Methods of forming magnetic memory cells
    1.
    发明授权
    Methods of forming magnetic memory cells 有权
    形成磁记忆单元的方法

    公开(公告)号:US09373775B2

    公开(公告)日:2016-06-21

    申请号:US13614212

    申请日:2012-09-13

    摘要: Methods of forming memory cells, magnetic memory cell structures, and arrays of magnetic memory cell structures are disclosed. Embodiments of the methods include patterning a precursor structure to form a stepped structure including at least an upper discrete feature section and a lower feature section with a broader width, length, or both than the upper discrete feature section. The method uses patterning acts directed along a first axis, e.g., an x-axis, and then along a second axis, e.g., a y-axis, that is perpendicular to or about perpendicular to the first axis. The patterning acts may therefore allow for more unifoimity between a plurality of formed, neighboring cell core structures, even at dimensions below about thirty nanometers. Magnetic memory structures and memory cell arrays are also disclosed.

    摘要翻译: 公开了形成存储单元,磁存储单元结构和磁存储单元结构阵列的方法。 方法的实施例包括图案化前体结构以形成包括至少上部离散特征部分和具有更宽的宽度,长度或两者比较高离散特征部分的下部特征部分的阶梯式结构。 该方法使用沿着第一轴线例如x轴,然后沿着垂直于第一轴线或垂直于第一轴线的第二轴线,例如y轴定向的图案化动作。 因此,即使在低于约三十纳米的尺寸下,图案化动作也可允许在多个形成的相邻电池芯结构之间的更大的均匀性。 还公开了磁存储器结构和存储单元阵列。

    METHODS OF FORMING MEMORY CELLS AND ARRAYS OF MAGNETIC MEMORY CELL STRUCTURES, AND RELATED MEMORY CELLS AND MEMORY CELL STRUCTURES
    2.
    发明申请
    METHODS OF FORMING MEMORY CELLS AND ARRAYS OF MAGNETIC MEMORY CELL STRUCTURES, AND RELATED MEMORY CELLS AND MEMORY CELL STRUCTURES 有权
    形成记忆细胞的方法和磁记忆细胞结构的阵列,以及相关记忆细胞和记忆细胞结构

    公开(公告)号:US20140070342A1

    公开(公告)日:2014-03-13

    申请号:US13614212

    申请日:2012-09-13

    IPC分类号: H01L43/12 H01L29/82

    摘要: Methods of forming memory cells, magnetic memory cell structures, and arrays of magnetic memory cell structures are disclosed. Embodiments of the methods include patterning a precursor structure to form a stepped structure including at least an upper discrete feature section and a lower feature section with a broader width, length, or both than the upper discrete feature section. The method uses patterning acts directed along a first axis, e.g., an x-axis, and then along a second axis, e.g., a y-axis, that is perpendicular to or about perpendicular to the first axis. The patterning acts may therefore allow for more unifoimity between a plurality of formed, neighboring cell core structures, even at dimensions below about thirty nanometers. Magnetic memory structures and memory cell arrays are also disclosed.

    摘要翻译: 公开了形成存储单元,磁存储单元结构和磁存储单元结构阵列的方法。 方法的实施例包括图案化前体结构以形成包括至少上部离散特征部分和具有更宽的宽度,长度或两者比较高离散特征部分的下部特征部分的阶梯式结构。 该方法使用沿着第一轴线例如x轴,然后沿着垂直于第一轴线或垂直于第一轴线的第二轴线,例如y轴定向的图案化动作。 因此,即使在低于约三十纳米的尺寸下,图案化动作也可允许在多个形成的相邻电池芯结构之间的更大的均匀性。 还公开了磁存储器结构和存储单元阵列。

    Memory cells, semiconductor device structures, memory systems, and methods of fabrication
    3.
    发明授权
    Memory cells, semiconductor device structures, memory systems, and methods of fabrication 有权
    存储单元,半导体器件结构,存储器系统和制造方法

