-
公开(公告)号：US20140113097A1
公开(公告)日：2014-04-24
申请号：US13726546
申请日：2012-12-25
发明人： YONG LI , WEN-HSIUNG CHEN , SHIN-WEN CHEN , SHU-SHENG PENG , WEN-CHANG CHEN , YU-TSAN CHENG , LING-QI YI , LI-MIN LIU , FU-LI LONG , FU-CHUN LI
IPC分类号： H05K13/04
CPC分类号： H05K13/0084 , Y10T428/239
摘要： A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.
摘要翻译： SMT带包括载带，多个分隔垫，多个工件和包装带。 载带包括封装表面并且在封装表面中限定许多接收槽，并且沿着载带的长度方向布置。 分离垫被容纳在接收槽中并分别固定到接收槽的底表面。 每个分离垫包括与相应的接收槽的底表面相对的分离表面和从分离表面向上突出的多个突起。 工件分别容纳在接收槽中。 每个工件包括主体和位于相应的分离垫和主体之间的粘合剂层。 包装带粘附到包装表面并密封接收槽。
-
公开(公告)号：US20140049684A1
公开(公告)日：2014-02-20
申请号：US13727467
申请日：2012-12-26
CPC分类号： H05K1/0281 , H04N5/225 , H04N5/2253 , H05K1/0215 , H05K1/141 , H05K3/323 , H05K2201/041 , H05K2201/09781 , H05K2201/10121
摘要： A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads.The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.
摘要翻译： 电路板组件包括柔性电路板，导电粘合剂和多个增强板。 柔性电路板包括第一表面和第二表面。 多个板焊盘安装在第一表面上。 导电粘合剂涂覆在第一表面上并且完全覆盖所有的板焊盘。 加强板位于第二表面上。 每个加强板在空间上对应于相应的一个板焊盘。 加强板提供电路板组件的物理接地和加强。
-
公开(公告)号：US20140059822A1
公开(公告)日：2014-03-06
申请号：US13726654
申请日：2012-12-26
发明人： WEN-CHANG CHEN , SHIN-WEN CHEN , YU-TSAN CHENG , YU-SHU LIN , CHIEN-LIANG CHOU , ZUO-QING YAO
IPC分类号： B23P21/00
CPC分类号： B23P21/004 , H05K13/0434 , Y10T29/4913 , Y10T29/5124 , Y10T29/5135 , Y10T29/5137 , Y10T29/53174 , Y10T29/53187
摘要： An apparatus for assembling camera modules to flexible printed circuit boards (PCBs) includes a number of trays, a surface mounting device used in surface mount technology (SMT) for PCBs, and a hot pressing device. Workpieces, each of which includes a flexible PCB (FPCB) and a lens module positioned on the FPCB, are received in the trays. Each tray is sent to the surface mounting device. The surface mounting device loads and pastes a stiffener onto a FBCB, opposite to a lens module. The hot pressing device hot presses each stiffener to the respective workpiece, which is received in each tray sent from the surface mounting device, to fixedly secure the stiffener to the respective workpiece to form a camera module.
摘要翻译： 用于将相机模块组装到柔性印刷电路板（PCB）的装置包括多个托盘，用于PCB的表面贴装技术（SMT）中的表面安装装置和热压装置。 工件，其中每个包括柔性PCB（FPCB）和位于FPCB上的透镜模块被接收在托盘中。 每个托盘都被送到表面安装装置。 表面安装装置将加强件加载到FBCB上，与透镜模块相对。 热压装置将每个加强件热压到从表面安装装置发送的每个托盘中的相应工件，以将加强件固定地固定到相应的工件以形成相机模块。
-
4.发明申请公开(公告)号：US20140036116A1
公开(公告)日：2014-02-06
申请号：US13727454
申请日：2012-12-26
发明人： SHU-SHENG PENG , WEN-CHANG CHEN , LI-MIN LIU , YU-TSAN CHENG , WEN-HSIUNG CHEN , SHIN-WEN CHEN , YONG LI
CPC分类号： H04N5/335 , H04N5/2257 , H05K1/0215 , H05K1/0277 , H05K1/189 , H05K2201/10151 , H05K2201/2009
摘要： A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.
