GAPS IN RESISTORS FOR THERMAL IMAGING

    公开(公告)号:US20210331488A1

    公开(公告)日:2021-10-28

    申请号:US16603577

    申请日:2018-07-11

    Abstract: In some examples, a thermal imaging head includes a resistor and conductors connected to end portions of the resistor to pass an electrical current through the resistor. The resistor includes gaps at the end portions of the resistor, each gap of the gaps reducing a cross-sectional area of a respective end portion of the end portions of the resistor relative to a cross-sectional area of a central portion of the resistor.

    Fluid ejection devices comprising memory cells

    公开(公告)号:US10319728B2

    公开(公告)日:2019-06-11

    申请号:US15379286

    申请日:2016-12-14

    Abstract: In some examples, a fluid ejection device includes a substrate and a memory cell on the substrate, the memory cell including a first dielectric layer, a floating gate, a second dielectric layer, and a control gate. The memory cell includes a channel region between a drain region and a source region. The first dielectric layer is over the channel region and the floating gate is capacitively coupled to the channel region through the first dielectric layer. The floating gate includes a polysilicon layer, a metal layer, and a second dielectric layer between the polysilicon layer and the metal layer, where the second dielectric layer includes an opening through which the polysilicon layer is electrically connected to the metal layer.

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