公开(公告)号：US08277251B2

公开(公告)日：2012-10-02

申请号：US12586151

申请日：2009-09-16

申请人： Heng Liu ,  Xian-Kui Shi ,  Yi Zhou ,  Chung-Yen Yang

发明人： Heng Liu ,  Xian-Kui Shi ,  Yi Zhou ,  Chung-Yen Yang

IPC分类号： H01R13/648

CPC分类号： H01R13/504 ,  H01R13/514 ,  H01R13/659 ,  H01R13/6595 ,  H01R27/02

摘要： An electrical connector assembly (100) includes a case (1) defining a chamber therein; a connector (2) received in the chamber, the connector having a metallic shell (22); a printed circuit board (23) enclosed in the case, the printed circuit board having main portion and side portion laterally projecting from the main portion, the side portion having a conductive layer (230) on a top surface thereof, and a hole (231) defined in the side portion through the conductive layer, the hole further aligning with a through hole defined in the case; and the metallic shell of the connector soldered to the main portion of the printed circuit board.

摘要翻译： 电连接器组件（100）包括在其中限定腔室的壳体（1） 连接器（2），容纳在所述腔室中，所述连接器具有金属壳体（22）; 封装在所述壳体中的印刷电路板（23），所述印刷电路板具有从所述主体侧向突出的主要部分和侧部，所述侧部在其顶表面上具有导电层（230），以及孔（231 ），所述孔通过所述导电层限定在所述侧部中，所述孔进一步与所述壳体中限定的通孔对准; 并且连接器的金属外壳焊接到印刷电路板的主要部分。

公开(公告)号：US20100075544A1

公开(公告)日：2010-03-25

申请号：US12586151

申请日：2009-09-16

申请人： Heng Liu ,  Xian-Kui Shi ,  Yi Zhou ,  Chung-Yen Yang

发明人： Heng Liu ,  Xian-Kui Shi ,  Yi Zhou ,  Chung-Yen Yang

IPC分类号： H01R13/514

CPC分类号： H01R13/504 ,  H01R13/514 ,  H01R13/659 ,  H01R13/6595 ,  H01R27/02

摘要： An electrical connector assembly (100) includes a case (1) defining a chamber therein; a connector (2) received in the chamber, the connector having a metallic shell (22); a printed circuit board (23) enclosed in the case, the printed circuit board having main portion and side portion laterally projecting from the main portion, the side portion having a conductive layer (230) on a top surface thereof, and a hole (231) defined in the side portion through the conductive layer, the hole further aligning with a through hole defined in the case; and the metallic shell of the connector soldered to the main portion of the printed circuit board.

摘要翻译： 电连接器组件（100）包括在其中限定腔室的壳体（1） 连接器（2），容纳在所述腔室中，所述连接器具有金属壳体（22）; 封装在所述壳体中的印刷电路板（23），所述印刷电路板具有从所述主体侧向突出的主要部分和侧部，所述侧部在其顶表面上具有导电层（230），以及孔（231 ），所述孔通过所述导电层限定在所述侧部中，所述孔进一步与所述壳体中限定的通孔对准; 并且连接器的金属外壳焊接到印刷电路板的主要部分。

公开(公告)号：US20110143593A1

公开(公告)日：2011-06-16

申请号：US12968299

申请日：2010-12-15

申请人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

发明人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

IPC分类号： H01R13/648

CPC分类号： H01R13/6583 ,  H01R13/506 ,  H01R13/518 ,  H01R13/6594 ,  H01R13/6596 ,  H01R13/6658

摘要： A connector assembly (100) includes an insulative cover (11, 12) defining an interior and an exterior, and the insulative cover having at least one platform (18) disposed outside of the interior thereof; a printed circuit board (3) located in the interior of the insulative cover; at least one connector (2) mounted to the printed circuit board; and a conductive member (4) fixed to the insulative cover, said conductive member (4) including a main body (41), an arm (42) extending forwardly from the main body and a spring finger (43) formed at a front edge of the arm, the main body supported by the platform, the spring finger contacting the printed circuit board.

摘要翻译： 连接器组件（100）包括限定内部和外部的绝缘盖（11,12），并且所述绝缘盖具有设置在其内部的至少一个平台（18）; 位于绝缘盖内部的印刷电路板（3）; 安装到印刷电路板的至少一个连接器（2） 以及固定到所述绝缘盖的导电构件（4），所述导电构件（4）包括主体（41），从主体向前延伸的臂（42）和形成在前边缘处的弹簧指 的臂，主体由平台支撑，弹簧指接触印刷电路板。

公开(公告)号：US08221160B2

公开(公告)日：2012-07-17

申请号：US12968299

申请日：2010-12-15

申请人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

发明人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

IPC分类号： H01R13/60

CPC分类号： H01R13/6583 ,  H01R13/506 ,  H01R13/518 ,  H01R13/6594 ,  H01R13/6596 ,  H01R13/6658

摘要： A connector assembly (100) includes an insulative cover (11, 12) defining an interior and an exterior, and the insulative cover having at least one platform (18) disposed outside of the interior thereof; a printed circuit board (3) located in the interior of the insulative cover; at least one connector (2) mounted to the printed circuit board; and a conductive member (4) fixed to the insulative cover, said conductive member (4) including a main body (41), an arm (42) extending forwardly from the main body and a spring finger (43) formed at a front edge of the arm, the main body supported by the platform, the spring finger contacting the printed circuit board.

