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公开(公告)号：US10068830B2
公开(公告)日：2018-09-04
申请号：US15117862
申请日：2015-02-04
申请人： HONEYWELL INTERNATIONAL INC. , Liang Zeng , Ya Qun Liu , Jerry Chang , Bright Zhang , Zhe Ding , Wei Jun Wang , Hong Min Huang
发明人： Liang Zeng , Ya Qun Liu , Wei Chang , Liqiang Zhang , Zhe Ding , Wei Jun Wang , Hong Min Huang
IPC分类号： F28F7/00 , H01L23/373 , H01L23/42 , C09K5/06 , H01L23/367
CPC分类号： H01L23/3737 , C09K5/063 , H01L23/367 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
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公开(公告)号：US20170018481A1
公开(公告)日：2017-01-19
申请号：US15117862
申请日：2015-02-04
申请人： Liang ZENG , Ya Qunn LIU , Jerry CHANG , Zhe DING , Wei Jun WANG , Hong Min HUANG , HONEYWELL INTERNATIONAL INC. , Bright ZHANG
发明人： Liang Zeng , Ya Qun Liu , Wei Chang , Liqiang Zhang , Zhe Ding , Wei Jun Wang , Hong Min Huang
IPC分类号： H01L23/373 , C09K5/06 , H01L23/367
CPC分类号： H01L23/3737 , C09K5/063 , H01L23/367 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
摘要翻译： 提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。 还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。
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公开(公告)号：US10781349B2
公开(公告)日：2020-09-22
申请号：US16081649
申请日：2016-03-08
发明人： Liqiang Zhang , Wei Jun Wang , Ya Qun Liu , Hong Min Huang
IPC分类号： H01L23/373 , C09K5/06 , H01L23/367 , H01L23/00 , H01L23/498 , H01L23/42
摘要： A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
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公开(公告)号：US20180358283A1
公开(公告)日：2018-12-13
申请号：US15554806
申请日：2016-10-12
申请人： Liqiang ZHANG , Yaqin MAO , Huifeng DUAN , Haigang KANG , Ya Qun LIU , Ling SHEN , Kai ZHANG , Honeywell International Inc.
发明人： Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
IPC分类号： H01L23/42 , H01L23/373 , C09K5/06 , C08L23/26
CPC分类号： H01L23/42 , C08L23/26 , C09K5/06 , C09K5/063 , H01L23/3737
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
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公开(公告)号：US10312177B2
公开(公告)日：2019-06-04
申请号：US15554806
申请日：2016-10-12
申请人： Honeywell International Inc. , Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
发明人： Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
IPC分类号： C09K5/06 , C08L23/26 , H01L23/373 , H01L23/42
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
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6.发明授权公开(公告)号：US11373921B2
公开(公告)日：2022-06-28
申请号：US16844916
申请日：2020-04-09
发明人： Kai Zhang , Liqiang Zhang , Ling Shen , Ya Qun Liu
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.
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公开(公告)号：US20190249007A1
公开(公告)日：2019-08-15
申请号：US16267056
申请日：2019-02-04
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Xin Zhang
IPC分类号： C08L83/04 , C09K5/08 , H01L23/373 , C08K3/22
CPC分类号： C08L83/04 , C08K3/22 , C08K2201/006 , C08L2201/56 , C08L2203/20 , C09K5/08 , H01L23/3737
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers
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公开(公告)号：US10287471B2
公开(公告)日：2019-05-14
申请号：US15531253
申请日：2014-12-05
发明人： Liqiang Zhang , Ling Shen , Hui Wang , Ya Qun Liu , Wei Jun Wang , Hong Min Huang
IPC分类号： H01L23/373 , C09K5/06 , C09K5/14
摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
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公开(公告)号：US11072706B2
公开(公告)日：2021-07-27
申请号：US16267056
申请日：2019-02-04
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Xin Zhang
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.
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公开(公告)号：US11041103B2
公开(公告)日：2021-06-22
申请号：US16105456
申请日：2018-08-20
发明人： Liqiang Zhang , Huifeng Duan , Rongwei Pan , Qi Zhang , Ya Qun Liu , Haigang Kang
摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.
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