公开(公告)号：US07595223B2

公开(公告)日：2009-09-29

申请号：US11766654

申请日：2007-06-21

申请人： Ubaldo Mastromatteo ,  Mauro Bombonati ,  Daniela Morin ,  Marta Mottura ,  Mauro Marchi

发明人： Ubaldo Mastromatteo ,  Mauro Bombonati ,  Daniela Morin ,  Marta Mottura ,  Mauro Marchi

IPC分类号： H01L21/20 ,  H01L21/00 ,  H01L21/46

CPC分类号： B81C1/00269 ,  H01L21/185 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05181 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/10135 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13164 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/812 ,  H01L2224/81201 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/013

摘要： A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.

摘要翻译： 一种用于结合集成微系统的两个不同基板的方法，包括使用微电子处理技术和粘合基板在两个基板中的至少一个中形成微集成器件的步骤。 通过在第一基板上形成接合可变形材料的区域并将基板压在另一个上以使接合区域变形并使其与第二基板发生化学反应来进行接合。 接合区域优选由选自铝，铜和镍的材料的厚层形成，被选自钯和铂之间的材料的薄层覆盖。 间隔区确保两个晶片之间的精确间距。

公开(公告)号：US20080197512A1

公开(公告)日：2008-08-21

申请号：US11600687

申请日：2006-11-16

申请人： Mauro Marchi ,  Marco Ferrera ,  Caterina Riva

发明人： Mauro Marchi ,  Marco Ferrera ,  Caterina Riva

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/4763

CPC分类号： B81B7/0006 ,  B81B2201/0242 ,  B81B2201/0257 ,  H01L21/76267 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A process for manufacturing a through via in a semiconductor device includes the steps of: forming a body having a structural layer, a substrate, and a dielectric layer set between the structural layer and the substrate; insulating a portion of the structural layer to form a front-side interconnection region; insulating a portion of the substrate to form a back-side interconnection region; and connecting the front-side interconnection region and the back-side interconnection region through the dielectric layer.

摘要翻译： 一种用于制造半导体器件中的通孔的方法包括以下步骤：在结构层和衬底之间形成具有结构层，衬底和介电层的主体; 绝缘结构层的一部分以形成正面互连区域; 绝缘所述基板的一部分以形成背面互连区域; 并且通过电介质层连接前侧互连区域和背面互连区域。

公开(公告)号：US07399652B2

公开(公告)日：2008-07-15

申请号：US10821263

申请日：2004-04-08

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/58

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US07116525B2

公开(公告)日：2006-10-03

申请号：US10429266

申请日：2003-05-02

申请人： Marco Del Sarto ,  Mauro Marchi ,  Lorenzo Baldo ,  Simone Sassolini

发明人： Marco Del Sarto ,  Mauro Marchi ,  Lorenzo Baldo ,  Simone Sassolini

IPC分类号： G11B5/56

CPC分类号： G11B5/4826

摘要： A read/write assembly for magnetic hard disks includes at least: one supporting element; one read/write (R/W) transducer; one micro-actuator, set between the R/W transducer and the supporting element; one electrical-connection structure for connection to a remote device carried by the supporting element and connected to the R/W transducer and to the micro-actuator. In addition, a protective structure, set so as to cover the micro-actuator is made of a single piece with the electrical-connection structure.

公开(公告)号：US08679887B2

公开(公告)日：2014-03-25

申请号：US13456990

申请日：2012-04-26

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/58

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20080272447A1

公开(公告)日：2008-11-06

申请号：US12136722

申请日：2008-06-10

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L29/84

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20120208343A1

公开(公告)日：2012-08-16

申请号：US13456990

申请日：2012-04-26

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L21/311

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US08193550B2

公开(公告)日：2012-06-05

申请号：US12136722

申请日：2008-06-10

申请人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

发明人： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC分类号： H01L31/0352 ,  G02B26/10

CPC分类号： H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

摘要： A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

摘要翻译： 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US07800234B2

公开(公告)日：2010-09-21

申请号：US11600687

申请日：2006-11-16

申请人： Mauro Marchi ,  Marco Ferrera ,  Caterina Riva

发明人： Mauro Marchi ,  Marco Ferrera ,  Caterina Riva

IPC分类号： H01L23/48

CPC分类号： B81B7/0006 ,  B81B2201/0242 ,  B81B2201/0257 ,  H01L21/76267 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A process for manufacturing a through via in a semiconductor device includes the steps of: forming a body having a structural layer, a substrate, and a dielectric layer set between the structural layer and the substrate; insulating a portion of the structural layer to form a front-side interconnection region; insulating a portion of the substrate to form a back-side interconnection region; and connecting the front-side interconnection region and the back-side interconnection region through the dielectric layer.

摘要翻译： 一种用于制造半导体器件中的通孔的方法包括以下步骤：在结构层和衬底之间形成具有结构层，衬底和介电层的主体; 绝缘结构层的一部分以形成正面互连区域; 绝缘所述基板的一部分以形成背面互连区域; 并且通过电介质层连接前侧互连区域和背面互连区域。

公开(公告)号：US07437933B2

公开(公告)日：2008-10-21

申请号：US11177474

申请日：2005-07-07

申请人： Guido Spinola Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

发明人： Guido Spinola Durante ,  Simone Sassolini ,  Marco Ferrera ,  Mauro Marchi

IPC分类号： H01L21/306 ,  H01L23/24 ,  G01P9/04

CPC分类号： G01C19/5769

摘要： Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.

摘要翻译： 由半导体材料的基板形成的微机电结构和在基板上方延伸并通过气隙分离的悬浮物。 第一电绝缘材料的绝缘区域延伸穿过悬挂质量并将其分成至少一个第一电绝缘悬浮区域和一个第二电绝缘悬浮区域。 在绝缘区域的下面形成有与第一电绝缘材料不同的第二电绝缘材料的插头元件，并且在使用蚀刻剂时，在绝缘区域和气隙之间形成阻挡层，以防止在制造期间去除绝缘区域 用于去除牺牲层并形成气隙。