摘要翻译： 连接器组件（100）包括限定内部和外部的绝缘盖（11,12），并且所述绝缘盖具有设置在其内部的至少一个平台（18）; 位于绝缘盖内部的印刷电路板（3）; 安装到印刷电路板的至少一个连接器（2） 以及固定到所述绝缘盖的导电构件（4），所述导电构件（4）包括主体（41），从主体向前延伸的臂（42）和形成在前边缘处的弹簧指 的臂，主体由平台支撑，弹簧指接触印刷电路板。

公开(公告)号：US08430692B2

公开(公告)日：2013-04-30

申请号：US12943032

申请日：2010-11-10

申请人： Fei-Yan Peng ,  Xian-Kui Shi ,  Heng Liu ,  Chung-Yen Yang

发明人： Fei-Yan Peng ,  Xian-Kui Shi ,  Heng Liu ,  Chung-Yen Yang

IPC分类号： H01R13/648

CPC分类号： H01R13/518 ,  H01R13/6594 ,  H01R13/6658

摘要： A cable assembly (100) includes an insulative cover (11, 12) defining at least one groove with a front opening; a connector (20) accommodated in the groove, the connector (20) having a terminal module (21) and a metallic shell (22) enclosing the terminal module; a cable (5) electrically coupled to the terminal module of the connector; a printed circuit board (3) received in the insulative cover and electrically connected to the metallic shell of the connector; and a conductive member (4) having a main body (41) fixed to the insulative cover, a connecting portion (42) extending forwardly from the main body and a griping portion (43) formed on a front segment of the connecting portion and griping the printed circuit board to electrically connected with the metallic shell of the connector.

摘要翻译： 电缆组件（100）包括限定具有前开口的至少一个凹槽的绝缘盖（11,12） 容纳在所述槽中的连接器（20），所述连接器（20）具有封闭所述端子模块的端子模块（21）和金属壳体（22） 电缆（5），电连接到连接器的端子模块; 印刷电路板（3），其容纳在绝缘盖中并电连接到连接器的金属壳; 以及导电构件（4），其具有固定到所述绝缘盖的主体（41），从所述主体向前延伸的连接部分（42）和形成在所述连接部分的前部段上的抓握部分（43） 印刷电路板与连接器的金属外壳电连接。

公开(公告)号：US08011961B2

公开(公告)日：2011-09-06

申请号：US12579424

申请日：2009-10-15

申请人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

发明人： Heng Liu ,  Xian-Kui Shi ,  Chung-Yen Yang

IPC分类号： H01R13/649

CPC分类号： H01R13/514 ,  H01R4/64 ,  H01R13/506 ,  H01R13/6582 ,  H01R13/73

摘要： A cable assembly comprises an insulative housing defining a first and second receiving room therein, and a mounting platform disposed at one side of the insulative housing. A first and second electrical connectors are respectively received into the first and second receiving rooms, the first electrical connector defines a metallic shell. At least one cable is electrically connected with the first and second electrical connectors. And a grounding piece is assembled to the mounting platform of the insulative housing and has a contacting arm received into the first receiving room and electrically contacted with the metallic shell of the first electrical connector.

摘要翻译： 电缆组件包括在其中限定第一和第二接收室的绝缘壳体和设置在绝缘壳体的一侧的安装平台。 第一和第二电连接器分别容纳在第一和第二接收室中，第一电连接器限定金属外壳。 至少一根电缆与第一和第二电连接器电连接。 并且将接地片组装到绝缘壳体的安装平台上，并且具有容纳在第一容纳室中并与第一电连接器的金属壳电接触的接触臂。

公开(公告)号：US20140175738A1

公开(公告)日：2014-06-26

申请号：US13884268

申请日：2012-07-09

申请人： Heng Liu ,  Dong Tan ,  En Wu ,  Fa Ran

发明人： Heng Liu ,  Dong Tan ,  En Wu ,  Fa Ran

IPC分类号： B65H5/00 ,  B65H7/06 ,  B65H9/00

CPC分类号： B65H5/00 ,  B65H5/008 ,  B65H7/06 ,  B65H9/004 ,  B65H29/40 ,  B65H29/52 ,  B65H31/02 ,  B65H31/20 ,  B65H31/34 ,  B65H31/38 ,  B65H2301/4212 ,  B65H2301/4213 ,  B65H2403/512 ,  B65H2403/514 ,  B65H2403/52 ,  B65H2404/7414 ,  B65H2404/742 ,  B65H2511/222 ,  B65H2511/413 ,  B65H2701/1912 ,  G07D11/0021 ,  B65H2220/01 ,  B65H2220/02 ,  B65H2220/11

