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公开(公告)号：US20220212418A1
公开(公告)日：2022-07-07
申请号：US17453588
申请日：2021-11-04
发明人： Sina Chaeichian , Kaspar Schaerer , Ruairi O'Kane , Li Li , Michael D. Halbasch , Martin Renkel , Omar L. Abu-Shanab , Brian Deegan , Anna Esmeralda Javier
IPC分类号： B29C65/00
摘要： This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.
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公开(公告)号：US20210284881A1
公开(公告)日：2021-09-16
申请号：US17150939
申请日：2021-01-15
发明人： Ruairi O'Kane , Li Li , Adam Meng , William F. Torres , Nicholas O. Dominguez , Martin Renkel
IPC分类号： C09J163/00 , C08F220/06 , C08K3/013 , C08F2/50
摘要： The present disclosure provides two part, room-temperature curable hybrid epoxy/(meth)acrylate compositions, comprising: (a) a first component, comprising (meth)acrylate monomers, crosslinkers, epoxy curatives, and optional free radical accelerator, tougheners, fillers and additives, and inhibitors; and (b) a second component, comprising epoxy resins, methacrylate free radical initiators, and optional tougheners, fillers and additives. The compositions provide among other advantageous properties fast cure rate, extremely high compression properties, and good thermal cycling performance.
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公开(公告)号：US20220056227A1
公开(公告)日：2022-02-24
申请号：US17453539
申请日：2021-11-04
发明人： Sina Chaeichian , Kaspar Schaerer , Bashir M. Ahmed , Omar L. Abu-Shanab , Michael D. Halbasch , Tsehaye N. Eyassu , Martin Renkel , Ruairi O'Kane , Anna Esmeralda Javier
摘要： This disclosure is directed to methods for preparing thermoplastic surfaces suitable for the application of paint, adhesives, or surfacing films and the structures derived or derivable from these methods. The disclosure is also directed to composite structures comprising a thermoplastic substrate comprising a chemical sealant direct bonded to a surface thereof, the chemical sealant providing a surface suitable for adhering adhesives, paints, and/or surfacing films to the thermoplastic surfaces.
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公开(公告)号：US09209105B2
公开(公告)日：2015-12-08
申请号：US14267579
申请日：2014-05-01
CPC分类号： H01L23/36 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： Provided herein are electronic devices assembled with thermally insulating layers.
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公开(公告)号：US20140239481A1
公开(公告)日：2014-08-28
申请号：US14267579
申请日：2014-05-01
IPC分类号： H01L23/36
CPC分类号： H01L23/36 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： Provided herein are electronic devices assembled with thermally insulating layers.
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公开(公告)号：US10066134B2
公开(公告)日：2018-09-04
申请号：US14050940
申请日：2013-10-10
申请人： HENKEL AG & CO. KGAA
IPC分类号： B29C43/12 , B29C43/20 , B29C45/16 , B29C70/44 , B29C70/46 , B29C70/48 , C08J5/04 , C08J5/24 , C08G18/40 , C08G59/40 , C08K7/14 , C09J5/06 , C09J163/00 , C09J175/04 , B29K105/06 , B29L31/30
CPC分类号： C09J163/00 , B29C43/12 , B29C43/203 , B29C45/1671 , B29C70/443 , B29C70/46 , B29C70/48 , B29K2105/06 , B29L2031/3041 , C08G18/4045 , C08G59/4021 , C08J5/043 , C08J5/24 , C08K7/14 , C08L75/04 , C09J5/06 , C09J175/04 , C09J2463/00 , C09J2475/00 , Y10T428/31511
摘要： A fiber composite material obtainable by (a) mixing the components of a multi-component agent immediately before use, wherein component A of the multi-component agent contains at least one compound having two or more isocyanate groups, component B of the multi-component agent contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, and at least one of the components of the multi-component agent contains at least one epoxide prepolymer, (b) introducing the resulting application preparation into a mold in which fibers and optionally further additives are present, the resulting mixture containing at least one latent hardener for epoxide prepolymers, (c) pre-curing the resulting mixture at a temperature from 5° C. to 90° C., and (d) then finally curing the pre-cured fiber composite material at temperatures from 100° C. to 240° C., wherein the fiber composite material being removed from the mold after step (c) or step (d).
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公开(公告)号：US20150064380A1
公开(公告)日：2015-03-05
申请号：US14491034
申请日：2014-09-19
申请人： HENKEL AG & CO. KGaA
IPC分类号： C08J9/00
CPC分类号： C08J9/0085 , C08G59/226 , C08G59/36 , C08G59/38 , C08J9/0028 , C08J9/0061 , C08J9/0066 , C08J9/32 , C08J2203/22 , C08J2207/00 , C08J2363/00 , C08J2463/00 , C08J2477/10 , C08K3/013 , C08K7/02 , C08L63/00 , C08L2205/02 , Y10T428/1376
摘要： The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
摘要翻译： 本申请的主题是可以在低于70℃的应用温度下泵送的热可膨胀制剂，其包含（a）至少一种环氧当量为至多280g / eq的第一环氧树脂E1和 在25℃下的粘度至多为1250Pa·s，（b）至少一种环氧当量为至少300g / eq，粘度至多为250Pa * s的第二环氧树脂E2为25 （c）可以热活化的至少一种硬化剂，（d）至少一种能够被热活化的推进剂，和（e）至少1wt。 ％纤维长度为0.2mm至10mm的有机纤维。
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公开(公告)号：US09828534B2
公开(公告)日：2017-11-28
申请号：US14051509
申请日：2013-10-11
申请人： HENKEL AG & CO. KGAA
IPC分类号： C09J163/00 , C09J175/04 , C08L75/04 , C08L63/00 , C08G59/40 , C08G18/40 , C09J5/06 , C08J5/24 , C08J5/04 , C08K7/14
CPC分类号： C09J163/00 , B29C43/12 , B29C43/203 , B29C45/1671 , B29C70/443 , B29C70/46 , B29C70/48 , B29K2105/06 , B29L2031/3041 , C08G18/4045 , C08G59/4021 , C08J5/043 , C08J5/24 , C08K7/14 , C08L75/04 , C09J5/06 , C09J175/04 , C09J2463/00 , C09J2475/00 , Y10T428/31511
摘要： The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.
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公开(公告)号：US09790341B2
公开(公告)日：2017-10-17
申请号：US14491034
申请日：2014-09-19
申请人： HENKEL AG & CO. KGaA
IPC分类号： B29D22/00 , B05D7/22 , C08G18/08 , C08G59/00 , C08J9/00 , C08G59/22 , C08G59/38 , C08K7/02 , C08G59/36 , C08L63/00 , C08K3/00
CPC分类号： C08J9/0085 , C08G59/226 , C08G59/36 , C08G59/38 , C08J9/0028 , C08J9/0061 , C08J9/0066 , C08J9/32 , C08J2203/22 , C08J2207/00 , C08J2363/00 , C08J2463/00 , C08J2477/10 , C08K3/013 , C08K7/02 , C08L63/00 , C08L2205/02 , Y10T428/1376
摘要： The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
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