公开(公告)号：US20060070441A1

公开(公告)日：2006-04-06

申请号：US11177474

申请日：2005-07-07

申请人： Guido Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

发明人： Guido Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

IPC分类号： G01P9/04 ,  G01C19/56 ,  G01C25/00 ,  H01L21/306 ,  H01L23/24

CPC分类号： G01C19/5769

摘要： Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.

摘要翻译： 由半导体材料的基板形成的微机电结构和在基板上方延伸并通过气隙分离的悬浮物。 第一电绝缘材料的绝缘区域延伸穿过悬挂质量并将其分成至少一个第一电绝缘悬浮区域和一个第二电绝缘悬浮区域。 在绝缘区域的下方形成有与第一电绝缘材料不同的第二电绝缘材料的插头元件，并且在使用蚀刻剂时，在绝缘区域和气隙之间形成阻挡层，以防止在制造期间去除绝缘区域 用于去除牺牲层并形成气隙。

公开(公告)号：US07437933B2

公开(公告)日：2008-10-21

申请号：US11177474

申请日：2005-07-07

申请人： Guido Spinola Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

发明人： Guido Spinola Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

IPC分类号： H01L21/306 ,  H01L23/24 ,  G01P9/04

CPC分类号： G01C19/5769

摘要： Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.

摘要翻译： 由半导体材料的基板形成的微机电结构和在基板上方延伸并通过气隙分离的悬浮物。 第一电绝缘材料的绝缘区域延伸穿过悬挂质量并将其分成至少一个第一电绝缘悬浮区域和一个第二电绝缘悬浮区域。 在绝缘区域的下面形成有与第一电绝缘材料不同的第二电绝缘材料的插头元件，并且在使用蚀刻剂时，在绝缘区域和气隙之间形成阻挡层，以防止在制造期间去除绝缘区域 用于去除牺牲层并形成气隙。

公开(公告)号：US07399652B2

公开(公告)日：2008-07-15

申请号：US10821263

申请日：2004-04-08

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/58

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US07116525B2

公开(公告)日：2006-10-03

申请号：US10429266

申请日：2003-05-02

申请人： Marco Del Sarto ,  Mauro Marchi ,  Lorenzo Baldo ,  Simone Sassolini

发明人： Marco Del Sarto ,  Mauro Marchi ,  Lorenzo Baldo ,  Simone Sassolini

IPC分类号： G11B5/56

CPC分类号： G11B5/4826

摘要： A read/write assembly for magnetic hard disks includes at least: one supporting element; one read/write (R/W) transducer; one micro-actuator, set between the R/W transducer and the supporting element; one electrical-connection structure for connection to a remote device carried by the supporting element and connected to the R/W transducer and to the micro-actuator. In addition, a protective structure, set so as to cover the micro-actuator is made of a single piece with the electrical-connection structure.

公开(公告)号：US08679887B2

公开(公告)日：2014-03-25

申请号：US13456990

申请日：2012-04-26

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/58

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20080272447A1

公开(公告)日：2008-11-06

申请号：US12136722

申请日：2008-06-10

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L29/84

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US07270003B2

公开(公告)日：2007-09-18

申请号：US11189544

申请日：2005-07-25

申请人： Simone Sassolini ,  Marco Del Sarto ,  Lorenzo Baldo ,  Mauro Marchi

发明人： Simone Sassolini ,  Marco Del Sarto ,  Lorenzo Baldo ,  Mauro Marchi

IPC分类号： G01P15/125 ,  G01C19/00

CPC分类号： G01C19/5755 ,  G01C19/5769

摘要： The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.

摘要翻译： 半导体惯性传感器由静电耦合在一起的转子元件和定子元件形成。 转子元件由悬挂质量和从悬浮物质延伸的多个移动电极形成。 定子元件由面对各自的移动电极的多个固定电极形成。 悬挂质量由弹性悬挂元件支撑。 悬挂质量具有第一，较大的厚度，并且弹性悬挂元件具有小于第一厚度的第二厚度。

公开(公告)号：US20060042385A1

公开(公告)日：2006-03-02

申请号：US11189544

申请日：2005-07-25

申请人： Simone Sassolini ,  Marco Del Sarto ,  Lorenzo Baldo ,  Mauro Marchi

发明人： Simone Sassolini ,  Marco Del Sarto ,  Lorenzo Baldo ,  Mauro Marchi

IPC分类号： G01P15/08 ,  H01L21/308

CPC分类号： G01C19/5755 ,  G01C19/5769

摘要： The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.

摘要翻译： 半导体惯性传感器由静电耦合在一起的转子元件和定子元件形成。 转子元件由悬挂质量和从悬浮物质延伸的多个移动电极形成。 定子元件由面对各自的移动电极的多个固定电极形成。 悬挂质量由弹性悬挂元件支撑。 悬挂质量具有第一，较大的厚度，并且弹性悬挂元件具有小于第一厚度的第二厚度。

公开(公告)号：US20120208343A1

公开(公告)日：2012-08-16

申请号：US13456990

申请日：2012-04-26

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/311

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US08193550B2

公开(公告)日：2012-06-05

申请号：US12136722

申请日：2008-06-10

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L31/0352 ,  G02B26/10

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。