公开(公告)号：US08897027B2

公开(公告)日：2014-11-25

申请号：US13117614

申请日：2011-05-27

申请人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K1/11 ,  H01L33/62 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20110292625A1

公开(公告)日：2011-12-01

申请号：US13117614

申请日：2011-05-27

申请人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/06

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20120075218A1

公开(公告)日：2012-03-29

申请号：US13238255

申请日：2011-09-21

申请人： MING-CHUAN LIN ,  Tien-Nan Wang ,  Ying-Chi Wang ,  Yung-Chang Lin ,  Lin Lin ,  Wen-Hung Wang ,  Pei-Fang Tsai ,  Shyh-Jeng Chen

发明人： MING-CHUAN LIN ,  Tien-Nan Wang ,  Ying-Chi Wang ,  Yung-Chang Lin ,  Lin Lin ,  Wen-Hung Wang ,  Pei-Fang Tsai ,  Shyh-Jeng Chen

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G06F3/0418 ,  G06F2203/04107

摘要： A touch panel comprising a substrate, a touch element, a first grounding electrode, an insulation layer and a second grounding electrode is disclosed. The touch element is disposed on a first surface of the substrate. The first grounding electrode is disposed on the first surface to surround the touch element. The insulation layer is disposed on the first surface to cover the touch element and the first grounding electrode. The second grounding electrode is disposed on the first insulation layer or on a second surface of the substrate opposite to the first surface. Therefore, the ESD can be conducted to the grounding end G of the circuit component through the enclosed first grounding electrode, and the signal interference between the touch panel and display can be shielded by the second grounding electrode to enhance anti-ESD and anti-noise abilities of the touch panel.

摘要翻译： 公开了一种包括基板，触摸元件，第一接地电极，绝缘层和第二接地电极的触摸面板。 触摸元件设置在基板的第一表面上。 第一接地电极设置在第一表面上以围绕触摸元件。 绝缘层设置在第一表面上以覆盖触摸元件和第一接地电极。 第二接地电极设置在与第一表面相对的第一绝缘层或第二表面上。 因此，ESD可以通过封闭的第一接地电极传导到电路部件的接地端G，并且可以通过第二接地电极屏蔽触摸面板和显示器之间的信号干扰，以增强抗ESD和抗噪声 触摸屏的能力。