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公开(公告)号：US07799504B2
公开(公告)日：2010-09-21
申请号：US11758042
申请日：2007-06-05
IPC分类号： G03C1/00
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。
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公开(公告)号：US20080305407A1
公开(公告)日：2008-12-11
申请号：US11758042
申请日：2007-06-05
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。
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公开(公告)号：US20120219773A1
公开(公告)日：2012-08-30
申请号：US13468376
申请日：2012-05-10
IPC分类号： B32B7/02
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas. This mask film is used to form a relief image such as in a flexographic printing plate.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。 该掩模膜用于形成诸如柔版印刷版中的浮雕图像。
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公开(公告)号：US08632944B2
公开(公告)日：2014-01-21
申请号：US13468376
申请日：2012-05-10
IPC分类号： G03C1/00
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas. This mask film is used to form a relief image such as in a flexographic printing plate.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。 该掩模膜用于形成诸如柔版印刷版中的浮雕图像。
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公开(公告)号：US08198012B2
公开(公告)日：2012-06-12
申请号：US12722572
申请日：2010-03-12
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas. This mask film is used to form a relief image such as in a flexographic printing plate.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。 该掩模膜用于形成诸如柔版印刷版中的浮雕图像。
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公开(公告)号：US20100167209A1
公开(公告)日：2010-07-01
申请号：US12722572
申请日：2010-03-12
IPC分类号： G03F7/20
CPC分类号： G03F1/68 , B41C1/05 , B41M5/40 , G03F7/2014 , G03F7/202 , Y10S430/145 , Y10T428/24942
摘要： A mask-forming film has a transparent layer between the imageable layer and the carrier sheet, which transparent layer has a refractive index that is lower (by at least 0.04) than that of the carrier sheet or any immediately adjacent layer between it and the carrier sheet. This lower refractive index layer modifies the path of incident radiation during mask image transfer so as to provide steeper shoulder angles in the relief image solid areas. This mask film is used to form a relief image such as in a flexographic printing plate.
摘要翻译： 掩模形成膜在可成像层和载体片之间具有透明层，该透明层的折射率比载体片材或其与载体之间的任何紧邻层的折射率低至少（至少0.04） 片。 该低折射率层在掩模图像转印期间改变入射辐射的路径，以便在浮雕图像实心区域中提供较陡的肩部角度。 该掩模膜用于形成诸如柔版印刷版中的浮雕图像。
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公开(公告)号：US07696013B2
公开(公告)日：2010-04-13
申请号：US11737187
申请日：2007-04-19
IPC分类号： H01L21/00
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译： 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。
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公开(公告)号：US20100112758A1
公开(公告)日：2010-05-06
申请号：US12635747
申请日：2009-12-11
IPC分类号： H01L21/50
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译： 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。
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公开(公告)号：US20100109168A1
公开(公告)日：2010-05-06
申请号：US12635750
申请日：2009-12-11
IPC分类号： H01L23/485
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
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公开(公告)号：US20080258313A1
公开(公告)日：2008-10-23
申请号：US11737187
申请日：2007-04-19
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译： 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。
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