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1.发明授权公开(公告)号：US07437933B2
公开(公告)日：2008-10-21
申请号：US11177474
申请日：2005-07-07
IPC分类号： H01L21/306 , H01L23/24 , G01P9/04
CPC分类号： G01C19/5769
摘要： Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.
摘要翻译： 由半导体材料的基板形成的微机电结构和在基板上方延伸并通过气隙分离的悬浮物。 第一电绝缘材料的绝缘区域延伸穿过悬挂质量并将其分成至少一个第一电绝缘悬浮区域和一个第二电绝缘悬浮区域。 在绝缘区域的下面形成有与第一电绝缘材料不同的第二电绝缘材料的插头元件，并且在使用蚀刻剂时，在绝缘区域和气隙之间形成阻挡层，以防止在制造期间去除绝缘区域 用于去除牺牲层并形成气隙。
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2.发明申请公开(公告)号：US20060070441A1
公开(公告)日：2006-04-06
申请号：US11177474
申请日：2005-07-07
申请人： Guido Durante , Simone Sassolini , Marco Ferrera , Mauro Marchi
发明人： Guido Durante , Simone Sassolini , Marco Ferrera , Mauro Marchi
IPC分类号： G01P9/04 , G01C19/56 , G01C25/00 , H01L21/306 , H01L23/24
CPC分类号： G01C19/5769
摘要： Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.
摘要翻译： 由半导体材料的基板形成的微机电结构和在基板上方延伸并通过气隙分离的悬浮物。 第一电绝缘材料的绝缘区域延伸穿过悬挂质量并将其分成至少一个第一电绝缘悬浮区域和一个第二电绝缘悬浮区域。 在绝缘区域的下方形成有与第一电绝缘材料不同的第二电绝缘材料的插头元件，并且在使用蚀刻剂时，在绝缘区域和气隙之间形成阻挡层，以防止在制造期间去除绝缘区域 用于去除牺牲层并形成气隙。
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公开(公告)号：US07258008B2
公开(公告)日：2007-08-21
申请号：US11317623
申请日：2005-12-22
CPC分类号： G01C19/5762 , G01C19/5747
摘要： An Integrated gyroscope includes a suspended mass; mobile actuation electrodes extending from the suspended mass; and a sensing mass connected to the actuation mass through coupling springs. The suspended mass is formed by an external part and an internal part, electrically separated by an electrical-insulation region having a closed annular shape. The electrical-insulation region is laterally completely surrounded by the external part and by the internal part. In one embodiment, the suspended mass has the shape of a closed frame delimiting an opening, the sensing mass is formed inside the opening and is connected to the internal part, and the mobile actuation electrodes are connected to the external part.
摘要翻译： 集成陀螺仪包括悬挂质量; 从悬浮物延伸的移动致动电极; 以及通过联接弹簧连接到致动质量块的感测质量。 悬挂质量由外部部分和内部部分形成，由具有闭合环形形状的电绝缘区域电隔离。 电绝缘区域由外部部分和内部部分横向完全包围。 在一个实施例中，悬挂质量具有限定开口的闭合框架的形状，感测质量形成在开口内部并且连接到内部部分，并且移动致动电极连接到外部部分。
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4.发明授权Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained 有权微机电装置，特别是光学微动开关的制造方法以及如此获得的微电子机械装置公开(公告)号：US07399652B2
公开(公告)日：2008-07-15
申请号：US10821263
申请日：2004-04-08
申请人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
发明人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
IPC分类号： H01L21/58
CPC分类号： H01L21/76898 , B81B2201/033 , B81B2201/045 , B81C1/00484 , B81C1/00896 , B81C2201/019 , G02B6/357 , G02B6/3584
摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。
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公开(公告)号：US07116525B2
公开(公告)日：2006-10-03
申请号：US10429266
申请日：2003-05-02
申请人： Marco Del Sarto , Mauro Marchi , Lorenzo Baldo , Simone Sassolini
发明人： Marco Del Sarto , Mauro Marchi , Lorenzo Baldo , Simone Sassolini
IPC分类号： G11B5/56
CPC分类号： G11B5/4826
摘要： A read/write assembly for magnetic hard disks includes at least: one supporting element; one read/write (R/W) transducer; one micro-actuator, set between the R/W transducer and the supporting element; one electrical-connection structure for connection to a remote device carried by the supporting element and connected to the R/W transducer and to the micro-actuator. In addition, a protective structure, set so as to cover the micro-actuator is made of a single piece with the electrical-connection structure.
