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公开(公告)号:US20120161914A1
公开(公告)日:2012-06-28
申请号:US13335377
申请日:2011-12-22
申请人: Hee Soo Yoon , Hee Soo Kim , Dong Jin Kim , Kyu Hwan Oh , Kyung Ho Lee , Kyoung Ho Lee , Su Bong Jang , Jeong Ho Yoon , Dong Hwan Lee
发明人: Hee Soo Yoon , Hee Soo Kim , Dong Jin Kim , Kyu Hwan Oh , Kyung Ho Lee , Kyoung Ho Lee , Su Bong Jang , Jeong Ho Yoon , Dong Hwan Lee
IPC分类号: H01F27/28
CPC分类号: H01F27/2804 , H01F2027/2809
摘要: There is provided a transformer having a minimized thickness. The transformer includes: insulating layers; and coil units including primary and secondary coils disposed on the insulating layers to have a common center.
摘要翻译: 提供了具有最小厚度的变压器。 变压器包括:绝缘层; 以及包括设置在绝缘层上以具有公共中心的初级和次级线圈的线圈单元。
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公开(公告)号:US20120081869A1
公开(公告)日:2012-04-05
申请号:US13251780
申请日:2011-10-03
申请人: Yoon Dong KIM , Hee Soo Yoon , Jong Lae Kim , Su Bong Jang , Dong Hwan Lee , Kyoung Ho Lee
发明人: Yoon Dong KIM , Hee Soo Yoon , Jong Lae Kim , Su Bong Jang , Dong Hwan Lee , Kyoung Ho Lee
摘要: There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced.
摘要翻译: 提供了一种用于减少串扰的印刷电路板,具有连接在信号和接地图案之间的电容性阻抗分量,印刷电路板包括:包括传输低频信号的第一信号图案和传送高频信号的第二信号图案的信号图案; 包括连接到第一信号图案的第一接地图案和连接到第二信号图案的彼此分离的第二接地图案的接地图案; 以及连接在第一和第二接地图案之间并且屏蔽从印刷电路板产生的电磁波的导电屏蔽膜。 因此,可以减小低频和高频信号之间的串扰。
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公开(公告)号:US20120289173A1
公开(公告)日:2012-11-15
申请号:US13444538
申请日:2012-04-11
申请人: Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
发明人: Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
CPC分类号: H01L23/48 , H01L2924/0002 , H01L2924/00
摘要: Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.
摘要翻译: 这里公开了多芯片模块在多个芯片之间发送和接收数据的接口。 多芯片模块的接口包括设置在芯片中并发送和接收数据的通信单元; 以及设置在芯片外部的无线电通信单元,将从通信单元发送的数据转换为无线电信号并无线发送无线电信号,并将从其他芯片接收的无线电信号解调为数据,并将数据发送到通信单元,由此 有线通信芯片可以实现无线电通信。
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公开(公告)号:US20120250267A1
公开(公告)日:2012-10-04
申请号:US13330625
申请日:2011-12-19
申请人: Dong Hwan Lee , Hee Soo Yoon , Su Bong Jang
发明人: Dong Hwan Lee , Hee Soo Yoon , Su Bong Jang
IPC分类号: H05K7/00
CPC分类号: H05K9/0022 , H05K9/0045
摘要: Disclosed herein is a radio frequency (RF) communication module. The RF communication module includes: a main substrate having a plurality of electronic components mounted on an upper surface thereof and having at least one ground pad formed at corners thereof; an insulating material encapsulating the electronic components mounted on the upper surface of the main substrate and having a metal layer formed on an upper surface thereof; and a side shielding layer formed on a side of the insulating material.
摘要翻译: 本文公开了射频(RF)通信模块。 RF通信模块包括:主基板,其具有安装在其上表面上的多个电子部件,并且在其角部具有至少一个接地焊盘; 绝缘材料,其封装安装在所述主基板的上表面上并具有形成在其上表面上的金属层的电子部件; 以及形成在绝缘材料的侧面上的侧面屏蔽层。
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公开(公告)号:US20130169075A1
公开(公告)日:2013-07-04
申请号:US13531213
申请日:2012-06-22
申请人: Sang Jong Lee , Han Kyung Bae , Hee Soo Yoon , Su Bong Jang
发明人: Sang Jong Lee , Han Kyung Bae , Hee Soo Yoon , Su Bong Jang
IPC分类号: H02K19/06
CPC分类号: H02K19/103 , H02K2213/03
摘要: Disclosed herein is a switched reluctance motor including: a rotor part including a rotor core and rotor poles each formed to be protruded from the rotor core; and a stator part including a stator yoke rotatably receiving the rotor part therein and stator salient poles each formed to be protruded from the stator yoke so as to face the rotor poles, wherein a ratio of the number of stator salient poles to the number of rotor poles is (6×n+9):((6×n+9)+1) or (6×n+9):((6×n+9)−1), (n=0, 1, 2 . . . ), (where n=0, 1, 2 . . . ).
