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    Inspection Device and Measurement Device
    1.
    发明申请
    Inspection Device and Measurement Device 有权
    检测装置和测量装置

    公开(公告)号：US20160322193A1

    公开(公告)日：2016-11-03

    申请号：US15109726

    申请日：2014-12-08

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Masami MAKUUCHI ,  Takahiro JINGU

    IPC: H01J37/244 ,  H01J37/28 ,  G01N21/94 ,  G01N21/95

    CPC classification number: H01J37/244 ,  A61B5/0059 ,  A61B5/0075 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/956 ,  H01J37/28 ,  H01J49/00 ,  H01J2237/2443 ,  H01J2237/2444 ,  H01J2237/2445 ,  H01J2237/24495

    Abstract: A detection circuit for accurately detecting a very small foreign material and an inspection/measurement device using the same are provided. The inspection/measurement device includes: an irradiation section that irradiates a laser beam to a surface of a specimen; and a detection section that detects scattered light from the surface of the specimen and generates a detection signal. The detection section includes: a photon counting sensor that outputs M output signals from photo-detecting elements of N pixels (N and N are natural numbers, and M

    Abstract translation: 提供了一种用于精确检测非常小的异物的检测电路和使用其的检查/测量装置。 检查/测量装置包括：照射部，其将激光束照射到试样的表面; 以及检测部，其检测来自所述检体的表面的散射光，并生成检测信号。 检测部分包括：光子计数传感器，其从N个像素的光检测元件输出M个输出信号（N和N是自然数，M

    INSPECTION APPARATUS AND INSPECTION METHOD
    2.
    发明申请
    INSPECTION APPARATUS AND INSPECTION METHOD 审中-公开

    公开(公告)号：US20190178813A1

    公开(公告)日：2019-06-13

    申请号：US16311103

    申请日：2016-07-04

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Hisaaki KANAI ,  Masami MAKUUCHI ,  Yukihisa MOHARA ,  Eiji IMAI

    IPC: G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/9501 ,  G01N21/956

    Abstract: A defect inspection apparatus includes a light irradiation unit irradiating a sample placed on a table unit with illumination light, a detection optical system forming a scattered light image from the sample and detecting the generated scattered light image through an image sensor, a processing unit receiving a signal from the image sensor of the detection optical system that detects the scattered light image, generating an image of the scattered light, and detecting a defect of the sample by processing the generated image, an output unit outputting the defect image processed by the image processing unit, and a control unit controlling the stable unit, the light irradiation unit, the detection optical system, and the image processing unit. The image processing unit includes an image generation unit that receives the signal and generates the image, a correction unit that corrects lightness discontinuity and a defect detection unit for image processing.

    DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD
    4.
    发明申请
    DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD 审中-公开

    公开(公告)号：US20200256804A1

    公开(公告)日：2020-08-13

    申请号：US16616069

    申请日：2018-02-16

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Toshifumi HONDA ,  Shunichi MATSUMOTO ,  Masami MAKUUCHI ,  Yuta URANO ,  Keiko OKA

    IPC: G01N21/88 ,  G01N21/956 ,  G01N21/47

    Abstract: A defect inspection apparatus includes: an illumination unit configured to illuminate an inspection object region of a sample with light emitted from a light source; a detection unit configured to detect scattered light in a plurality of directions, which is generated from the inspection object region; a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal; and a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample. The detection unit includes an imaging unit configured to divide an aperture and form a plurality of images on the photoelectric conversion unit. The signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample.

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