公开(公告)号：US07333339B2

公开(公告)日：2008-02-19

申请号：US11308673

申请日：2006-04-20

申请人： Guo Tao Liu ,  Shanquan Bao ,  Taojin Le ,  William X. Huang ,  Meng-en Tan

发明人： Guo Tao Liu ,  Shanquan Bao ,  Taojin Le ,  William X. Huang ,  Meng-en Tan

IPC分类号： H05K7/20

CPC分类号： H05K1/0207 ,  H05K1/0206 ,  H05K1/141 ,  H05K7/205 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09781

摘要： A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.

摘要翻译： 用于小型化形状因子卡的散热系统允许包含在卡中的移动信息设备的通信系统通过在移动信息设备的印刷电路板上使用高电导率焊盘来操作高热负荷，该电导板接触到 小型化外形尺寸卡。 此外，在移动信息设备邻近PCB的情况下，散热塞被集成到PCB的边缘中，发射表面邻近辐射孔。 通过PCB层的热对流通道允许热量从焊盘传递到PCB中的其他导电层。 小型化形状卡中的高导热性填料将热量从内部组件传导到与高导电性接触的卡的情况。 也可采用与高电导率焊盘相邻的接触界面内的卡壳内的高发热部件的放置，以实现最大的散热。 在卡盒上提供高导电性膜，以增加从壳体到PCB上的焊盘的导电性。

公开(公告)号：US20070247815A1

公开(公告)日：2007-10-25

申请号：US11308673

申请日：2006-04-20

申请人： Guo Liu ,  Shanquan Bao ,  Taojin Le ,  William Huang ,  Meng-en Tan

发明人： Guo Liu ,  Shanquan Bao ,  Taojin Le ,  William Huang ,  Meng-en Tan

IPC分类号： H05K7/20

CPC分类号： H05K1/0207 ,  H05K1/0206 ,  H05K1/141 ,  H05K7/205 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09781

摘要： A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.

摘要翻译： 用于小型化形状因子卡的散热系统允许包含在卡中的移动信息设备的通信系统通过在移动信息设备的印刷电路板上使用高电导率焊盘来操作高热负荷，该电导板接触到 小型化外形尺寸卡。 此外，在移动信息设备邻近PCB的情况下，散热塞被集成到PCB的边缘中，发射表面邻近辐射孔。 通过PCB层的热对流通道允许热量从焊盘传递到PCB中的其他导电层。 小型化形状卡中的高导热性填料将热量从内部组件传导到与高导电性接触的卡的情况。 也可采用与高电导率焊盘相邻的接触界面内的卡壳内的高发热部件的放置，以实现最大的散热。 在卡盒上提供高导电性膜，以增加从壳体到PCB上的焊盘的导电性。

公开(公告)号：US07361057B1

公开(公告)日：2008-04-22

申请号：US11670551

申请日：2007-02-02

申请人： Shanquan Bao ,  Taojin Le ,  Hongqi Wu

发明人： Shanquan Bao ,  Taojin Le ,  Hongqi Wu

IPC分类号： H01R24/00

CPC分类号： G06K19/07743 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/09409 ,  H05K2201/09954 ,  Y10S439/946

摘要： A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.

摘要翻译： 用于小型化形状因子卡的连接器系统允许具有应用处理器和用户界面组件的移动信息设备的通信系统。 在移动信息设备中提供接收帧，用于可插入小型化形状因子卡，其包括用于RF发送和接收的装置和无线调制解调器。 卡上的连接器部分被接收在接收框架中的配合部分中。 小型化外形尺寸卡还包括一组焊盘，用于可替换的移动信息装置中的印刷电路板上的匹配焊盘阵列的永久接合。 移动信息设备中的应用处理器和用户接口组件与无线调制解调器的数字功能相互连接，以及用于通过连接器进行RF传输和接收的装置，或备选地，焊盘阵列。

公开(公告)号：US20070254503A1

公开(公告)日：2007-11-01

申请号：US11775373

申请日：2007-07-10

申请人： Shanquan Bao ,  Liming Gao ,  Taojin Le ,  Bin Luo ,  Hongqi Wu

发明人： Shanquan Bao ,  Liming Gao ,  Taojin Le ,  Bin Luo ,  Hongqi Wu

IPC分类号： H01R12/00

CPC分类号： H04B1/3816 ,  H04M1/0274 ,  H04M1/7253

摘要： A connector system employs a first connector moiety on an insertable miniaturized form factor card. A mobile information device (MID) has a printed circuit board having a second connector moiety with a frame mounted on the MID PCB for receiving the card and having a slot for engagement of an elastomeric connector element in alignment with the second connector moiety. The card is positioned by the frame for alignment of the first connector moiety with the elastomeric connector element. The elastomeric connector element is a single integrated element. The first connector moiety incorporates a plurality of contact pads on the card and the second connector moiety incorporates a like plurality of contact pads on the MID PCB. The contact pads include at least a first set of RF pads and the signals on the first and second connector moieties are arranged for cross talk shielding in the elastomeric connector.

