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23 条记录 (耗时 0.027 秒)

    Method and apparatus for optimizing heat transfer with electronic components
    5.
    发明申请
    Method and apparatus for optimizing heat transfer with electronic components 有权
    用于优化电子部件传热的方法和装置

    公开(公告)号：US20070086168A1

    公开(公告)日：2007-04-19

    申请号：US11249911

    申请日：2005-10-13

    申请人： Vijayeshwar Khanna ,  Joseph Kuczynski ,  Arvind Sinha ,  Sri Sri-Jayantha

    发明人： Vijayeshwar Khanna ,  Joseph Kuczynski ,  Arvind Sinha ,  Sri Sri-Jayantha

    IPC分类号： H05K7/20

    CPC分类号： H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

    摘要翻译： 传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括用于将一个或多个半导体芯片加载以与散热器组件接合的装载组件。 提供了一种封装机构，其包含足够量的导热介质以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量，其中导热介质填充一个或多个半导体芯片之间的任何间隙或空间 半导体芯片和散热器组件。

    Method to monitor substrate viability by a sensor mounted to a substrate
    7.
    发明授权
    Method to monitor substrate viability by a sensor mounted to a substrate 失效
    通过安装在基板上的传感器来监测衬底生存力的方法

    公开(公告)号：US07741834B2

    公开(公告)日：2010-06-22

    申请号：US11835008

    申请日：2007-08-07

    申请人： Hien Dang ,  Sri Sri-Jayantha

    发明人： Hien Dang ,  Sri Sri-Jayantha

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2812 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/0298 ,  H05K2201/10151 ,  H05K2203/163

    摘要： Method for detecting and reporting a condition. The components of the invention include an electronic package having a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

    摘要翻译： 检测和报告病症的方法。 本发明的组件包括一个电子封装，该电子封装具有一个基板，导电线与集成芯片电连接，并具有一个电压源。 集成电路芯片安装在基板上并与至少一个导电线电连接。 与基板连接的传感器与信号发生器组合可操作以在检测到从基板的状况和与基板的电连接状态中选择的状态时产生电信号。 在立即从传感器接收到上述电信号之后，信号发生器发出警告信号。 指示现有缺陷的警告信号或可以降低总电子封装寿命的条件。