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    Defect Classification Device, Inspection Device, and Inspection System
    1.
    发明申请
    Defect Classification Device, Inspection Device, and Inspection System 审中-公开

    公开(公告)号：US20200256807A1

    公开(公告)日：2020-08-13

    申请号：US16642948

    申请日：2017-09-11

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Takanori KONDO ,  Toshifumi HONDA ,  Akira HAMAMATSU ,  Hideo OTA ,  Yoshio KIMOTO

    IPC: G01N21/95 ,  G01N21/956

    Abstract: The present invention addresses the problem of a film formation process in that a minute defect that an inspection before film formation (pre-inspection) has failed to detect becomes a larger film swelling due to film formation, and that, since the film swelling cannot be distinguished from an on-film defect, the film swelling is detected during an inspection after the film formation (post-inspection) as being an on-film defect that is on the film. In order to prevent the erroneous determination of the on-film defect, the sensitivity of the post-inspection has been reduced so that a film swelling due to a minute defect would not be detected. According to the present invention, classification is performed to determine whether a defect is at least one of an on-film defect and a film swelling, by performing a coordinate correction on the result of a post-inspection by means of an actual-defect fine alignment using the result of a pre-inspection performed with two-stage thresholds, and by checking defects against each other. In addition, classification is performed to determine whether a defect is at least one of an on-film defect and a film swelling by, during the post-inspection, preparing instruction data from information of the refractive index and thickness of a film formed on a wafer and comparing the instruction data with a signal intensity ratio of a detection system.

    Inspection Device
    4.
    发明申请
    Inspection Device 有权
    检验装置

    公开(公告)号：US20160139059A1

    公开(公告)日：2016-05-19

    申请号：US14895618

    申请日：2014-05-19

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Shunichi MATSUMOTO ,  Akira HAMAMATSU ,  Takahiro JINGU

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/0636

    Abstract: An inspection device is required to detect a minute defect, that is, to have high sensitivity as semiconductor devices become finer. There are some approaches for improving the sensitivity. One is to shorten the wavelength of illuminating light radiated onto a sample. This is because, assuming that the wavelength of the illuminating light is λ, I∝λ−4 is established between the magnitude of scattered light is I and λ. Another approach is to use illuminating light including multiple wavelengths. An approach for taking in more scattered light generated from the sample is also possible. However, an optical system suitable for these approaches has not been sufficiently found in conventional techniques. One feature of the present invention is to detect a defect by using a Wolter optical system including a Wolter mirror.

    Abstract translation: 需要检查装置来检测微小缺陷，即，随着半导体器件变得更细，具有高灵敏度。 有一些提高灵敏度的方法。 一个是缩短辐射到样品上的照明光的波长。 这是因为，假设照明光的波长为λ，则在散射光的大小为I和λ之间建立Iαλ-4。 另一种方法是使用包括多个波长的照明光。 采用从样品产生的更多散射光的方法也是可能的。 然而，适用于这些方法的光学系统在常规技术中尚未充分发现。 本发明的一个特征是通过使用包括Wolter反射镜的Wolter光学系统来检测缺陷。

    Inspection Device
    6.
    发明申请
    Inspection Device 审中-公开

    公开(公告)号：US20180088055A1

    公开(公告)日：2018-03-29

    申请号：US15569503

    申请日：2015-05-26

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Yoshio KIMOTO ,  Akira HAMAMATSU

    IPC: G01N21/88 ,  G01N21/95 ,  G01N21/47

    CPC classification number: G01N21/8806 ,  G01N21/47 ,  G01N21/9501 ,  G01N2021/4792 ,  G01N2021/8848

    Abstract: Proposed is an inspection device that is provided with: an illuminating optical unit that irradiates a discretionary region of a sample with light; a control unit that gives instructions to the illuminating optical unit; and at least one detection unit that detects light transmitted from the sample. The illuminating optical unit includes a light source unit that generates light, and an electrooptic element unit to which the light generated by the light source unit is inputted, and on the basis of the instructions given from the control unit, the electrooptic element unit adjusts the light to be in a desired polarization state, said light having been generated by the light source unit, and irradiates the sample with the light.

    DEFECT INSPECTION METHOD AND APPARATUS
    7.
    发明申请
    DEFECT INSPECTION METHOD AND APPARATUS 有权
    缺陷检查方法和装置

    公开(公告)号：US20130343632A1

    公开(公告)日：2013-12-26

    申请号：US13846441

    申请日：2013-03-18

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuta URANO ,  Akira HAMAMATSU ,  Shunji MAEDA ,  Kaoru SAKAI

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/30148

    Abstract: A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

    Abstract translation: 提供了一种图案检查装置，用于将形成为相同的图案的彼此对应的区域的图像进行比较，并判断图像中的非重合部分是缺陷。 图案检查装置配备有图像比较部，其在特征空间中绘制检查对象图像的各个像素，并且将特征空间中的过度偏离的点作为缺陷进行检测。 即使图像中的相同图案由于晶片上形成的膜的厚度差而具有亮度差，因此也可以正确地检测缺陷。

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