公开(公告)号：US20180358283A1

公开(公告)日：2018-12-13

申请号：US15554806

申请日：2016-10-12

申请人： Liqiang ZHANG ,  Yaqin MAO ,  Huifeng DUAN ,  Haigang KANG ,  Ya Qun LIU ,  Ling SHEN ,  Kai ZHANG ,  Honeywell International Inc.

发明人： Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

IPC分类号： H01L23/42 ,  H01L23/373 ,  C09K5/06 ,  C08L23/26

CPC分类号： H01L23/42 ,  C08L23/26 ,  C09K5/06 ,  C09K5/063 ,  H01L23/3737

摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

公开(公告)号：US10312177B2

公开(公告)日：2019-06-04

申请号：US15554806

申请日：2016-10-12

申请人： Honeywell International Inc. ,  Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

发明人： Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

IPC分类号： C09K5/06 ,  C08L23/26 ,  H01L23/373 ,  H01L23/42

摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

公开(公告)号：US20190078007A1

公开(公告)日：2019-03-14

申请号：US16105456

申请日：2018-08-20

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Rongwei Pan ,  Qi Zhang ,  Ya Qun Liu ,  Haigang Kang

IPC分类号： C09K5/14 ,  C08L71/02

摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

公开(公告)号：US20180030327A1

公开(公告)日：2018-02-01

申请号：US15642082

申请日：2017-07-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Kai Zhang ,  Ya Qun Liu ,  Ling Shen ,  Wei Jun Wang ,  Haigang Kang

IPC分类号： C09K5/14 ,  H05K7/20 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/014 ,  H05K7/2039

摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

公开(公告)号：US10428256B2

公开(公告)日：2019-10-01

申请号：US16160478

申请日：2018-10-15

申请人： Honeywell International Inc.

发明人： Ling Shen ,  Kai Zhang ,  Liqiang Zhang ,  Ya Qun Liu ,  Huifeng Duan ,  Haigang Kang

IPC分类号： H05K7/20 ,  H01L23/34 ,  H01L23/373 ,  C08K3/00 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C09K5/10 ,  C09K5/14 ,  F28F13/00 ,  H05K1/02 ,  H01L23/00 ,  H01L23/42

摘要： The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

公开(公告)号：US20180030328A1

公开(公告)日：2018-02-01

申请号：US15642092

申请日：2017-07-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Kai Zhang ,  Ling Shen ,  Ya Qun Liu ,  Wei Jun Wang ,  Haigang Kang

IPC分类号： C09K5/14 ,  H05K7/20 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08G77/26 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/014 ,  C08L83/04 ,  H05K7/2039 ,  C08K5/5419 ,  C08L83/00

摘要： A thermal interface material includes at least one polysiloxane; at least one thermally conductive filler; and at least one adhesion promoter including both amine and alkyl functional groups.

公开(公告)号：US11041103B2

公开(公告)日：2021-06-22

申请号：US16105456

申请日：2018-08-20

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Rongwei Pan ,  Qi Zhang ,  Ya Qun Liu ,  Haigang Kang

IPC分类号： C09K5/14 ,  C08L71/02

摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

公开(公告)号：US20190119544A1

公开(公告)日：2019-04-25

申请号：US16160478

申请日：2018-10-15

申请人： Honeywell International Inc.

发明人： Ling Shen ,  Kai Zhang ,  Liqiang Zhang ,  Ya Qun Liu ,  Huifeng Duan ,  Haigang Kang

IPC分类号： C09K5/10 ,  F28F13/00 ,  H05K1/02 ,  H01L23/373 ,  H01L23/00

CPC分类号： C09K5/10 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29291 ,  H01L2224/32245 ,  H05K1/0203 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022

摘要： The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.