    公开(公告)号:US08923038B2

    公开(公告)日:2014-12-30

    申请号:US13527173

    申请日:2012-06-19

    IPC分类号: G11C11/15 G11C11/00 H01L29/82

    摘要: Methods of forming magnetic memory cells are disclosed. Magnetic and non-magnetic materials are formed into a primal precursor structure in an initial stress state of essentially no strain, compressive strain, or tensile strain. A stress-compensating material, e.g., a non-sacrificial, conductive material, is formed to be disposed on the primal precursor structure to form a stress-compensated precursor structure in a net beneficial stress state. Thereafter, the stress-compensated precursor structure may be patterned to form a cell core of a memory cell. The net beneficial stress state of the stress-compensated precursor structure lends to formation of one or more magnetic regions, in the cell core, exhibiting a vertical magnetic orientation without deteriorating a magnetic strength of the one or more magnetic regions. Also disclosed are memory cells, memory cell structures, semiconductor device structures, and spin torque transfer magnetic random access memory (STT-MRAM) systems.

    摘要翻译: 公开了形成磁存储器单元的方法。 磁性和非磁性材料在基本上没有应变,压缩应变或拉伸应变的初始应力状态下形成原始前体结构。 形成应力补偿材料,例如非牺牲导电材料,以设置在原始前体结构上以在净有益应力状态下形成应力补偿前体结构。 此后,应力补偿前体结构可以被图案化以形成存储单元的单元芯。 应力补偿前体结构的净有益应力状态有助于在电池芯中形成一个或多个磁性区域,呈现垂直磁性取向而不会使一个或多个磁性区域的磁强度恶化。 还公开了存储器单元,存储单元结构,半导体器件结构和自旋转矩传递磁随机存取存储器(STT-MRAM)系统。

    MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
    4.
    发明申请
    MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION 有权
    存储器单元,半导体器件结构,存储器系统和制造方法

    公开(公告)号:US20130334630A1

    公开(公告)日:2013-12-19

    申请号:US13527173

    申请日:2012-06-19

    IPC分类号: H01L29/82 H01L21/8246

    摘要: Methods of forming magnetic memory cells are disclosed. Magnetic and non-magnetic materials are formed into a primal precursor structure in an initial stress state of essentially no strain, compressive strain, or tensile strain. A stress-compensating material, e.g., a non-sacrificial, conductive material, is formed to be disposed on the primal precursor structure to form a stress-compensated precursor structure in a net beneficial stress state. Thereafter, the stress-compensated precursor structure may be patterned to form a cell core of a memory cell. The net beneficial stress state of the stress-compensated precursor structure lends to formation of one or more magnetic regions, in the cell core, exhibiting a vertical magnetic orientation without deteriorating a magnetic strength of the one or more magnetic regions. Also disclosed are memory cells, memory cell structures, semiconductor device structures, and spin torque transfer magnetic random access memory (STT-MRAM) systems.

    摘要翻译: 公开了形成磁存储器单元的方法。 磁性和非磁性材料在基本上没有应变,压缩应变或拉伸应变的初始应力状态下形成原始前体结构。 形成应力补偿材料,例如非牺牲导电材料,以设置在原始前体结构上以在净有益应力状态下形成应力补偿前体结构。 此后,应力补偿前体结构可以被图案化以形成存储单元的单元芯。 应力补偿前体结构的净有益应力状态有助于在电池芯中形成一个或多个磁性区域,呈现垂直磁性取向而不会使一个或多个磁性区域的磁强度恶化。 还公开了存储器单元,存储单元结构,半导体器件结构和自旋转矩传递磁随机存取存储器(STT-MRAM)系统。

    Memory cells, semiconductor device structures, memory systems, and methods of fabrication
    5.
    发明授权
    Memory cells, semiconductor device structures, memory systems, and methods of fabrication 有权
    存储单元,半导体器件结构,存储器系统和制造方法

    公开(公告)号:US09054030B2

    公开(公告)日:2015-06-09

    申请号:US13527262

    申请日:2012-06-19

    摘要: Memory cells are disclosed. Magnetic regions within the memory cells include an alternating structure of magnetic sub-regions and coupler sub-regions. The coupler material of the coupler sub-regions antiferromagnetically couples neighboring magnetic sub-regions and effects or encourages a vertical magnetic orientation exhibited by the neighboring magnetic sub-regions. Neighboring magnetic sub-regions, spaced from one another by a coupler sub-region, exhibit oppositely-directed magnetic orientations. The magnetic and coupler sub-regions may each be of a thickness tailored to form the magnetic region in a compact structure. Interference between magnetic dipole fields emitted from the magnetic region on switching of a free region in the memory cell may be reduced or eliminated. Also disclosed are semiconductor device structures, spin torque transfer magnetic random access memory (STT-MRAM) systems, and methods of fabrication.

