公开(公告)号：US20150354947A1

公开(公告)日：2015-12-10

申请号：US14759798

申请日：2014-01-10

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Takanori KONDO ,  Takahiro JINGU ,  Masaaki ITO ,  Masami IKOTA

IPC: G01B11/30 ,  G01B11/24 ,  G01Q60/24

CPC classification number: G01B11/303 ,  G01B11/24 ,  G01B2210/56 ,  G01Q60/24 ,  H01L22/12 ,  H01L22/20

Abstract: Patent Document 1 discloses height measurement using an atomic force microscope (AFM) as means for measuring micro roughness. However, since it takes time for this measurement, it is difficult to apply a single display to inspection of all wafers and the entire surface thereof in an in-line manner. The invention provides a technique that estimates micro roughness from a total sum of detection signals from plural detection systems and signal ratios, using a light scattering method. The technique rotates and translates a wafer at high speed to measure the entire surface of the wafer with high throughput. Further, the relationship between the micro roughness and the intensity of scattered light varies according to a material of the wafer and a film thickness thereof. Further, calibration of an apparatus is also necessary. In consideration of this point, the invention provides a technique that has a function of correcting an optically acquired detection result using a sample which is substantially the same as a measurement target and makes the optically acquired detection result come close to a result measured by an apparatus (for example, an AFM) using a different measurement principle.

Abstract translation: 专利文献1公开了使用原子力显微镜（AFM）作为测量微观粗糙度的装置的高度测量。 然而，由于该测量需要时间，因此难以以一个一行的方式将单个显示器应用于所有晶片及其整个表面的检查。 本发明提供一种使用光散射法从多个检测系统和信号比的总和的总和估计微粗糙度的技术。 该技术高速旋转和平移晶片，以高产量测量晶片的整个表面。 此外，微观粗糙度和散射光的强度之间的关系根据晶片的材料和膜的厚度而变化。 此外，设备的校准也是必需的。 考虑到这一点，本发明提供了一种技术，其具有使用与测量目标基本相同的样本来校正光学获取的检测结果的功能，并且使光学获取的检测结果接近由装置测量的结果 （例如，AFM）使用不同的测量原理。

公开(公告)号：US20170268870A1

公开(公告)日：2017-09-21

申请号：US15528692

申请日：2014-11-25

Applicant: Hitachi High-Technologies Corporation

Inventor： Takahiro JINGU

IPC: G01B21/04 ,  G03F7/20

CPC classification number: G01B21/042 ,  G01N21/93 ,  G01N21/956 ,  G03F7/7065

Abstract: A sample for coordinates calibration including (1) a substrate having a circular plate-shape, and (2) multiple intentional defects that form a grid pattern with squares as unit grids on a surface of the substrate, the intentional defect providing a center point of the grid pattern coinciding with a center point of the substrate and, letting the maximum value of a number of the unit grids arranged from the center point of the substrate in radial directions be N (a natural number equal to or larger than two), a number of the intentional defects formed at equal spaces along one side of the unit grid being N+1 including the two intentional defects providing a vertex of the unit grid is proposed.

公开(公告)号：US20130314700A1

公开(公告)日：2013-11-28

申请号：US13956858

申请日：2013-08-01

Applicant: Hitachi High-Technologies Corporation

Inventor： Katsuya SUZUKI ,  Takahiro JINGU

IPC: G01N21/93

CPC classification number: G01N21/93 ,  G01N21/9501 ,  G01N2021/8861 ,  H04L9/3247 ,  H04N5/77

Abstract: A data processing and controlling portion calculates the amounts of coordinate deviations between artificial defects on a standard sample and detected defects, checks the sensitivity (instrumental sensitivity (luminance, brightness, or the like)), and proceeds to execution of hardware corrections. If the coordinate deviation is less than a certain value, software corrections are carried out. In the case of the software corrections, coordinate corrections are made for the whole standard sample. The amounts of coordinate deviations are computed and checked. If the amounts of coordinate deviations are outside a tolerance, coordinate corrections are made for each region obtained by dividing the standard sample.