摘要翻译： 柔性印刷电路板（FPCB）组件包括FPCB，电介质层，加强件和导电粘合剂层。 FPCB包括位于FPCB的表面上的表面和导电层。 导电层包括电路部分和连接到电路部分的接地部分。 电路部分被电介质层完全覆盖，并且接地部分暴露在电介质层的外部。 导电粘合剂位于加强件上，并包括第一粘合部分和第二粘合部分。 第二粘合部分的厚度大于第一粘附部分。 第二粘附部分和第一粘合部分之间的厚度差基本上等于介电层的厚度。 第一粘附部分粘附到电介质层，第二粘附部分粘附到接地部分。
-
5.发明申请STAMPING HEAD USED FOR PRESSING ANISOTROPIC CONDUCTIVE FILM ONTO CERAMIC SUBSTRATE 有权用于将各向异性导电膜压印在陶瓷基板上的压印头公开(公告)号：US20140053986A1
公开(公告)日：2014-02-27
申请号：US13727473
申请日：2012-12-26
发明人： CHIEN-LIANG CHOU , FANG YE , YU-SHU LIN , SHIN-WEN CHEN , WEN-CHANG CHEN , YU-TSAN CHENG
IPC分类号： B32B37/10
CPC分类号： B32B37/10 , B32B2307/202 , B32B2315/02
摘要： A stamping head includes a stamping portion and a connection portion connected to the stamping portion. The stamping portion includes a top surface and four side surfaces. The stamping head defines a jag extending from a junction between a specific one of the side surfaces and the top surface toward a centre of the top surface. The jag passes through the specific side surface. When the stamping head presses a ACF onto a ceramic substrate, a residual air between the ACF and the ceramic substrate flows outside through the jag.
摘要翻译： 冲压头包括冲压部分和连接到冲压部分的连接部分。 冲压部分包括顶表面和四个侧表面。 冲压头限定了从特定一个侧表面和顶表面之间的接头朝向顶表面的中心延伸的锯齿。 锯齿通过特定的侧面。 当冲压头将ACF压在陶瓷衬底上时，ACF和陶瓷衬底之间的剩余空气通过夹层流到外面。
-
公开(公告)号：US20140055651A1
公开(公告)日：2014-02-27
申请号：US13727475
申请日：2012-12-26
发明人： SHIN-WEN CHEN , WEN-CHANG CHEN , YU-TSAN CHENG , YU-SHU LIN , CHIEN-LIANG CHOU
IPC分类号： H04N5/335
CPC分类号： H04N5/335 , H04N5/2257
摘要： An image sensor module includes a ceramic substrate, an image sensor, a conductive film, a flexible print circuit board (FPCB), and a stiffening plate. The ceramic substrate includes an upper surface and a lower surface opposite to the upper surface, the ceramic substrate defines a transparent hole on the upper surface and a receiving recess on the lower surface. The transparent hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The FPCB is electrically connected to the lower surface of the ceramic substrate by the conductive film. The stiffening plate is positioned on one side of the FPCB opposite to the ceramic substrate.
摘要翻译： 图像传感器模块包括陶瓷基板，图像传感器，导电膜，柔性印刷电路板（FPCB）和加强板。 陶瓷基板包括上表面和与上表面相对的下表面，陶瓷基板在上表面上限定透明孔和在下表面上的接收凹部。 透明孔与容纳凹部连通。 图像传感器被容纳在接收凹部中并且电连接到陶瓷基板。 FPCB通过导电膜电连接到陶瓷基板的下表面。 加强板位于FPCB的与陶瓷基板相对的一侧。
-
公开(公告)号：US20140020934A1
公开(公告)日：2014-01-23
申请号：US13707552
申请日：2012-12-06
发明人： SHIN-WEN CHEN , SHU-SHENG PENG , WEN-CHANG CHEN , WEN-HSIUNG CHEN , LI-MIN LIU , YU-TSAN CHENG , YONG LI
IPC分类号： H05K1/02
CPC分类号： H05K1/0277 , H05K1/0215 , H05K2201/09054 , H05K2201/2009
摘要： A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.
摘要翻译： 电路板组件包括柔性电路板和加强板。 柔性电路板包括表面。 导电层位于表面上。 导电层包括完全由电介质层覆盖的电路部分和暴露在电介质层外部的接地部分。 加强板安装在电介质层上。 加强板包括连接到电介质层的连接表面和背离连接表面的支撑表面。 投影从连接表面延伸。 所有突起的位置对应于接地部分的位置，并且所有的突起都通过导电粘合剂与接地部分电接触。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.022 秒)