    摘要翻译: 公开了存储单元。 存储单元内的磁性区域包括磁性子区域和耦合器子区域的交替结构。 耦合器子区域的耦合器材料反铁磁耦合相邻磁性子区域并且影响或促进相邻磁性子区域呈现的垂直磁性取向。 通过耦合器子区彼此间隔开的相邻的磁子区域表现出相反方向的磁取向。 磁性和耦合器子区域可以各自具有被调整以在紧凑结构中形成磁性区域的厚度。 可以减少或消除在切换存储单元中的自由区域时从磁性区域发射的磁偶极子场之间的干扰。 还公开了半导体器件结构,自旋扭矩传递磁随机存取存储器(STT-MRAM)系统和制造方法。

    MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION
    6.
    发明申请
    MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION 有权
    存储器单元,半导体器件结构,存储器系统和制造方法

    公开(公告)号:US20130334631A1

    公开(公告)日:2013-12-19

    申请号:US13527262

    申请日:2012-06-19

    摘要: Memory cells are disclosed. Magnetic regions within the memory cells include an alternating structure of magnetic sub-regions and coupler sub-regions. The coupler material of the coupler sub-regions antiferromagnetically couples neighboring magnetic sub-regions and effects or encourages a vertical magnetic orientation exhibited by the neighboring magnetic sub-regions. Neighboring magnetic sub-regions, spaced from one another by a coupler sub-region, exhibit oppositely-directed magnetic orientations. The magnetic and coupler sub-regions may each be of a thickness tailored to form the magnetic region in a compact structure. Interference between magnetic dipole fields emitted from the magnetic region on switching of a free region in the memory cell may be reduced or eliminated. Also disclosed are semiconductor device structures, spin torque transfer magnetic random access memory (STT-MRAM) systems, and methods of fabrication.

    摘要翻译: 公开了存储单元。 存储单元内的磁性区域包括磁性子区域和耦合器子区域的交替结构。 耦合器子区域的耦合器材料反铁磁耦合相邻磁性子区域并且影响或促进相邻磁性子区域呈现的垂直磁性取向。 通过耦合器子区彼此间隔开的相邻的磁子区域表现出相反方向的磁取向。 磁性和耦合器子区域可以各自具有被调整以在紧凑结构中形成磁性区域的厚度。 可以减少或消除在切换存储单元中的自由区域时从磁性区域发射的磁偶极子场之间的干扰。 还公开了半导体器件结构,自旋扭矩传递磁随机存取存储器(STT-MRAM)系统和制造方法。

    Multilayers having reduced perpendicular demagnetizing field using moment dilution for spintronic applications
    7.
    发明授权
    Multilayers having reduced perpendicular demagnetizing field using moment dilution for spintronic applications 有权
    具有减少的垂直退磁场的多层使用瞬时应用的时间稀释

    公开(公告)号:US09048411B2

    公开(公告)日:2015-06-02

    申请号:US14047130

    申请日:2013-10-07

    摘要: A magnetic element is disclosed that has a composite free layer with a FM1/moment diluting/FM2 configuration wherein FM1 and FM2 are magnetic layers made of one or more of Co, Fe, Ni, and B and the moment diluting layer is used to reduce the perpendicular demagnetizing field. As a result, lower resistance x area product and higher thermal stability are realized when perpendicular surface anisotropy dominates shape anisotropy to give a magnetization perpendicular to the planes of the FM1, FM2 layers. The moment diluting layer may be a non-magnetic metal like Ta or a CoFe alloy with a doped non-magnetic metal. A perpendicular Hk enhancing layer interfaces with the FM2 layer and may be an oxide to increase the perpendicular anisotropy field in the FM2 layer. A method for forming the magnetic element is also provided.

