Abstract:
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
Abstract:
A sliding mechanism comprises a sliding plate, a main plate, a sliding enabling member, a biasing member and a stopping member. The sliding plate has sidewalls and the main plate has peripheral walls corresponding to the sidewalls, respectively. The slide enabling member is coupling the sidewalls to the peripheral walls such that the sliding plate is slid relative to the main plate between closed and open position. The biasing member provides a force for biasing the sliding plate to slide relative to the main body. The stopping member is coupled between the sliding plate and the main plate. When the sliding plate is slid from the open position to the closed position, the stopping member provides a mechanism for the sliding plate to steadily slide relative to the main plate and to firmly stop in the closed position.
Abstract:
An elastic assembly for a portable electronic device includes at least two springs and two bushings. Each spring has a different curvature radius and two annular connecting portions at two ends, the connecting portion of each spring having a different diameter relative other connecting portion of other springs. The springs are substantially arranged in a plane, the two connecting portions of each spring are respectively coiled around and secured to another two connecting portion of another spring, the two bushings are respectively secured to the two connecting portion having the smallest diameter. The disclosure also discloses a slide mechanism using the elastic module.
Abstract:
Transparent conductive materials, articles and films are described herein a) that are easily and efficiently produced, b) can be produced prior to application or in situ, c) are easily applied to surfaces and substrates or formed into articles, d) can be produced and used with materials and methods that are generally accepted by the flat panel display (FPD) industry, along with other industries that produce and utilize microelectronics, e) can be tailored to be photoimageable and patternable using accepted photolithography techniques, f) have superior optical properties and have superior film forming properties, including better adhesion to other adjacent layers, the ability to be laid down in very or ultra thin layers and the ability to remain transparent when laid down as thicker layers. Methods of producing and using these transparent conductive materials are also disclosed.
Abstract:
A housing assembly includes a housing, a push button, and a sealing member. The housing includes a bottom plate and a sidewall protruding from the bottom plate. The sidewall defines an opening therethrough and includes a protruding tab protruding from an inner side thereof and extending around the opening. The push button includes a button body extending through the opening and a pushing portion protruding from an inner side of the button body. The sealing member is made of elastic material and includes a first surface and an opposite, second surface. The first surface defines a receiving groove, and the protruding tab is tightly fit in the receiving groove. When the push button is pressed, the pushing portion pushes the sealing member and the sealing member is elastically deformed, thereby preventing liquid from entering the housing through a gap between the push button and the housing.
Abstract:
Phosphorous-comprising dopants, methods for forming phosphorous-doped regions in a semiconductor material, and methods for fabricating phosphorous-comprising dopants are provided. In one embodiment, a phosphorous-comprising dopant comprises a phosphorous source comprising a phosphorous-comprising salt, a phosphorous-comprising acid, phosphorous-comprising anions, or a combination thereof, an alkaline material, cations from an alkaline material, or a combination thereof, and a liquid medium.
Abstract:
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
Abstract:
A sliding mechanism comprises a sliding plate, a main plate, a sliding enabling member, a biasing member and a stopping member. The sliding plate has sidewalls and the main plate has peripheral walls corresponding to the sidewalls, respectively. The slide enabling member is coupling the sidewalls to the peripheral walls such that the sliding plate is slid relative to the main plate between closed and open position. The biasing member provides a force for biasing the sliding plate to slide relative to the main body. The stopping member is coupled between the sliding plate and the main plate. When the sliding plate is slid from the open position to the closed position, the stopping member provides a mechanism for the sliding plate to steadily slide relative to the main plate and to firmly stop in the closed position.
Abstract:
Methods for simultaneously forming doped regions of opposite conductivity using non-contact printing processes are provided. In one exemplary embodiment, a method comprises the steps of depositing a first liquid dopant comprising first conductivity-determining type dopant elements overlying a first region of a semiconductor material and depositing a second liquid dopant comprising second conductivity-determining type dopant elements overlying a second region of the semiconductor material. The first conductivity-determining type dopant elements and the second conductivity-determining type dopant elements are of opposite conductivity. At least a portion of the first conductivity-determining type dopant elements and at least a portion of the second conductivity-determining type dopant elements are simultaneously diffused into the first region and into the second region, respectively.
Abstract:
Methods for simultaneously forming doped regions of opposite conductivity using non-contact printing processes are provided. In one exemplary embodiment, a method comprises the steps of depositing a first liquid dopant comprising first conductivity-determining type dopant elements overlying a first region of a semiconductor material and depositing a second liquid dopant comprising second conductivity-determining type dopant elements overlying a second region of the semiconductor material. The first conductivity-determining type dopant elements and the second conductivity-determining type dopant elements are of opposite conductivity. At least a portion of the first conductivity-determining type dopant elements and at least a portion of the second conductivity-determining type dopant elements are simultaneously diffused into the first region and into the second region, respectively.