Abstract translation: 数据处理和控制部分计算标准样品上的人造缺陷和检测到的缺陷之间的坐标偏差量，检查灵敏度（仪器灵敏度（亮度，亮度等）），并进行硬件校正的执行。 如果坐标偏差小于一定值，则进行软件校正。 在软件校正的情况下，对整个标准样品进行坐标校正。 计算和检查坐标偏差量。 如果坐标偏差量超出公差，则对通过划分标准样品获得的每个区域进行坐标校正。

公开(公告)号：US20160178360A1

公开(公告)日：2016-06-23

申请号：US15054372

申请日：2016-02-26

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Masaaki ITO ,  Takahiro JINGU ,  Hisashi HATANO

IPC: G01B11/30 ,  G01N21/55

CPC classification number: G01B11/303 ,  G01B11/24 ,  G01B2210/56 ,  G01N21/4738 ,  G01N21/55 ,  G01N21/9501 ,  G01N2201/12

Abstract: In related art, consideration is not given to that a spatial distribution of scattered light changes in various direction such as forward/backward/sideways according to a difference in micro roughness. Particularly, although a step-terrace structure appearing on an epitaxial growth wafer produces anisotropy in the scattered light distribution, consideration is not given to this point in the related art. The invention includes a process in which light is illuminated to a sample surface, plural detection optical systems mutually different in directions of optical axes detect a spatial distribution of scattered light, and a spatial frequency spectrum of the sample surface is calculated.

Abstract translation: 在现有技术中，不考虑散射光的空间分布根据微粗糙度的差异而在各种方向如前后/侧面变化。 特别地，虽然出现在外延生长晶片上的台阶平台结构在散射光分布中产生各向异性，但是在现有技术中没有考虑到这一点。 本发明包括将光照射到样品表面的方法，在光轴方向上彼此不同的多个检测光学系统检测散射光的空间分布，并且计算样品表面的空间频谱。

公开(公告)号：US20150346112A1

公开(公告)日：2015-12-03

申请号：US14758054

申请日：2013-12-19

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Takahiro JINGU

IPC: G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/93 ,  G01N21/956 ,  G01N2201/127

Abstract: An inspection apparatus which can be accurately calibrated regardless of a use environment or an amount of use time is implemented. A reference substrate 100 provided with a diffraction grating 107 is mounted on a transport system 110, an illumination region 106 is formed on the diffraction grating 107 by light 105 from an illumination optical system 104, reflected light is collected by a detection optical system 108, and an output value from a sensor 111 is measured. It is determined whether or not a difference between a simulation value preserved in a processing section 112 and the output value from the sensor 111 is within a predetermined allowable range, and the optical system is adjusted so that the difference enters the allowable range. Since standard data for performing calibration on the inspection apparatus is obtained by using the diffraction grating, it is possible to implement the inspection apparatus which can be accurately calibrated regardless of a use environment or an amount of use time.

Abstract translation: 实现无论使用环境或使用时间量多少都可以精确校准的检查装置。 设置有衍射光栅107的参考基板100安装在传送系统110上，照明区域106由照明光学系统104的光105形成在衍射光栅107上，反射光被检测光学系统108收集， 并且测量来自传感器111的输出值。 确定在处理部分112中保存的模拟值与来自传感器111的输出值之间的差是否在预定的允许范围内，并且调整光学系统以使差值进入允许范围。 由于通过使用衍射光栅来获得用于在检查装置上进行校准的标准数据，所以可以实现可以精确校准的检查装置，而不管使用环境或使用时间量如何。

公开(公告)号：US20200266027A1

公开(公告)日：2020-08-20

申请号：US16061469

申请日：2015-12-22

Applicant: Hitachi High-Technologies Corporation

Inventor： Takahiro JINGU

IPC: H01J37/244 ,  H01J37/28

Abstract: A charged particle beam apparatus includes an irradiation system that supplies a converged charged particle beam to a sample and scans the sample with the charged particle beam, an imaging optical system that images the energy generated in the sample, a detection system that detects an image formed by the imaging optical system with an avalanche photodiode array, and a control unit that changes a pixel to be operated in a Geiger mode among pixels configuring the avalanche photodiode array according to movement of an irradiation range of the energy.

公开(公告)号：US20170102339A1

公开(公告)日：2017-04-13

申请号：US15387786

申请日：2016-12-22

Applicant: Hitachi High-Technologies Corporation

Inventor： Toshifumi HONDA ,  Yuta URANO ,  Takahiro JINGU ,  Akira HAMAMATSU

IPC: G01N21/88 ,  G01N21/95 ,  G01J1/44

CPC classification number: G01N21/8806 ,  G01J1/0474 ,  G01J1/44 ,  G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/0683 ,  G01N2201/0697 ,  G01N2201/10 ,  G01N2201/12

Abstract: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.

