公开(公告)号：US20080314634A1

公开(公告)日：2008-12-25

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01R12/04

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US08368488B2

公开(公告)日：2013-02-05

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01P1/203

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US08457450B2

公开(公告)日：2013-06-04

申请号：US12314449

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20090133444A1

公开(公告)日：2009-05-28

申请号：US12149517

申请日：2008-05-02

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

IPC分类号： C03B37/022

CPC分类号： G02B6/136 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4611

摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

摘要翻译： 公开了一种制造光学板的方法。 制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层 在倾斜的表面上。

公开(公告)号：US20090130390A1

公开(公告)日：2009-05-21

申请号：US12149952

申请日：2008-05-09

申请人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

发明人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC分类号： B32B3/00 ,  B29D11/00

CPC分类号： B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

摘要翻译： 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。

公开(公告)号：US07505661B2

公开(公告)日：2009-03-17

申请号：US12078948

申请日：2008-04-08

申请人： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

发明人： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC分类号： G02B6/10 ,  H01L21/00

CPC分类号： B29D11/00663 ,  G02B6/136 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/3436 ,  H05K2201/10121 ,  Y10T29/49155

摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

摘要翻译： 公开了一种光波导，具有光波导的封装板及其制造方法。 制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。 利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

公开(公告)号：US08048324B2

公开(公告)日：2011-11-01

申请号：US12076359

申请日：2008-03-17

申请人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： G02B6/10

CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/136 ,  H01L2224/16225

摘要： A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

摘要翻译： 一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离， 载体 抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。 在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

公开(公告)号：US07991250B2

公开(公告)日：2011-08-02

申请号：US12923143

申请日：2010-09-03

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

公开(公告)号：US20110168666A1

公开(公告)日：2011-07-14

申请号：US12986767

申请日：2011-01-07

申请人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Jong-Ha Park ,  Sang-Hoon Kim

发明人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Jong-Ha Park ,  Sang-Hoon Kim

IPC分类号： H01P11/00 ,  B32B37/02 ,  B32B37/14 ,  B32B38/10

CPC分类号： B32B37/0015 ,  B32B37/02 ,  B32B2457/08 ,  B32B2457/14 ,  G02B6/0065

摘要： A method of manufacturing an optical waveguide is disclosed. The method in accordance with an embodiment of the present invention includes providing a carrier, fixing a base substrate to the carrier by using a first insulation layer such that the base substrate is directly stacked on the carrier, stacking an optical waveguide layer on at least one of the base substrate and the first insulation layer, and severing the base substrate such that the base substrate and the optical waveguide layer are separated from the carrier. Accordingly, the optical waveguide layer can be formed with a uniform thickness since wrinkles in the base substrate supporting the optical waveguide layer are prevented from forming during the manufacturing process.

摘要翻译： 公开了一种制造光波导的方法。 根据本发明的实施例的方法包括提供载体，通过使用第一绝缘层将基底固定到载体上，使得基底基板直接堆叠在载体上，将光波导层堆叠在至少一个 的基底基板和第一绝缘层，并且切断基底基板，使得基底基板和光波导层与载体分离。 因此，光波导层可以形成均匀的厚度，因为在制造过程中防止了支撑光波导层的基底基板中的皱纹成形。

公开(公告)号：US07809220B2

公开(公告)日：2010-10-05

申请号：US12219135

申请日：2008-07-16

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括：光波导，其一侧埋有电路图案和垫; 层叠在光波导一侧的绝缘层; 堆叠在所述绝缘层上的第一绝缘材料; 堆叠在所述第一绝缘材料上的第一电布线层; 层叠在所述光波导的另一侧的第二绝缘材料; 层叠在所述第二绝缘材料上的第二电布线层; 以及穿过光波导的通孔。 本发明的某些实施例能够有效地传输光信号和电信号，减少传输到光电转换器的光信号的损耗，并且允许更有效的设计用于电路板中的配线。