公开(公告)号：US20120138338A1

公开(公告)日：2012-06-07

申请号：US13365755

申请日：2012-02-03

申请人： Han KIM ,  Hyung-Sik Choi ,  Dae-Hyun Park

发明人： Han KIM ,  Hyung-Sik Choi ,  Dae-Hyun Park

IPC分类号： H05K1/00

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745

摘要： A printed circuit board having stepped conduction layer includes at least one conduction layer configured for use as a signal transmission layer, the at least one conduction layer being divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, and the connecting region being stepped to a lower height than those of the base regions. A lower surface of the connecting region lies on a same plane as a lower surface of the base region, or an upper surface of the connecting region lies on a same plane as an upper surface of the base region. A bridge connecting structure between the connecting regions and the base regions is disposed in possible noise transfer paths between a noise source and a noise attenuation target positioned on the printed circuit board.

摘要翻译： 具有阶梯式导电层的印刷电路板包括被配置为用作信号传输层的至少一个导电层，所述至少一个导电层被分成至少两个基极区域和至少一个连接区域， 区域，并且连接区域被阶梯到比基部区域低的高度。 连接区域的下表面位于与基底区域的下表面相同的平面上，或者连接区域的上表面位于与基底区域的上表面相同的平面上。 在连接区域和基极区域之间的桥连接结构设置在位于印刷电路板上的噪声源和噪声衰减目标之间的可能的噪声传递路径中。

公开(公告)号：US20090084582A1

公开(公告)日：2009-04-02

申请号：US12010750

申请日：2008-01-29

申请人： Han Kim ,  Hyung-Sik Choi ,  Dae-Hyun Park

发明人： Han Kim ,  Hyung-Sik Choi ,  Dae-Hyun Park

IPC分类号： H05K1/00

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745

摘要： A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, where the connecting region is stepped to a lower height than those of the base regions. The stepped conduction layer in the printed circuit board can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc.

摘要翻译： 公开了一种具有台阶导电层的印刷电路板。 在本发明的一个实施例中，提供一种印刷电路板，其中被配置为用作信号传输层的至少一个导电层被分成至少两个基极区域和连接任何相邻的两个基极区域的至少一个连接区域 ，其中连接区域被阶梯到比基部区域的高度更低的高度。 可以使用印刷电路板中的阶梯式导电层来解决配备有各种部件的印刷电路板中的混合信号的问题，包括模拟电路和数字电路等。

公开(公告)号：US08368488B2

公开(公告)日：2013-02-05

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01P1/203

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US20080314634A1

公开(公告)日：2008-12-25

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01R12/04

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。