    摘要翻译: 公开了具有FM1 /力矩稀释/ FM2配置的复合自由层的磁性元件,其中FM1和FM2是由Co,Fe,Ni和B中的一种或多种构成的磁性层,并且力矩稀释层用于减少 垂直退磁场。 结果,当垂直表面各向异性支配形状各向异性以产生垂直于FM1,FM2层的平面的磁化时,实现较低的电阻x面积乘积和较高的热稳定性。 瞬时稀释层可以是非磁性金属如Ta或具有掺杂的非磁性金属的CoFe合金。 垂直Hk增强层与FM2层接合,并且可以是氧化物以增加FM2层中的垂直各向异性场。 还提供了形成磁性元件的方法。

    MTJ element for STT MRAM
    8.
    发明授权
    MTJ element for STT MRAM 有权
    STT MRAM的MTJ元素

    公开(公告)号:US08900884B2

    公开(公告)日:2014-12-02

    申请号:US13525502

    申请日:2012-06-18

    IPC分类号: H01L21/00 H01L29/82

    CPC分类号: H01L43/10 H01L43/08 H01L43/12

    摘要: An all (111) MTJ stack is disclosed in which there are no transitions between different crystalline orientations when going from layer to layer. This is accomplished by providing strongly (111)-textured layers immediately below the MgO tunnel barrier to induce a (111) orientation therein.

    摘要翻译: 公开了所有(111)MTJ堆叠,其中当从层到层不同时,不同结晶取向之间没有转变。 这通过在MgO隧道势垒正下方提供强(111) - 纹理层以在其中诱导(111)取向来实现。

    MTJ Element for STT MRAM
    9.
    发明申请
    MTJ Element for STT MRAM 有权
    STT MRAM的MTJ元素

    公开(公告)号:US20130334629A1

    公开(公告)日:2013-12-19

    申请号:US13525502

    申请日:2012-06-18

    IPC分类号: H01L43/10 H01L43/12

    CPC分类号: H01L43/10 H01L43/08 H01L43/12

    摘要: An all (111) MTJ stack is disclosed in which there are no transitions between different crystalline orientations when going from layer to layer. This is accomplished by providing strongly (111)-textured layers immediately below the MgO tunnel barrier to induce a (111) orientation therein.

    摘要翻译: 公开了所有(111)MTJ堆叠,其中当从层到层不同时,不同结晶取向之间没有转变。 这通过在MgO隧道势垒正下方提供强(111) - 纹理层以在其中诱导(111)取向来实现。

    Free Layer with High Thermal Stability for Magnetic Device Applications by Insertion of a Boron Dusting Layer
    10.
    发明申请
    Free Layer with High Thermal Stability for Magnetic Device Applications by Insertion of a Boron Dusting Layer 有权
    通过插入硼粉尘层的磁性器件应用具有高热稳定性的自由层

    公开(公告)号:US20130270523A1

    公开(公告)日:2013-10-17

    申请号:US13448557

    申请日:2012-04-17

    IPC分类号: H01L43/10 H01L43/12

    摘要: A boron or boron containing dusting layer such as CoB or FeB is formed along one or both of top and bottom surfaces of a free layer at interfaces with a tunnel barrier layer and capping layer to improve thermal stability while maintaining other magnetic properties of a MTJ stack. Each dusting layer has a thickness from 0.2 to 20 Angstroms and may be used as deposited, or at temperatures up to 400° C. or higher, or following a subsequent anneal at 400° C. or higher. The free layer may be a single layer of CoFe, Co, CoFeB or CoFeNiB, or may include a non-magnetic insertion layer. The resulting MTJ is suitable for STT-MRAM memory elements or spintronic devices. Perpendicular magnetic anisotropy is maintained in the free layer at temperatures up to 400° C. or higher. Ku enhancement is achieved and the retention time of a memory cell for STT-MRAM designs is increased.

    摘要翻译: 在具有隧道势垒层和封盖层的界面处,在自由层的顶表面和底表面中的一个或两个上形成含硼或含硼的除尘层,以改善热稳定性,同时保持MTJ堆叠的其它磁性能 。 每个除尘层的厚度为0.2至20埃,可用于沉积,或在高达400℃或更高的温度下使用,或随后在400℃或更高温度下退火。 自由层可以是CoFe,Co,CoFeB或CoFeNiB的单层,或者可以包括非磁性插入层。 所得MTJ适用于STT-MRAM存储器元件或自旋电子器件。 垂直磁各向异性在高达400℃或更高的温度下保持在自由层中。 实现了Ku增强,并且用于STT-MRAM设计的存储单元的保留时间增加。