摘要:
In a method for manufacturing a semiconductor device, first, a trench is formed on a semiconductor substrate by anisotropic etching, and a reaction product is produced and deposited on the inner wall of the trench during the anisotropic etching. Then, isotropic etching is performed to round a corner of a bottom portion of the trench without removing the reaction product. The isotropic etching can round the corner of the trench without etching the side wall of the trench that is covered by the reaction product.
摘要:
After performing an etching process with respect to one substrate, the substrate is taken out from an etching chamber. Then, a dummy substrate is disposed in the etching chamber and a cleaning process is performed. The cleaning process includes a cleaning step for etching reaction products produced during the etching process to be removed, a seasoning step for adjusting the atmosphere within the etching chamber and the temperature of the substrate, and a purge step for removing suspended foreign materials without generating plasma. By performing the cleaning process, the successive etching process can be performed without generating any black silicon on the substrate, thereby attaining a high production yield.
摘要:
A method of manufacturing a trench gate type IGBT element, which can sufficiently round off a corner at a bottom of a trench with restricting silicon from being excessively etched. A trench is formed at a surface of a P+-type monocrystalline silicon substrate by conducting an anisotropic etching (STEP 1). A corner portion at a bottom of the trench is formed to a concave shape surface by conducting a concave etching (STEP 2). The concave etching etches the silicon substrate so that a diameter of the trench is gradually reduced as the etching advances. After that, the corner portion at a bottom of the trench is rounded off by conducting an isotropic etching (STEP 3). Since the corner portion is chamfered, a radius of curvature of the corner portion of the bottom of the trench can be increased even if an amount of the etching using the isotropic etching in the STEP 3 is small.
摘要:
A surface of a semiconductor substrate is selectively etched to form a first opening, which serves as the opening of a trench. A USG film is deposited on the first opening. A second opening, the width of which is smaller than that of the first opening, is formed in the USG film within the first opening. An inner section of the trench is formed by etching while using the USG film as a mask. The inner surface of the inner region is thermally oxidized to form a silicon oxide film, and a gate insulating film is made by the silicon oxide film and the USG film. A gate electrode is formed in the trench. The gate insulating film is relatively thick at the opening of the trench, so the breakdown voltage at the opening of the trench is increased.
摘要:
A calculation processing unit controls temperature of a Peltier device based on a slope of a waveform obtained by subtracting a waveform of a B-arm monitoring signal from a waveform of an A-arm monitoring signal and a value obtained by subtracting a value B of the B-arm monitoring signal from a value A of the A-arm monitoring signal. Similarly, the calculation processing unit controls a phase of the A-arm and a phase of the B-arm. An A-arm side micro-controller controls temperature of an A-arm side heater 22 based on the value of the A-arm monitoring signal, and controls the phase of the A-arm. A B-arm side micro-controller controls temperature of a B-arm side heater based on the value B of the B-arm monitoring signal, and controls the phase of the B-arm.
摘要:
A method of etching for forming a groove in a SOI substrate includes a forming step, in which a mixed gas plasma is formed by using a mixed gas of a fluorinate gas and an oxygenic gas, and an applying step, in which a high-frequency bias is intermittently applied to the SOI substrate. In the applying step, the high-frequency bias is a temporally modulated high-frequency electricity. According to the method of etching, a yielding rate and a productivity can be improved.
摘要:
A reliable optical transmission system with an improved signal control mechanism that avoids abrupt power variations of light beams, thereby preventing optical supervisory channel (OSC) signals from experiencing errors. An optical amplifier amplifies main signals under the control of an optical amplifier controller, which spends a first predetermined time to raise the output power of the optical amplifier up to a desired level. A pump light source produces a pump beam for injection to a fiber-optic transmission line so as to make it serve as an amplifying medium. The pump light source is controlled by a pump light source controller that spends a second predetermined time to raise the pump beam to a desired power level. This stepwise start-up process of the amplifier power and pump beam power prevents OSC signals from experiencing abrupt power variations.
摘要:
There is provided a mirror supporting structure for a monochromator capable of turning the mirrors about axis lines which cross each other, thereby adjusting the attachment angles of the mirrors in two directions. The mirror supporting structure for a monochromator comprises first angle adjusting means for turning the mirrors about each first axis line which does not cross each plane direction of the mirrors and second angle adjusting means for turning the mirrors about each second axis line which does not cross each plane direction of the mirrors at right angles but is parallel with a line crossing the first axis line. The first angle adjusting means comprises a first leg member and a second leg member which are disposed to be spaced from each other, and a support member installed between the first leg member and the second leg member and supporting the mirrors, and wherein the mirrors are supported by the support member in a manner that each plane direction of the mirrors does not cross the installing direction of the support member at right angles, and the support member can be turned about a line which is parallel with the installing direction of the support member.
摘要:
An immunoassay plate for an immune complex transfer immunoassay, comprising a well type solid phase and a dip stick type solid phase which can be inserted into said well type solid phase, wherein the dip stick type solid phase is coated with either substance (A) or (B) to be mentioned below and the well type solid phase is coated with the other, remaining substance, and these solid phases are used as the two solid phases to be used for an immune complex transfer immunoassay:(A): a substance having a reactive group which specifically binds to a functional group previously introduced onto a substance, which specifically forms an immune complex with a test substance(B): a substance having a reactive group capable of specifically binding to the test substance in the immune complex, a substance which specifically forms an immune complex with the test substance, or a functional group conjugated in advance with said substance, provided that the moiety which binds to the reactive group of (A) does not bind to the reactive group of (B) and vice versa. According to the present invention, an immune complex transfer immunoassay can be markedly simplified. Consequently, a highly sensitive immune complex transfer immunoassay can be conducted with ease and with high precision.
摘要:
A method of assay for antigen comprising the following sequential steps (A), (B), (C) and (D):(A): the antigen to be assayed in a subject solution is bound with a functional group or marker to form a modified antigen;(B): the modified antigen is bound to a carrier via an antibody against the antigen, and then the carrier is separated from the subject solution;(C): Either (a) or (b):(a) the modified antigen is dissociated from the carrier; or(b) the modified antigen-antibody complex comprising the modified antigen and the antibody against the antigen is dissociated from the carrier; and(D): the modified antigen or modified antigen-antibody complex of Step (C) is assayed.This method permits assay for antigens with high sensitivity based on characteristic features of the sandwich method, using an antibody against a single epitopic site, and also permits assay for low molecular substances, which have never been assayed by the conventional sandwich method, with higher sensitivity in comparison with the conventional competitive method.