摘要:
The present invention relates to a flame-retardant adhesive composition comprising a reactive polyurethane prepolymer, in particular a one-component flame-retardant adhesive composition, and to the use of the adhesive composition for the structural bonding of wood substrates.
摘要:
The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.
摘要:
The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.
摘要:
The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.
摘要:
Cross-linkable foamable composition with low content of monomeric isocyanates, containing a pre-polymer of polyester diols and/or polyether dials reacted i) with asymmetric aromatic diisocyanates to form a reaction product with OH and NCO groups, ii) subsequent addition of and reaction with symmetric aromatic diisocyanate in a quantity at least equivalent to the available OH-groups, 0.1 to 30 wt % additives, at least one propellant, wherein the polyols have a molar mass (MN) of less than 5000 g/mol, and the reaction product has a content of less than 0.1 wt % monomeric asymmetric isocyanate and less than 2 wt % monomeric symmetric isocyanate.
摘要:
The present invention is directed to a method for detaching two substrates bonded by an adhesive, in particular by treating with a debonding agent. In addition, the present invention relates to the use of the method in recycling parts of the electronic devices. The method comprises the steps of: (1) treating two substrates bonded by an adhesive with a debonding agent comprising acetone and/or oleic acid at a temperature from 20° C. to 90° C., and (2) removing the substrates from the adhesive.
摘要:
A reactive hot melt adhesive comprising a blend of a (meth)acrylate polymer, a polyurethane polymer containing (meth)acrylate groups and a polyurethane prepolymer containing NCO-groups wherein the content of low molecular weight (meth)acrylate urethanes is less than 1 wt % of the adhesive. The adhesive provides a fast and improved green strength during application.
摘要:
A solvent-free moisture-curing polyurethane hot-melt adhesive composition, in which the adhesive comprises the following components: 20 to 85 wt % of a polyurethane prepolymer with free isocyanate groups produced from at least one polyol from the group of polyether polyols, polyester polyols, polyalkylene polyols and mixtures thereof with an excess of at least one polyisocyanate, the prepolymer having a monomeric diisocyanate content of below 1 wt %, 4 to 40 wt % of at least one acrylate copolymer with a molecular weight of below 60,000 g/mol, 3 to 35 wt % of a thermoplastic polyester with a number-average molecular weight (MN) of below 6000 g/mol, which comprises fewer than 1.4 NCO-reactive groups, and 0 to 25 wt % of at least one additive from the group of catalysts, resins, plasticizers, fillers, pigments, stabilizers or adhesion promoters, the sum of the constituents being equal to 100 wt %.
摘要:
A reactive melt adhesive containing 30 to 70% of at least one prepolymer having at least two isocyanate groups having a molecular weight below 6000 g/mol, manufactured from polyether polyols and/or polyester polyols reacted with a molar excess of diisocyanates, the prepolymer containing less than 1% monomeric diisocyanate; 30 to 70 wt % of a thermoplastic polyester having a number-average molecular weight (MN) below 6000 g/mol, which comprises fewer than 1.4 groups reactive with NCO; and up to 30 wt % additives from the group of the catalysts, resins, plasticizers, fillers, pigments, stabilizers, or adhesion promoters.
摘要:
The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty polyurethane composition comprising at least one polyisocyanate resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty polyurethane composition has a viscosity factor (1.5/15) of at least 2 at application temperature.