摘要翻译: 本发明公开了一种开关磁阻电动机,包括:转子部分,其包括转子芯和转子磁极,每个转子磁极都形成为从转子芯突出; 以及定子部,其包括可转动地容纳所述转子部的定子磁轭和从所述定子磁轭突出而与所述转子磁极相对的定子凸极,所述定子磁极的数量与所述转子的数量成比例 (6×n + 9):((6×n + 9)+1)或(6×n + 9):((6×n + 9)-1),(n = ...),(其中n = 0,1,2 ...)。
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公开(公告)号:US20130171013A1
公开(公告)日:2013-07-04
申请号:US13440961
申请日:2012-04-05
申请人: Su Bong Jang , Han Kyung Bae , Hee Soo Yoon , Chang Hwan Park , Sang Jong Lee , Young Bok Yoon , Jin Su Seok
发明人: Su Bong Jang , Han Kyung Bae , Hee Soo Yoon , Chang Hwan Park , Sang Jong Lee , Young Bok Yoon , Jin Su Seok
IPC分类号: F04D25/06
摘要: Disclosed herein is a motor assembly for a vacuum cleaner, the motor assembly including: an inlet introducing air therethrough; a motor; an impeller installed on a shaft of the motor and including a plurality of blades disposed at predetermined intervals between a pair of plates facing each other so that it rotates by the motor to suck the air; a diffuser disposed at an outer side of a discharge hole formed at an edge of the impeller; a first fan including a plurality of blade parts disposed at predetermined intervals while having the shaft as a concentric axis and disposed beneath the diffuser; and an outlet discharging the air to the outside.
摘要翻译: 本文公开了一种用于真空吸尘器的马达组件,该马达组件包括:引入空气的入口; 电机 安装在所述电动机的轴上的叶轮,并且包括以彼此相对的一对板之间的预定间隔设置的多个叶片,使得其由所述电动机旋转以吸入空气; 扩散器,设置在形成在叶轮的边缘处的排出孔的外侧; 第一风扇,其包括以预定间隔设置的多个叶片部件,同时具有轴作为同心轴并且设置在扩散器下方; 以及将空气排出到外部的出口。
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公开(公告)号:US20130169082A1
公开(公告)日:2013-07-04
申请号:US13439532
申请日:2012-04-04
申请人: Su Bong Jang , Han Kyung Bae , Hee Soo Yoon , Jin Su Seok , Sang Jong Lee , Young Bok Yoon , Tae Ho Yun
发明人: Su Bong Jang , Han Kyung Bae , Hee Soo Yoon , Jin Su Seok , Sang Jong Lee , Young Bok Yoon , Tae Ho Yun
IPC分类号: H02K9/06
CPC分类号: H02K29/06 , F04D17/16 , F04D25/0606 , F04D29/4226 , F04D29/5813 , H02K7/14 , H02K11/0094
摘要: Disclosed herein is a fan motor assembly. A motor includes a rotor unit and a stator unit. An impeller is provided on an upper end of a motor shaft of the motor. The impeller is rotated by the motor to suck air. The impeller includes a pair of plates that face each other, and a plurality of blades that are disposed between the plates at positions spaced apart from each other at regular intervals. A diffuser is disposed around an outlet formed in a periphery of the impeller. A motor housing encases the rotor unit and the stator unit therein. A sensing unit is provided on a lower end of the motor shaft that extends outwards from the motor housing. The sensing unit senses the rotation of the rotor unit. An inductor is installed in the motor housing.
摘要翻译: 这里公开了一种风扇马达组件。 电动机包括转子单元和定子单元。 在电动机的电动机轴的上端设有叶轮。 叶轮由电机旋转以吸入空气。 叶轮包括彼此面对的一对板,以及以规则的间隔彼此间隔开的位置设置在板之间的多个叶片。 扩散器设置在形成在叶轮周边的出口周围。 电动机壳体将转子单元和定子单元包围在其中。 感测单元设置在从电动机壳体向外延伸的电动机轴的下端。 感测单元感测转子单元的旋转。 电感器安装在电机外壳中。
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公开(公告)号:US07663892B2
公开(公告)日:2010-02-16
申请号:US11449408
申请日:2006-06-07
申请人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号: H05K1/18
CPC分类号: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
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公开(公告)号:US07843702B2
公开(公告)日:2010-11-30
申请号:US12437042
申请日:2009-05-07
申请人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号: H05K1/18
CPC分类号: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
摘要翻译: 这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。 具体地说,本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板,其中在多层有线电路板的电源平面上限定或形成用于电阻器,焊道或电感器的端子焊盘, 将电阻器,焊道或电感器连接到电源平面,并且电阻器,焊道或电感器通过使用通孔或通过嵌入电阻器,焊道或电感器而与去耦电容器并联连接 垂直于电源平面,从而减小RF模块的尺寸并提高其性能。
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公开(公告)号:US20090268419A1
公开(公告)日:2009-10-29
申请号:US12436996
申请日:2009-05-07
申请人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人: Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号: H05K7/12
CPC分类号: H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
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