公开(公告)号：US20050029666A1

公开(公告)日：2005-02-10

申请号：US10487990

申请日：2002-08-27

Applicant: Yasutoshi Kurihara ,  Yoshimasa Takahashi ,  Tsuneo Endoh ,  Mikio Negishi ,  Masashi Yamaura ,  Hirokazu Nakajima ,  Yosuke Sakurai ,  Hironori Kodama

Inventor： Yasutoshi Kurihara ,  Yoshimasa Takahashi ,  Tsuneo Endoh ,  Mikio Negishi ,  Masashi Yamaura ,  Hirokazu Nakajima ,  Yosuke Sakurai ,  Hironori Kodama

IPC: B23K35/02 ,  B23K35/26 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/85 ,  B23K35/0244 ,  B23K35/262 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/552 ,  H01L23/642 ,  H01L24/01 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29223 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29249 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29266 ,  H01L2224/2927 ,  H01L2224/29272 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/35121 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01029

Abstract: A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.

Abstract translation: 公开了一种半导体器件，其中将粘合芯片部件和布线部件的焊料层封装在树脂层中，并且焊料层由金属粉末分布在基体金属中的复合体构成。 当将其中芯片部件与焊料一起安装在布线部件中的半导体器件时，将树脂密封的焊接部件二次安装在外部布线部件上，由于流出而导致焊料的流出和短路， 可以防止切断部件和芯片部件的位移。

公开(公告)号：US20170326640A1

公开(公告)日：2017-11-16

申请号：US15523830

申请日：2015-05-08

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Wolfgang SCHMITT ,  Thomas KREBS ,  Michael SCHÄFER ,  Susanne Klaudia DUCH ,  Jens NACHREINER

IPC: B22F1/00 ,  H01L23/00 ,  B22F3/10 ,  B22F7/06

CPC classification number: B22F1/0062 ,  B22F1/0011 ,  B22F1/0055 ,  B22F3/10 ,  B22F7/062 ,  B22F7/064 ,  B22F7/08 ,  B22F2301/255 ,  C22C5/00 ,  C22C5/06 ,  C22C9/00 ,  C22C21/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27505 ,  H01L2224/29224 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29269 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32145 ,  H01L2224/8384 ,  H01L2924/00014

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.

公开(公告)号：US11667817B2

公开(公告)日：2023-06-06

申请号：US16339145

申请日：2017-09-26

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takashi Tatsuzawa ,  Kazuya Matsuda ,  Yutaka Tsuchida ,  Takashi Seki ,  Mitsuyoshi Shimamura ,  Kengo Shinohara ,  Tetsuyuki Shirakawa ,  Yasunori Kawabata ,  Satoru Matsumoto

IPC: H01L21/68 ,  C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/40 ,  C09J11/04 ,  C09J201/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L23/00 ,  H01R11/01

CPC classification number: C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/401 ,  C09J11/04 ,  C09J201/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01R11/01 ,  C09J2203/326 ,  C09J2423/045 ,  C09J2423/105 ,  C09J2425/00 ,  C09J2463/00 ,  C09J2467/005 ,  H01L24/32 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/743 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2224/29014 ,  H01L2924/00012 ,  H01L2224/29013 ,  H01L2924/00012 ,  H01L2224/29012 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/27 ,  H01L2224/83851 ,  H01L2924/00014

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

公开(公告)号：US20120211764A1

公开(公告)日：2012-08-23

申请号：US13359855

申请日：2012-01-27

Applicant: Keishiro OKAMOTO ,  Tadahiro IMADA ,  Nobuhiro IMAIZUMI ,  Keiji WATANABE

Inventor： Keishiro OKAMOTO ,  Tadahiro IMADA ,  Nobuhiro IMAIZUMI ,  Keiji WATANABE

IPC: H01L23/488 ,  H01L21/60 ,  H01L29/20

CPC classification number: H01L24/32 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29269 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29565 ,  H01L2224/2969 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13064 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/3512

Abstract: A semiconductor device includes: a support base material, and a semiconductor element bonded to the support base material with a binder, the binder including: a porous metal material that contacts the support base material and the semiconductor element, and a solder that is filled in at least one part of pores of the porous metal material.

Abstract translation: 半导体器件包括：支撑基底材料和用粘合剂粘合到支撑基底材料上的半导体元件，所述粘合剂包括：接触所述支撑基底材料和所述半导体元件的多孔金属材料，以及填充在所述基底材料中的焊料 多孔金属材料的孔的至少一部分。

公开(公告)号：US11842968B2

公开(公告)日：2023-12-12

申请号：US17732751

申请日：2022-04-29

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Kohei Yabuta ,  Takayuki Yamada ,  Yuya Muramatsu ,  Noriyuki Besshi ,  Yutaro Sugi ,  Hiroaki Haruna ,  Masaru Fuku ,  Atsuki Fujita

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/13

CPC classification number: H01L23/562 ,  H01L21/4878 ,  H01L23/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29021 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29264 ,  H01L2224/29269 ,  H01L2224/8384 ,  H01L2924/1033 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/35121

Abstract: A power semiconductor device includes a substrate and a semiconductor element bonded onto a first surface of the substrate through use of a sintered metal bonding material. The substrate has a plurality of dimples formed in the first surface and located outside a location immediately below a heat generation unit of the semiconductor element. The sintered metal bonding material is supplied onto the substrate after the formation of the dimples, and the semiconductor element is bonded to the substrate through application of heat and a pressure thereto.

公开(公告)号：US11776927B2

公开(公告)日：2023-10-03

申请号：US17376372

申请日：2021-07-15

Applicant: Infineon Technologies AG

Inventor： Thomas Behrens ,  Alexander Heinrich ,  Evelyn Napetschnig ,  Bernhard Weidgans ,  Catharina Wille ,  Christina Yeong

IPC: H01L23/00 ,  B23K35/26 ,  C22C13/02

CPC classification number: H01L24/29 ,  B23K35/262 ,  C22C13/02 ,  H01L24/83 ,  H01L2224/2922 ,  H01L2224/29211 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29269 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.

公开(公告)号：US20190241771A1

公开(公告)日：2019-08-08

申请号：US16339145

申请日：2017-09-26

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takashi TATSUZAWA ,  Kazuya MATSUDA ,  Yutaka TSUCHIDA ,  Takashi SEKI ,  Mitsuyoshi SHIMAMURA ,  Kengo SHINOHARA ,  Tetsuyuki SHIRAKAWA ,  Yasunori KAWABATA ,  Satoru MATSUMOTO

IPC: C09J9/02 ,  H01L23/00 ,  C09J11/04 ,  C09J7/30 ,  C09J7/40

CPC classification number: C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/401 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  C09J2423/045 ,  C09J2423/105 ,  C09J2425/00 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2483/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29293 ,  H01L2224/83121 ,  H01L2224/83851 ,  H01R11/01

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.