公开(公告)号：US20160322193A1

公开(公告)日：2016-11-03

申请号：US15109726

申请日：2014-12-08

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Masami MAKUUCHI ,  Takahiro JINGU

IPC: H01J37/244 ,  H01J37/28 ,  G01N21/94 ,  G01N21/95

CPC classification number: H01J37/244 ,  A61B5/0059 ,  A61B5/0075 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/956 ,  H01J37/28 ,  H01J49/00 ,  H01J2237/2443 ,  H01J2237/2444 ,  H01J2237/2445 ,  H01J2237/24495

Abstract: A detection circuit for accurately detecting a very small foreign material and an inspection/measurement device using the same are provided. The inspection/measurement device includes: an irradiation section that irradiates a laser beam to a surface of a specimen; and a detection section that detects scattered light from the surface of the specimen and generates a detection signal. The detection section includes: a photon counting sensor that outputs M output signals from photo-detecting elements of N pixels (N and N are natural numbers, and M

Abstract translation: 提供了一种用于精确检测非常小的异物的检测电路和使用其的检查/测量装置。 检查/测量装置包括：照射部，其将激光束照射到试样的表面; 以及检测部，其检测来自所述检体的表面的散射光，并生成检测信号。 检测部分包括：光子计数传感器，其从N个像素的光检测元件输出M个输出信号（N和N是自然数，M

公开(公告)号：US20160139059A1

公开(公告)日：2016-05-19

申请号：US14895618

申请日：2014-05-19

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Shunichi MATSUMOTO ,  Akira HAMAMATSU ,  Takahiro JINGU

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/0636

Abstract: An inspection device is required to detect a minute defect, that is, to have high sensitivity as semiconductor devices become finer. There are some approaches for improving the sensitivity. One is to shorten the wavelength of illuminating light radiated onto a sample. This is because, assuming that the wavelength of the illuminating light is λ, I∝λ−4 is established between the magnitude of scattered light is I and λ. Another approach is to use illuminating light including multiple wavelengths. An approach for taking in more scattered light generated from the sample is also possible. However, an optical system suitable for these approaches has not been sufficiently found in conventional techniques. One feature of the present invention is to detect a defect by using a Wolter optical system including a Wolter mirror.

Abstract translation: 需要检查装置来检测微小缺陷，即，随着半导体器件变得更细，具有高灵敏度。 有一些提高灵敏度的方法。 一个是缩短辐射到样品上的照明光的波长。 这是因为，假设照明光的波长为λ，则在散射光的大小为I和λ之间建立Iαλ-4。 另一种方法是使用包括多个波长的照明光。 采用从样品产生的更多散射光的方法也是可能的。 然而，适用于这些方法的光学系统在常规技术中尚未充分发现。 本发明的一个特征是通过使用包括Wolter反射镜的Wolter光学系统来检测缺陷。

公开(公告)号：US20130258093A1

公开(公告)日：2013-10-03

申请号：US13767420

申请日：2013-02-14

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Takahiro JINGU

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: An inspection tool that can acquire large image data at a high speed while suppressing an increase in the size of a circuit, and an image pickup device that is used for the inspection tool, are provided. Image pickup devices that are used for the inspection tool each include: a plurality of photoelectronic devices of a photoelectron output type; a plurality of sample-and-hold circuits, each circuit being connected to corresponding one of the photoelectronic devices; an analog multiplexer connected to the plurality of sample-and-hold circuits; an analog-to-digital converting circuit connected to the analog multiplexer; and a package that stores the photoelectronic devices, the sample-and-hold circuits, the analog multiplexer and the analog-to-digital converting circuit.

Abstract translation: 提供了一种可以在抑制电路尺寸增加的同时高速获取大图像数据的检查工具和用于检查工具的图像拾取装置。 用于检查工具的图像拾取装置各自包括：多个光电子输出类型的光电子器件; 多个采样和保持电路，每个电路连接到相应的一个光电子器件; 连接到所述多个采样和保持电路的模拟多路复用器; 连接到模拟多路复用器的模拟 - 数字转换电路; 以及存储光电子器件，采样保持电路，模拟多路复用器和模数转换电路的封装。