公开(公告)号：US10068830B2

公开(公告)日：2018-09-04

申请号：US15117862

申请日：2015-02-04

申请人： HONEYWELL INTERNATIONAL INC. ,  Liang Zeng ,  Ya Qun Liu ,  Jerry Chang ,  Bright Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

发明人： Liang Zeng ,  Ya Qun Liu ,  Wei Chang ,  Liqiang Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： F28F7/00 ,  H01L23/373 ,  H01L23/42 ,  C09K5/06 ,  H01L23/367

CPC分类号： H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

公开(公告)号：US20170018481A1

公开(公告)日：2017-01-19

申请号：US15117862

申请日：2015-02-04

申请人： Liang ZENG ,  Ya Qunn LIU ,  Jerry CHANG ,  Zhe DING ,  Wei Jun WANG ,  Hong Min HUANG ,  HONEYWELL INTERNATIONAL INC. ,  Bright ZHANG

发明人： Liang Zeng ,  Ya Qun Liu ,  Wei Chang ,  Liqiang Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： H01L23/373 ,  C09K5/06 ,  H01L23/367

CPC分类号： H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

摘要翻译： 提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。 还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。

公开(公告)号：US20190085225A1

公开(公告)日：2019-03-21

申请号：US16081649

申请日：2016-03-08

申请人： Bright ZHANG ,  Wei Jun WANG ,  Ya Qun LIU ,  Hong Min HUANG ,  Honeywell International Inc.

发明人： Bright Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

IPC分类号： C09K5/06 ,  H01L23/367 ,  H01L23/00 ,  H01L23/373

摘要： A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US20170137685A1

公开(公告)日：2017-05-18

申请号：US15322691

申请日：2014-07-07

申请人： Ya Qun LIU ,  Liang ZENG ,  Hui WANG ,  Bright ZHANG ,  Hong Min HUANG ,  Honeywell International Inc.

发明人： Ya Qun Liu ,  Liang Zeng ,  Hui Wang ,  Bright Zhang ,  Hong Min Huang

IPC分类号： C09K5/14 ,  C09K15/24 ,  C09K15/22 ,  C09K15/30 ,  H01L23/00 ,  C08L23/08 ,  C08K13/02 ,  H05K7/20 ,  H01L23/367 ,  C09K5/06 ,  C09K15/06

CPC分类号： C09K5/14 ,  C08K13/02 ,  C08K2201/001 ,  C08L23/0815 ,  C08L2201/08 ,  C08L2203/20 ,  C09K5/063 ,  C09K15/06 ,  C09K15/22 ,  C09K15/24 ,  C09K15/30 ,  G06F1/20 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/0544 ,  H01L2924/12041 ,  H01L2924/1432 ,  H05K7/2039 ,  H01L2924/00

摘要： A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

公开(公告)号：US10155894B2

公开(公告)日：2018-12-18

申请号：US15322691

申请日：2014-07-07

申请人： HONEYWELL INTERNATIONAL INC. ,  Ya Qun Liu ,  Liang Zeng ,  Hui Wang ,  Bright Zhang ,  Hong Min Huang

发明人： Ya Qun Liu ,  Liang Zeng ,  Hui Wang ,  Bright Zhang ,  Hong Min Huang

IPC分类号： H05K7/20 ,  C09K5/14 ,  H01L23/42 ,  C08K13/02 ,  C08L23/08 ,  C09K5/06 ,  C09K15/06 ,  C09K15/22 ,  C09K15/24 ,  C09K15/30 ,  H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  G06F1/20

摘要： A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

公开(公告)号：US10781349B2

公开(公告)日：2020-09-22

申请号：US16081649

申请日：2016-03-08

申请人： Honeywell International Inc. ,  Liqiang Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

发明人： Liqiang Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

IPC分类号： H01L23/373 ,  C09K5/06 ,  H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/42

摘要： A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US08053867B2

公开(公告)日：2011-11-08

申请号：US12194688

申请日：2008-08-20

申请人： Hong Min Huang ,  Carol Gao ,  Zhe Ding ,  Albert Peng ,  Ya Qun Liu

发明人： Hong Min Huang ,  Carol Gao ,  Zhe Ding ,  Albert Peng ,  Ya Qun Liu

IPC分类号： H01L29/02 ,  H01L29/207

CPC分类号： H01L21/228 ,  H01L21/2225

摘要： Phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material, and methods for fabricating phosphorous-comprising dopants are provided. In one embodiment, a phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or a combination thereof, an alkaline material, cations from an alkaline material, or a combination thereof, and a liquid medium.

摘要翻译： 提供含磷的掺杂剂，在半导体材料中形成磷掺杂区域的方法，以及制造含磷掺杂剂的方法。 在一个实施方案中，含磷掺杂剂包括磷源，其包含含磷的盐，含磷的酸，含磷的阴离子或其组合，碱性材料，来自碱性材料的阳离子或其组合 ，和液体介质。

公开(公告)号：US20100048006A1

公开(公告)日：2010-02-25

申请号：US12194688

申请日：2008-08-20

申请人： Hong Min Huang ,  Carol Gao ,  Zhe Ding ,  Albert Peng ,  Ya Qun Liu

发明人： Hong Min Huang ,  Carol Gao ,  Zhe Ding ,  Albert Peng ,  Ya Qun Liu

IPC分类号： H01L21/22 ,  C09K3/00

CPC分类号： H01L21/228 ,  H01L21/2225

摘要： Phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material, and methods for fabricating phosphorous-comprising dopants are provided. In one embodiment, a phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or a combination thereof, an alkaline material, cations from an alkaline material, or a combination thereof, and a liquid medium.

摘要翻译： 提供含磷的掺杂剂，在半导体材料中形成磷掺杂区域的方法，以及制造含磷掺杂剂的方法。 在一个实施方案中，含磷掺杂剂包括磷源，其包含含磷的盐，含磷的酸，含磷的阴离子或其组合，碱性材料，来自碱性材料的阳离子或其组合 ，和液体介质。

公开(公告)号：US20180358283A1

公开(公告)日：2018-12-13

申请号：US15554806

申请日：2016-10-12

申请人： Liqiang ZHANG ,  Yaqin MAO ,  Huifeng DUAN ,  Haigang KANG ,  Ya Qun LIU ,  Ling SHEN ,  Kai ZHANG ,  Honeywell International Inc.

发明人： Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

IPC分类号： H01L23/42 ,  H01L23/373 ,  C09K5/06 ,  C08L23/26

CPC分类号： H01L23/42 ,  C08L23/26 ,  C09K5/06 ,  C09K5/063 ,  H01L23/3737

摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

公开(公告)号：US10312177B2

公开(公告)日：2019-06-04

申请号：US15554806

申请日：2016-10-12

申请人： Honeywell International Inc. ,  Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

发明人： Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

IPC分类号： C09K5/06 ,  C08L23/26 ,  H01L23/373 ,  H01L23/42

摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.