-
公开(公告)号：US20190241770A1
公开(公告)日：2019-08-08
申请号：US16328944
申请日：2017-08-29
IPC分类号： C09J9/02 , C09J175/16
CPC分类号： C09J9/02 , C09J7/00 , C09J175/16 , C09J201/00
摘要： One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
-
公开(公告)号：US20210074674A1
公开(公告)日：2021-03-11
申请号：US16965774
申请日：2019-01-31
发明人： Tetsuyuki SHIRAKAWA
摘要： This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.
-
公开(公告)号：US20210017427A1
公开(公告)日：2021-01-21
申请号：US16957538
申请日：2018-12-27
摘要： One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.
-
4.发明申请公开(公告)号：US20190241771A1
公开(公告)日：2019-08-08
申请号：US16339145
申请日：2017-09-26
发明人： Takashi TATSUZAWA , Kazuya MATSUDA , Yutaka TSUCHIDA , Takashi SEKI , Mitsuyoshi SHIMAMURA , Kengo SHINOHARA , Tetsuyuki SHIRAKAWA , Yasunori KAWABATA , Satoru MATSUMOTO
CPC分类号： C09J9/02 , C09J7/00 , C09J7/30 , C09J7/401 , C09J11/04 , C09J201/00 , C09J2203/326 , C09J2423/045 , C09J2423/105 , C09J2425/00 , C09J2463/00 , C09J2467/005 , C09J2483/00 , H01B1/22 , H01B5/14 , H01B5/16 , H01L24/29 , H01L24/83 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29255 , H01L2224/29264 , H01L2224/29293 , H01L2224/83121 , H01L2224/83851 , H01R11/01
摘要： A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
-
公开(公告)号：US20200321305A1
公开(公告)日：2020-10-08
申请号：US16957568
申请日：2018-12-27
IPC分类号： H01L23/00
摘要： One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.
-
-
-
-
搜索结果
5 条记录 (耗时 0.014 秒)