-
1.发明申请公开(公告)号：US20200343154A1
公开(公告)日：2020-10-29
申请号：US16844916
申请日：2020-04-09
发明人： Kai Zhang , Liqiang Zhang , Ling Shen , Ya Qun Liu
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.
-
公开(公告)号：US20180030327A1
公开(公告)日：2018-02-01
申请号：US15642082
申请日：2017-07-05
发明人： Liqiang Zhang , Huifeng Duan , Kai Zhang , Ya Qun Liu , Ling Shen , Wei Jun Wang , Haigang Kang
CPC分类号： C09K5/14 , C08K3/22 , C08K2003/2227 , C08K2003/2296 , C08K2201/001 , C08K2201/014 , H05K7/2039
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
-
3.发明授权公开(公告)号：US11373921B2
公开(公告)日：2022-06-28
申请号：US16844916
申请日：2020-04-09
发明人： Kai Zhang , Liqiang Zhang , Ling Shen , Ya Qun Liu
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.
-
公开(公告)号：US20190249007A1
公开(公告)日：2019-08-15
申请号：US16267056
申请日：2019-02-04
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Xin Zhang
IPC分类号： C08L83/04 , C09K5/08 , H01L23/373 , C08K3/22
CPC分类号： C08L83/04 , C08K3/22 , C08K2201/006 , C08L2201/56 , C08L2203/20 , C09K5/08 , H01L23/3737
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers
-
公开(公告)号：US20180358283A1
公开(公告)日：2018-12-13
申请号：US15554806
申请日：2016-10-12
申请人： Liqiang ZHANG , Yaqin MAO , Huifeng DUAN , Haigang KANG , Ya Qun LIU , Ling SHEN , Kai ZHANG , Honeywell International Inc.
发明人： Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
IPC分类号： H01L23/42 , H01L23/373 , C09K5/06 , C08L23/26
CPC分类号： H01L23/42 , C08L23/26 , C09K5/06 , C09K5/063 , H01L23/3737
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
-
公开(公告)号：US11072706B2
公开(公告)日：2021-07-27
申请号：US16267056
申请日：2019-02-04
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Xin Zhang
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.
-
公开(公告)号：US10312177B2
公开(公告)日：2019-06-04
申请号：US15554806
申请日：2016-10-12
申请人： Honeywell International Inc. , Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
发明人： Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
IPC分类号： C09K5/06 , C08L23/26 , H01L23/373 , H01L23/42
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
-
公开(公告)号：US20190119544A1
公开(公告)日：2019-04-25
申请号：US16160478
申请日：2018-10-15
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Huifeng Duan , Haigang Kang
IPC分类号： C09K5/10 , F28F13/00 , H05K1/02 , H01L23/373 , H01L23/00
CPC分类号： C09K5/10 , F28F13/00 , F28F2013/006 , H01L23/373 , H01L23/3732 , H01L23/3736 , H01L23/3737 , H01L23/42 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/29291 , H01L2224/32245 , H05K1/0203 , H05K2201/0162 , H05K2201/066 , H05K2201/10015 , H05K2201/10022
摘要： The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.
-
公开(公告)号：US20170321100A1
公开(公告)日：2017-11-09
申请号：US15531253
申请日：2014-12-05
发明人： Liqiang Zhang , Ling Shen , Hui Wang , Ya Qun Liu , Wei Jun Wang , Hong Min Huang
IPC分类号： C09K5/06 , H01L23/373 , C09K5/14
CPC分类号： C09K5/066 , C09K5/063 , C09K5/14 , H01L23/3737 , H01L2224/16225 , H01L2224/73204 , H01L2224/73253
摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
-
公开(公告)号：US10567084B2
公开(公告)日：2020-02-18
申请号：US16134139
申请日：2018-09-18
发明人： Kai Zhang , Ling Shen , Liqiang Zhang , Ya Qun Liu , Limei Cui
摘要： A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.02 秒)