摘要翻译： 连接器系统在可插入的小型化形状因子卡上采用第一连接器部分。 移动信息设备（MID）具有印刷电路板，其具有第二连接器部分，其中框架安装在MID PCB上用于接收卡并且具有用于与第二连接器部分对准的弹性连接器元件的接合槽。 该卡被框架定位，用于使第一连接器部分与弹性体连接器元件对准。 弹性连接器元件是单个集成元件。 第一连接器部分包括卡上的多个接触焊盘，第二连接器部分在MID PCB上结合了相似的多个接触焊盘。 接触焊盘包括至少第一组RF焊盘，并且第一和第二连接器部分上的信号被布置成用于弹性连接器中的串扰屏蔽。

公开(公告)号：US20090017649A1

公开(公告)日：2009-01-15

申请号：US11775406

申请日：2007-07-10

申请人： Hongqi Wu ,  Shanquan Bao ,  Taojin Le ,  Liming Gao

发明人： Hongqi Wu ,  Shanquan Bao ,  Taojin Le ,  Liming Gao

IPC分类号： H01R12/00

CPC分类号： H01R12/88 ,  H01R12/714 ,  H01R13/2414

摘要： A connector system employs a first connector moiety on an insertable miniaturized form factor card. A mobile information device (MID) has a printed circuit board having a second connector moiety and a frame mounted on the MID PCB for receiving the card. A slot is present in the frame for engagement of an elastomeric connector element in alignment with the second connector moiety. The card is positioned by the frame for alignment of the first connector moiety with the elastomeric connector element. The contact surface of the first connector moiety, as an example, multiple contact pads on the card, is extended, accomplished in the example by a matching plurality of individual metallic conductor extensions affixed to the plurality of contact pads using surface mount technology, and a cover attached to the frame is provided for urging the card into the frame and urging the extended contact surface to compress the elastomeric connector for positive contact.

摘要翻译： 连接器系统在可插入的小型化形状因子卡上采用第一连接器部分。 移动信息设备（MID）具有具有第二连接器部分的印刷电路板和安装在MID PCB上的用于接收卡的框架。 在框架中存在槽，用于与第二连接器部分对准的弹性体连接器元件接合。 该卡被框架定位，用于使第一连接器部分与弹性体连接器元件对准。 第一连接器部分的接触表面作为示例，卡上的多个接触垫，在该示例中通过使用表面贴装技术固定到多个接触垫的匹配的多个单独的金属导体延伸部分来实现，并且 提供附接到框架的盖子，用于将卡推入框架中并推动延伸的接触表面以压缩弹性连接器以进行正面接触。

公开(公告)号：US20080121685A1

公开(公告)日：2008-05-29

申请号：US11530766

申请日：2006-09-11

申请人： Taojin Le ,  Shanquan Bao ,  Jie Sun ,  Xin Liu

发明人： Taojin Le ,  Shanquan Bao ,  Jie Sun ,  Xin Liu

IPC分类号： G06F17/00

CPC分类号： G06F1/22 ,  G06F13/4291

摘要： A reduced pin count connection system for an insertable operational systems card having a plurality of input and output signals to a host device having operational circuits responsive to the input and output signals of the card includes a master serial data link in the card for communicating at least a portion of the plurality of input and output signals of the card. A slave serial data link is operably interconnected to the master serial data link through a connector having a second plurality contacts less than the plurality of input and output signals and communicates the input and output signals to the operational circuits in the host device.

摘要翻译： 一种用于可插入操作系统卡的减少的针数连接系统，其具有多个输入和输出信号到具有响应于卡的输入和输出信号的操作电路的主机设备，包括用于至少通信的卡中的主串行数据链路 卡的多个输入和输出信号的一部分。 从串行数据链路通过具有小于多个输入和输出信号的第二多个触点的连接器可操作地连接到主串行数据链路，并将输入和输出信号传送到主机设备中的操作电路。