公开(公告)号：US10547127B2

公开(公告)日：2020-01-28

申请号：US15689041

申请日：2017-08-29

Applicant: Hamilton Sundstrand Corporation

Inventor： David S. Behling ,  Glenn C. Lemmers, Jr. ,  Dhaval Patel ,  Alan Kasner ,  Douglas J. Turner

IPC: H01R9/24 ,  H02K5/22 ,  H02B1/28

Abstract: An electrical terminal device adapted to mount to a structure, and including a electrically non-conductive substructure, an electrically non-conductive cover, a heat resistant shroud, and an electric terminal. The substructure is in contact with the structure. The cover is engaged to the substructure. The substructure and the cover define a chamber, and the substructure defines, at least in-part, a sealed passage in communication with the chamber. The heat resistant shroud substantially covers the cover. The cover is substantially located between the shroud and the substructure. The electric terminal is located in the chamber and is attached to the substructure.

公开(公告)号：US20170133120A1

公开(公告)日：2017-05-11

申请号：US14936605

申请日：2015-11-09

Applicant: Hamilton Sundstrand Corporation

Inventor： William D. Sherman ,  John Huss ,  Alan Kasner

IPC: H01B3/30 ,  H01B7/02 ,  H01H1/021 ,  C08K3/38

CPC classification number: H01B3/30 ,  C08K3/38 ,  C08K2003/385 ,  H01B3/002 ,  H01B7/02 ,  H01H1/021

Abstract: A nanocomposite structure includes a nanocomposite. The nanocomposite includes a bulk matrix phase and a nanophase filler disposed within the bulk matrix phase. The nanophase has a plurality of nanotubes including a material with thermal conductivity that is greater than the thermal conductivity of the bulk matrix phase of the nanocomposite. An electrical device includes a conductor in thermal communication with the nanocomposite structure formed from the nanocomposite.

公开(公告)号：US20160047119A1

公开(公告)日：2016-02-18

申请号：US14462226

申请日：2014-08-18

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： David J. Dollhopf ,  Alan Kasner ,  Suzanne L.B. Woll

IPC: E04B1/84 ,  B64F1/26

CPC classification number: E04B1/84 ,  B64F1/26 ,  G10K11/168

Abstract: An acoustic absorption material may comprise an outer layer and a first layer of batting material proximate to the outer layer. A first layer of room temperature vulcanized silicone (RTV) may be proximate to the batting material. A second layer of batting material may be proximate to the first layer of RTV opposite the first layer of batting material.

Abstract translation: 声吸收材料可以包括靠近外层的外层和殴打材料的第一层。 室温硫化硅胶（RTV）的第一层可能接近击球材料。 第二层击球材料可以靠近与第一层击球材料相对的第一层RTV。

公开(公告)号：US20180199461A1

公开(公告)日：2018-07-12

申请号：US15401872

申请日：2017-01-09

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： John Huss ,  Alan Kasner ,  Mark W. Metzler ,  Ernest Thompson ,  Debabrata Pal ,  Charles Patrick Shepard

IPC: H05K7/20 ,  H05K5/06 ,  H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L23/29

CPC classification number: H05K7/2039 ,  B82Y30/00 ,  C08K7/04 ,  C08K2003/382 ,  H01F27/08 ,  H01G2/08 ,  H01G2/10 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3675 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/42 ,  H05K5/064 ,  C08L75/04 ,  C08L83/04 ,  C08L63/00

Abstract: Potted electronic assemblies are disclosed along with methods of making and cooling them. The electronic assemblies include a conductive heat transfer medium disposed between and in contact with an electronic component and a heat sink. The conductive heat transfer medium has a hardened fluid polymer material that includes boron nitride nanotubes dispersed therein.

公开(公告)号：US20190067840A1

公开(公告)日：2019-02-28

申请号：US15689041

申请日：2017-08-29

Applicant: Hamilton Sundstrand Corporation

Inventor： David S. Behling ,  Glenn C. Lemmers, JR. ,  Dhaval Patel ,  Alan Kasner ,  Douglas J. Turner

IPC: H01R9/24 ,  H02K5/22 ,  H02B1/28

CPC classification number: H01R9/24 ,  B64D33/00 ,  H01R13/516 ,  H01R13/533 ,  H01R2201/10 ,  H02B1/28 ,  H02K5/225

Abstract: An electrical terminal device adapted to mount to a structure, and including a electrically non-conductive substructure, an electrically non-conductive cover, a heat resistant shroud, and an electric terminal. The substructure is in contact with the structure. The cover is engaged to the substructure. The substructure and the cover define a chamber, and the substructure defines, at least in-part, a sealed passage in communication with the chamber. The heat resistant shroud substantially covers the cover. The cover is substantially located between the shroud and the substructure. The electric terminal is located in the chamber and is attached to the substructure.