸乙二醇酯（PET）材料制成的膜来制备积聚绝缘膜; 将积层绝缘膜堆叠在板上; 通过使用光刻工艺在积层绝缘膜上形成通孔; 以及在通孔中形成导电通孔。

公开(公告)号：US20120074430A1

公开(公告)日：2012-03-29

申请号：US13137877

申请日：2011-09-20

申请人： Kyu Sang Lee ,  Sang Su Hong ,  Hyun Ho Lim ,  Hwa Young Lee ,  Choon Keun Lee ,  Jae Choon Cho

发明人： Kyu Sang Lee ,  Sang Su Hong ,  Hyun Ho Lim ,  Hwa Young Lee ,  Choon Keun Lee ,  Jae Choon Cho

IPC分类号： H01L33/64 ,  B32B27/20 ,  B32B37/24 ,  C08L63/00 ,  B32B27/38 ,  B32B9/00 ,  B82Y30/00

CPC分类号： H01L33/641 ,  B82Y20/00 ,  B82Y30/00 ,  C08K3/042 ,  C08L63/00 ,  H01L21/4857 ,  H01L23/3737 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/12044 ,  Y10T428/30

摘要： Disclosed herein is a radiating substrate radiating heat generated from a predetermined heating element to the outside. The radiating substrate includes polymer resins and graphenes distributed in the polymer resins.

摘要翻译： 这里公开了将从预定加热元件产生的热辐射到外部的辐射基板。 辐射基板包括聚合物树脂和分布在聚合物树脂中的石墨烯。

公开(公告)号：US08832929B2

公开(公告)日：2014-09-16

申请号：US13472937

申请日：2012-05-16

申请人： Kyung Ho Lee ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

发明人： Kyung Ho Lee ,  Se Min Oh ,  Chang Hwan Choi ,  Choon Keun Lee ,  Jeong Yeol Moon ,  Jong Rip Kim

IPC分类号： H05K3/00 ,  H05K1/02

CPC分类号： H05K1/028 ,  H05K1/0218 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/0715 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126

摘要： A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.

摘要翻译： 一种制造柔性印刷电路板的方法，包括确定导电部分的弹性模量和第一和第二电介质部分的弹性模量，确定导电部分和第一和第二电介质部分的厚度，使得中性平面位于 在导电部分的厚度的预定范围内，响应于柔性印刷电路板的弯曲，中性面基本上不受张力或压缩，并且根据确定的厚度和确定的弹性模量来绝缘导电部分。