利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.066 秒)

    SLURRY COMPOSITIONS AND METHODS OF POLISHING A LAYER USING THE SLURRY COMPOSITIONS
    1.
    发明申请
    SLURRY COMPOSITIONS AND METHODS OF POLISHING A LAYER USING THE SLURRY COMPOSITIONS 有权
    浆料组合物和使用浆料组合物抛光层的方法

    公开(公告)号：US20080081542A1

    公开(公告)日：2008-04-03

    申请号：US11853735

    申请日：2007-09-11

    申请人： Gi-Sik HONG ,  Dong-Jun LEE ,  Nam-Soo KIM ,  Kyoung-Moon KANG

    发明人： Gi-Sik HONG ,  Dong-Jun LEE ,  Nam-Soo KIM ,  Kyoung-Moon KANG

    IPC分类号： B24B29/02 ,  B24D3/04

    CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/31053

    摘要： In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight of a nonionic surfactant, from about 0.01 to 1 percent by weight of a polish accelerating agent including an amino acid compound, and a remainder of an aqueous solution including a basic pH-controlling agent and water. The slurry composition including the nonionic surfactant and the polish accelerating agent may be used for speedily polishing a stepped upper portion of a silicon oxide layer, and may also enable a lower portion of the silicon oxide layer to function as a polish stop layer.

    摘要翻译： 在浆料组合物和使用浆料组合物抛光层的方法中，浆料组合物包括约3-20重量％的研磨剂，约0.1-3重量％的离子表面活性剂，约0.01至0.1重量％ 重量百分比的非离子表面活性剂，约0.01至1％重量的包含氨基酸化合物的抛光促进剂，以及剩余的包含碱性pH控制剂和水的水溶液。 包括非离子表面活性剂和抛光促进剂的浆料组合物可以用于快速抛光氧化硅层的阶梯状上部，并且还可以使氧化硅层的下部用作抛光停止层。

    CONDITIONER DEVICE FOR CONDITIONING POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
    4.
    发明申请
    CONDITIONER DEVICE FOR CONDITIONING POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME 有权
    用于调节抛光垫的调节装置和包括其的化学机械抛光装置

    公开(公告)号：US20070167117A1

    公开(公告)日：2007-07-19

    申请号：US11466425

    申请日：2006-08-22

    申请人： Sung-Taek MOON ,  Dong-Jun LEE ,  Kyoung-Moon KANG ,  Nam-Soo KIM ,  Bong-Su AHN

    发明人： Sung-Taek MOON ,  Dong-Jun LEE ,  Kyoung-Moon KANG ,  Nam-Soo KIM ,  Bong-Su AHN

    IPC分类号： B24B7/00 ,  B24B29/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24B53/14

    摘要： The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.

    摘要翻译： 本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光（CMP）装置。 本发明的调节装置包括可旋转支撑板，其包括支撑板表面，该支撑板表面包括围绕支撑板的旋转轴线的中心区域，围绕中心区域的中间区域和围绕中间区域的周边区域，多个 位于支撑板表面的中部区域的一部分内的调理区。 多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。 由浆料流过的调节区限定的多个通道，通道占据中部区域的未被调节区域，中心区域和周边区域占据的部分。