公开(公告)号：US08457450B2

公开(公告)日：2013-06-04

申请号：US12314449

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20090133444A1

公开(公告)日：2009-05-28

申请号：US12149517

申请日：2008-05-02

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

IPC分类号： C03B37/022

CPC分类号： G02B6/136 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4611

摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

摘要翻译： 公开了一种制造光学板的方法。 制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层 在倾斜的表面上。

公开(公告)号：US20090130390A1

公开(公告)日：2009-05-21

申请号：US12149952

申请日：2008-05-09

申请人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

发明人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC分类号： B32B3/00 ,  B29D11/00

CPC分类号： B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

摘要翻译： 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。

公开(公告)号：US07505661B2

公开(公告)日：2009-03-17

申请号：US12078948

申请日：2008-04-08

申请人： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

发明人： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC分类号： G02B6/10 ,  H01L21/00

CPC分类号： B29D11/00663 ,  G02B6/136 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/3436 ,  H05K2201/10121 ,  Y10T29/49155

摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

摘要翻译： 公开了一种光波导，具有光波导的封装板及其制造方法。 制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。 利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

公开(公告)号：US08048324B2

公开(公告)日：2011-11-01

申请号：US12076359

申请日：2008-03-17

申请人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： G02B6/10

CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/136 ,  H01L2224/16225

摘要： A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

摘要翻译： 一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离， 载体 抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。 在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

公开(公告)号：US07991250B2

公开(公告)日：2011-08-02

申请号：US12923143

申请日：2010-09-03

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

公开(公告)号：US07809220B2

公开(公告)日：2010-10-05

申请号：US12219135

申请日：2008-07-16

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括：光波导，其一侧埋有电路图案和垫; 层叠在光波导一侧的绝缘层; 堆叠在所述绝缘层上的第一绝缘材料; 堆叠在所述第一绝缘材料上的第一电布线层; 层叠在所述光波导的另一侧的第二绝缘材料; 层叠在所述第二绝缘材料上的第二电布线层; 以及穿过光波导的通孔。 本发明的某些实施例能够有效地传输光信号和电信号，减少传输到光电转换器的光信号的损耗，并且允许更有效的设计用于电路板中的配线。

公开(公告)号：US20090103860A1

公开(公告)日：2009-04-23

申请号：US12314449

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

摘要翻译： 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

公开(公告)号：US20090100671A1

公开(公告)日：2009-04-23

申请号：US12314450

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： H05K3/00

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20090072419A1

公开(公告)日：2009-03-19

申请号：US12076359

申请日：2008-03-17

申请人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： G02B6/10

CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/136 ,  H01L2224/16225

摘要： A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

摘要翻译： 一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离， 载体 抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。 在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。