摘要： Disclosed in the present invention is a sheet-type medium stacking and guiding device, also disclosed in the present invention are a control system and a method based on the same. The device comprises: a left limiting plate (14) and/or a right limiting plate (19), which locate at the outer end of a medium passage made up of a left and a right passage plate (301, 304); a driving mechanism (25), which is in transmission connection with the limiting plates and drives the limiting plates to move along the longitudinal direction of the medium. The system comprises a central control module (901), a detection module (902), a data processing module (903), an image acquisition module (904), a storage module (905) and an execution module (906). The method comprises: identifying the species of the medium to be arranged; querying the property of the medium to be arranged, obtaining the length value of the medium; calculating and outputting the servo signal for the executing component of the driving mechanism, driving the limiting plates to move to a predetermined position along the longitudinal direction of the medium. The medium arranging range can be increased by adjusting the position of the limiting plates to meet the requirements of the stacking medium with different lengths.

摘要翻译： 在本发明中公开了一种片式介质堆叠引导装置，其也在本发明中公开了一种控制系统及其方法。 该装置包括：位于由左右通道板（301,304）构成的介质通道的外端的左限位板（14）和/或右限位板（19）; 驱动机构（25），其与限位板传输连接并驱动限位板沿着介质的纵向方向移动。 该系统包括中央控制模块（901），检测模块（902），数据处理模块（903），图像采集模块（904），存储模块（905）和执行模块（906）。 该方法包括：识别要排列的介质的种类; 查询要布置的介质的属性，获取介质的长度值; 计算并输出用于驱动机构的执行部件的伺服信号，驱动限位板沿着介质的纵向方向移动到预定位置。 可以通过调整限位板的位置来满足不同长度的堆叠介质的要求来增加介质布置范围。

公开(公告)号：US08574936B2

公开(公告)日：2013-11-05

申请号：US13116765

申请日：2011-05-26

申请人： Ray-Hua Horng ,  Yi-An Lu ,  Heng Liu

发明人： Ray-Hua Horng ,  Yi-An Lu ,  Heng Liu

IPC分类号： H01L27/15 ,  H01L33/22 ,  H01L33/06

CPC分类号： H01L27/153 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the light emitting unit contacts the temporary substrate, and the light emitting unit includes a n-type layer, an active region, and a p-type layer; (c) forming a n-electrode on the n-type layer; (d) forming a p-electrode on the p-type layer; (e) bonding a permanent substrate on the light emitting unit, the n-electrode and the p-electrode; (f) removing the temporary substrate to expose the light emitting unit; and (g) etching the exposed light emitting unit, to expose at least one of the n-electrode and the p-electrode.

摘要翻译： 一种制造半导体发光器件的方法包括：（a）提供临时衬底; （b）在所述临时衬底上形成具有至少一个发光单元的多层LED外延结构，其中所述发光单元的第一表面接触所述临时衬底，并且所述发光单元包括n型层 ，有源区和p型层; （c）在n型层上形成n电极; （d）在p型层上形成p电极; （e）在发光单元，n电极和p电极上键合永久性基板; （f）去除临时衬底以露出发光单元; 和（g）蚀刻暴露的发光单元，以暴露n电极和p电极中的至少一个。

公开(公告)号：US08546829B2

公开(公告)日：2013-10-01

申请号：US13185845

申请日：2011-07-19

申请人： Ray-Hua Horng ,  Heng Liu ,  Yi-An Lu

发明人： Ray-Hua Horng ,  Heng Liu ,  Yi-An Lu

IPC分类号： H01L33/00

CPC分类号： H01L33/0079 ,  H01L33/22 ,  H01L33/38 ,  H01L33/46 ,  H01L33/641

摘要： A semiconductor light emitting device and a method for making the semiconductor light emitting device are described. The semiconductor light emitting device includes an epitaxial structure having a first type doped layer, a light emitting layer, and a second type doped layer. The epitaxial structure may further include an undoped layer. A substrate is bonded to at least one surface of the epitaxial structure with an adhesive layer. One or more posts are located in the adhesive layer. The posts may have different widths depending on the location of the posts and/or the posts may only be located under certain portions of the epitaxial structure.

摘要翻译： 对半导体发光元件及半导体发光元件的制造方法进行说明。 半导体发光器件包括具有第一类型掺杂层，发光层和第二类型掺杂层的外延结构。 外延结构还可以包括未掺杂的层。 用粘合剂层将衬底结合到外延结构的至少一个表面。 一个或多个柱位于粘合剂层中。 柱可以具有不同的宽度，这取决于柱的位置和/或柱可以仅位于外延结构的特定部分之下。

公开(公告)号：US08502239B2

公开(公告)日：2013-08-06

申请号：US11272366

申请日：2005-11-10

申请人： Heng Liu

发明人： Heng Liu

IPC分类号： H01L33/00

CPC分类号： H01L33/24 ,  F21L4/027 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode chip having a substantially transparent substrate and having an aspect ratio, which defines an elongated geometry provides enhanced efficiency and brightness. Method for forming and operating the same are also disclosed.

摘要翻译： 具有基本上透明的基板并且具有限定细长几何形状的纵横比的发光二极管芯片提供增强的效率和亮度。 还公开了其形成和操作方法。