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6.发明授权Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained 有权微机电装置，特别是光学微动开关的制造方法以及如此获得的微电子机械装置公开(公告)号：US08679887B2
公开(公告)日：2014-03-25
申请号：US13456990
申请日：2012-04-26
申请人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
发明人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
IPC分类号： H01L21/58
CPC分类号： H01L21/76898 , B81B2201/033 , B81B2201/045 , B81C1/00484 , B81C1/00896 , B81C2201/019 , G02B6/357 , G02B6/3584
摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。
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7.发明申请公开(公告)号：US20080272447A1
公开(公告)日：2008-11-06
申请号：US12136722
申请日：2008-06-10
申请人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
发明人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
IPC分类号： H01L29/84
CPC分类号： H01L21/76898 , B81B2201/033 , B81B2201/045 , B81C1/00484 , B81C1/00896 , B81C2201/019 , G02B6/357 , G02B6/3584
摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。
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8.发明授权BMEMS-type high-sensitivity inertial sensor and manufacturing process thereof 有权MEMS型高灵敏度惯性传感器及其制造工艺公开(公告)号：US07270003B2
公开(公告)日：2007-09-18
申请号：US11189544
申请日：2005-07-25
申请人： Simone Sassolini , Marco Del Sarto , Lorenzo Baldo , Mauro Marchi
发明人： Simone Sassolini , Marco Del Sarto , Lorenzo Baldo , Mauro Marchi
IPC分类号： G01P15/125 , G01C19/00
CPC分类号： G01C19/5755 , G01C19/5769
摘要： The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.
摘要翻译： 半导体惯性传感器由静电耦合在一起的转子元件和定子元件形成。 转子元件由悬挂质量和从悬浮物质延伸的多个移动电极形成。 定子元件由面对各自的移动电极的多个固定电极形成。 悬挂质量由弹性悬挂元件支撑。 悬挂质量具有第一，较大的厚度，并且弹性悬挂元件具有小于第一厚度的第二厚度。
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9.发明申请BMEMS-type high-sensitivity inertial sensor and manufacturing process thereof 有权MEMS型高灵敏度惯性传感器及其制造工艺公开(公告)号：US20060042385A1
公开(公告)日：2006-03-02
申请号：US11189544
申请日：2005-07-25
申请人： Simone Sassolini , Marco Del Sarto , Lorenzo Baldo , Mauro Marchi
发明人： Simone Sassolini , Marco Del Sarto , Lorenzo Baldo , Mauro Marchi
IPC分类号： G01P15/08 , H01L21/308
CPC分类号： G01C19/5755 , G01C19/5769
摘要： The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.
摘要翻译： 半导体惯性传感器由静电耦合在一起的转子元件和定子元件形成。 转子元件由悬挂质量和从悬浮物质延伸的多个移动电极形成。 定子元件由面对各自的移动电极的多个固定电极形成。 悬挂质量由弹性悬挂元件支撑。 悬挂质量具有第一，较大的厚度，并且弹性悬挂元件具有小于第一厚度的第二厚度。
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10.发明申请公开(公告)号：US20120208343A1
公开(公告)日：2012-08-16
申请号：US13456990
申请日：2012-04-26
申请人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
发明人： Simone Sassolini , Mauro Marchi , Marco Del Sarto , Lorenzo Baldo
IPC分类号： H01L21/311
CPC分类号： H01L21/76898 , B81B2201/033 , B81B2201/045 , B81C1/00484 , B81C1/00896 , B81C2201/019 , G02B6/357 , G02B6/3584
摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。
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