公开(公告)号：US08897027B2

公开(公告)日：2014-11-25

申请号：US13117614

申请日：2011-05-27

申请人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K1/11 ,  H01L33/62 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20110292625A1

公开(公告)日：2011-12-01

申请号：US13117614

申请日：2011-05-27

申请人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/06

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US07667141B2

公开(公告)日：2010-02-23

申请号：US12180087

申请日：2008-07-25

申请人： Ying-Fang Xu ,  Ning-Hua Li ,  Chin-Mei Huang ,  Tsui-Chuan Wang

发明人： Ying-Fang Xu ,  Ning-Hua Li ,  Chin-Mei Huang ,  Tsui-Chuan Wang

IPC分类号： H05K1/00

CPC分类号： H05K1/0268 ,  H05K1/0393 ,  H05K3/0005 ,  H05K3/242 ,  H05K2203/175 ,  Y10T29/49155 ,  Y10T29/49156

摘要： The present invention discloses a flexible printed circuit (FPC) layout and a method thereof. The flexible printed circuit (FPC) layout method comprises steps of: providing a circuit board body; disposing at least an electroplating point on the circuit board body; disposing a plurality of solder pads on the circuit board body, the plurality of solder pads comprising at least a first solder pad and at least a second solder pad being connected respectively to the electroplating point through an internal wire, the first solder pad being further connected to an electroplating zone on the circuit board body through an external wire; performing an electroplating process from the electroplating zone through the external wire so that the external wire, the first solder pad connected to the external wire, the electroplating point connected through the internal wire to the first solder pad, and the second solder pad connected through the internal wire to the electroplating point are electroplated and electrically connected; and providing at least a via hole at the electroplating point on the circuit board body to form an open circuit between the first solder pad and the second solder pad. By using the disclosed method, the flexible printed circuit layout of the present invention can be formed.

摘要翻译： 本发明公开了一种柔性印刷电路（FPC）布局及其方法。 柔性印刷电路（FPC）布局方法包括以下步骤：提供电路板主体; 在电路板主体上设置至少一个电镀点; 在电路板主体上设置多个焊盘，所述多个焊盘至少包括第一焊盘和至少第二焊盘，其通过内部导线分别连接到电镀点，所述第一焊盘还被连接 通过外部电线连接到电路板主体上的电镀区; 通过外部电线从电镀区域进行电镀处理，使得外部电线，连接到外部电线的第一焊盘，通过内部电线连接到第一焊盘的电镀点，以及通过 电镀点的内部电线电镀并电连接; 以及在所述电路板主体上的所述电镀点处至少设置通孔，以在所述第一焊盘和所述第二焊盘之间形成开路。 通过使用所公开的方法，可以形成本发明的柔性印刷电路布局。