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15 条记录 (耗时 0.024 秒)

    SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE
    1.
    发明申请
    SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE 有权
    用于电动或混合动力汽车的半导体冷却系统

    公开(公告)号：US20080225482A1

    公开(公告)日：2008-09-18

    申请号：US11685726

    申请日：2007-03-13

    申请人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P. Yankoski ,  David F. Nelson

    发明人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P. Yankoski ,  David F. Nelson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

    摘要翻译： 提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。

    Compact terminal assembly for power converters
    4.
    发明授权
    Compact terminal assembly for power converters 有权
    紧凑型电源转换器端子组件

    公开(公告)号：US08053920B2

    公开(公告)日：2011-11-08

    申请号：US12178897

    申请日：2008-07-24

    申请人： Terence G. Ward ,  George John ,  Edward P. Yankoski ,  Gregory S. Smith ,  James M. Nagashima

    发明人： Terence G. Ward ,  George John ,  Edward P. Yankoski ,  Gregory S. Smith ,  James M. Nagashima

    IPC分类号： B60L1/00

    CPC分类号： H02M7/003 ,  H01L2224/49111

    摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

    摘要翻译： 提供了一种用于功率转换器的端子组件。 端子组件包括第一和第二导电部件和电流传感器。 第一导电组件具有第一和第二可释放的附接结构。 第二导电部件具有相应的第一和第二宽度的第一和第二部分。 第一宽度小于第二宽度。 第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。 电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。 电流传感器响应于流过第二导电部件的第一部分的电流。

    Stacked busbar assembly with integrated cooling
    6.
    发明授权
    Stacked busbar assembly with integrated cooling 有权
    堆叠式母线组合，集成冷却

    公开(公告)号：US07952875B2

    公开(公告)日：2011-05-31

    申请号：US12475005

    申请日：2009-05-29

    申请人： George R. Woody ,  Terence G. Ward ,  Edward P. Yankoski

    发明人： George R. Woody ,  Terence G. Ward ,  Edward P. Yankoski

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L25/071 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/12044 ,  H02M7/003 ,  H01L2924/00

    摘要： A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.

    摘要翻译： 堆叠母线组件包括两个或更多个母线组件，每个母线组件包括多个母线，其具有与其连接的一个或多个功率半导体器件（例如，IGBT，功率二极管等）。 每个母线具有内部集成冷却系统，其包括与入口和出口连通的一个或多个流体通道。 母线组件被堆叠成使得它们各自的入口和出口对齐，然后冷却剂可以平行流过其中。

    Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
    7.
    发明授权
    Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices 有权
    具有延伸周期的层的半导体器件用于改进的冷却和用于冷却半导体器件的方法

    公开(公告)号：US07612447B2

    公开(公告)日：2009-11-03

    申请号：US11758833

    申请日：2007-06-06

    申请人： Terence G. Ward ,  Edward P. Yankoski

    发明人： Terence G. Ward ,  Edward P. Yankoski

    IPC分类号： H01L23/34 ,  H01L23/52

    CPC分类号： H01L23/4735 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer.

    摘要翻译： 提供半导体器件，并且包括具有第一和第二相对的金属化主面的晶片和结合到晶片的第一金属化面的晶体管。 晶体管包括第一表面，并且第一表面限定第一区域。 该器件还包括结合到晶体管的第一表面的第一金属层。 第一金属层具有限定比晶体管的第一区域大的第二区域的第一表面。 该装置还包括结合到第一金属层的第一表面的陶瓷层。

    Power electronics power module with imbedded gate circuitry
    8.
    发明授权
    Power electronics power module with imbedded gate circuitry 有权
    带嵌入式门电路的电力电子电源模块

    公开(公告)号：US08063440B2

    公开(公告)日：2011-11-22

    申请号：US12473632

    申请日：2009-05-28

    申请人： Edward P. Yankoski ,  Terence G. Ward ,  George R. Woody

    发明人： Edward P. Yankoski ,  Terence G. Ward ,  George R. Woody

    IPC分类号： H01L29/76 ,  H01L29/94

    CPC分类号： H01L25/18 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.

    摘要翻译： 提供电力电子电源模块。 电力电子功率模块包括导电衬底，具有第一和第二相对表面的电子管芯以及形成在其上的至少一个晶体管，该电子管芯安装在导电衬底上，并且至少一个晶体管被配置成使得当 至少一个晶体管被激活，电流从电子管芯的第一表面流入导电衬底，以及至少部分嵌入导电衬底中的控制构件，该控制构件具有形成在其上的控制导体并电连接到 所述至少一个晶体管使得当控制信号被提供给所述控制导体时，所述至少一个晶体管被激活。

    SYSTEM AND METHOD FOR CLAMPING A CHASSIS COVER
    9.
    发明申请
    SYSTEM AND METHOD FOR CLAMPING A CHASSIS COVER 审中-公开
    用于夹紧底盘盖的系统和方法

    公开(公告)号：US20100109351A1

    公开(公告)日：2010-05-06

    申请号：US12263155

    申请日：2008-10-31

    申请人： George R. Woody ,  Edward P. Yankoski ,  Terence G. Ward ,  Brooks S. Mann

    发明人： George R. Woody ,  Edward P. Yankoski ,  Terence G. Ward ,  Brooks S. Mann

    IPC分类号： B65D45/34 ,  B65D45/32

    CPC分类号： F16B5/0635 ,  Y10T292/214 ,  Y10T292/216 ,  Y10T292/221

    摘要： A system is provided for securing a cover having a first surface onto a chassis having a rim, the rim having a second surface. The system comprises a clamping rail and a fastener coupled to the rail. The clamping rail is configured to form a loop that circumferentially engages the first surface and the second surface and, when constricted, produces a first force substantially coplanar with the loop. The fastener is configured to constrict the rail, the rail and the first and second surfaces configured to produce a second force having a component substantially orthogonal to the loop when the rail is constricted.

    摘要翻译： 提供了一种用于将具有第一表面的盖固定到具有边缘的底架上的系统，所述边缘具有第二表面。 该系统包括夹紧轨道和联接到轨道的紧固件。 夹紧轨道构造成形成环，其环绕第一表面和第二表面接合，并且当收缩时产生与环基本上共面的第一力。 紧固件被构造成收缩轨道，轨道以及被构造成当轨道收缩时产生具有与环路基本正交的分量的第二力的第二和第二表面。

    Power module layout for automotive power converters
    10.
    发明授权
    Power module layout for automotive power converters 有权
    汽车电源转换器的电源模块布局

    公开(公告)号：US08354816B2

    公开(公告)日：2013-01-15

    申请号：US12891316

    申请日：2010-09-27

    申请人： Terence G. Ward ,  Edward P. Yankoski

    发明人： Terence G. Ward ,  Edward P. Yankoski

    IPC分类号： H02M1/00 ,  H02M7/537

    CPC分类号： H02M7/003 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.

    摘要翻译： 提供汽车功率转换器。 所述汽车功率转换器包括衬底，所述衬底上的第一和第二电子器件，耦合到所述衬底的至少一个导电构件，并且具有电耦合到所述第一电子器件的第一器件部分和电耦合到所述第二电子器件的第二器件部分 装置，以及电耦合到所述至少一个导电构件的第一和第二端子。 当电源耦合到第一和第二端子时，电流基本上在第一方向上从第一端子流到第一器件部分，并且从第二端子到第二器件部分基本上沿第二方向流动。 第一方向具有第一分量，第二方向具有与第一分量相对的第二分量。