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公开(公告)号：US5213886A
公开(公告)日：1993-05-25
申请号：US902219
申请日：1992-06-22
申请人： Herbert S. Chao , Robert E. Colborn , James R. Presley , Jana M. Whalen , Michael J. Davis , James E. Tracy , Edward F. Chu
发明人： Herbert S. Chao , Robert E. Colborn , James R. Presley , Jana M. Whalen , Michael J. Davis , James E. Tracy , Edward F. Chu
CPC分类号： C08L63/00 , C08G59/681 , C08L71/123 , H05K1/0326 , Y10S428/901 , Y10T428/24917 , Y10T428/2964 , Y10T442/2475 , Y10T442/2566 , Y10T442/2713
摘要： Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
摘要翻译： 可固化组合物含有低分子量聚苯醚和含有溴化和非溴化双酚多缩水甘油醚的聚环氧化物组合物，以及包括特定催化剂的其它组分。 所述组合物优选不含用于环氧树脂的硬化剂。 它们可用于制备可用于制造多层印刷电路组件并且具有优异的物理和电学性质的粘合片材。
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公开(公告)号：US5162450A
公开(公告)日：1992-11-10
申请号：US460430
申请日：1990-01-03
申请人： Herbert S. Chao , Robert E. Colborn , James R. Presley , Jana M. Whalen , Michael J. Davis , James E. Tracy , Edward F. Chu
发明人： Herbert S. Chao , Robert E. Colborn , James R. Presley , Jana M. Whalen , Michael J. Davis , James E. Tracy , Edward F. Chu
CPC分类号： C08L63/00 , C08G59/681 , C08L71/123 , H05K1/0326
摘要： Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
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公开(公告)号：US5580493A
公开(公告)日：1996-12-03
申请号：US471876
申请日：1995-06-07
IPC分类号： C08K3/00 , C08K3/04 , C08L23/04 , C08L23/06 , C08L23/08 , H01B1/12 , H01B1/20 , H01B1/22 , H01B1/24 , H01C7/02 , H01M2/34 , H01M4/66 , H01M6/50 , H01M10/30 , H01M10/42 , H01M10/48 , C08L33/08
CPC分类号： H01M10/48 , C08L23/0869 , H01B1/12 , H01B1/20 , H01B1/22 , H01B1/24 , H01C7/027 , H01M10/42 , H01M10/425 , H01M2/348 , H01M4/668 , C08L2203/202 , C08L23/06 , H01M2200/106 , H01M2200/20 , Y10T428/31504
摘要： A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.
摘要翻译： 包含分散在聚合物组分中的颗粒状导电填料的导电聚合物组合物。 聚合物组分包含第一聚合物，其中（i）以总聚合物组分的25至75重量％的量存在，和（ii）是聚乙烯，和第二聚合物，其中（i）以25至 75重量％的总聚合物组分，和（ii）包含衍生自作为乙烯的第一单体的单元和具有式-CH 2 = CHCOOC m H 2 m + 1的丙烯酸烷基酯的第二单体，其中m至少为4。 所得组合物可用于制备电气装置，例如 电路保护装置，其具有比包含常规导电聚合物组合物的装置更低的电阻率，更高的PTC异常以及更好的热和电稳定性。
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公开(公告)号：US5451919A
公开(公告)日：1995-09-19
申请号：US85859
申请日：1993-06-29
申请人： Edward F. Chu , Ann Banich , Robert Ives , Steven Sunshine , Chi-Ming Chan
发明人： Edward F. Chu , Ann Banich , Robert Ives , Steven Sunshine , Chi-Ming Chan
摘要： A conductive polymer composition which has a resistivity of less than 10 ohm-cm and which exhibits PTC behavior comprises a polymeric component and a particulate conductive filler. The polymeric component comprises a first crystalline fluorinated polymer having a first melting point T.sub.m1 and a second crystalline fluorinated polymer having a second melting point T.sub.m2 which is from (T.sub.m1 +25).degree. C. to (T.sub.m1 +100).degree. C. The composition exhibits one of a number of characteristics, including a relatively high PTC anomaly. The composition is useful in circuit protection devices to be used at high ambient conditions.
摘要翻译： 导电聚合物组合物具有小于10欧姆 - 厘米的电阻率并且表现为PTC行为的导电聚合物组合物包括聚合物组分和颗粒状导电填料。 聚合物组分包括具有第一熔点Tm1的第一结晶氟化聚合物和具有（Tm1 + 25）℃至（Tm1 + 100）℃的第二熔点Tm2的第二结晶氟化聚合物。该组合物显示 其中一个特点之一，包括相对较高的PTC异常。 该组合物可用于在高环境条件下使用的电路保护装置。
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公开(公告)号：US5250228A
公开(公告)日：1993-10-05
申请号：US788655
申请日：1991-11-06
申请人： Stephen Baigrie , Edward F. Chu , George B. Park , Vijay N. Reddy , James A. Rinde , Robert P. Saltman
发明人： Stephen Baigrie , Edward F. Chu , George B. Park , Vijay N. Reddy , James A. Rinde , Robert P. Saltman
摘要： A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.
摘要翻译： 一种导电聚合物组合物，其中颗粒状导电填料分散在聚合物组分中，聚合物组分是基本上无定形的热塑性树脂和热固性树脂的混合物。 在优选的组合物中，无定形热塑性树脂和热固性树脂基本上是相互溶解的。 为了提高组合物暴露于连续热循环的热稳定性，优选通过以至少15℃的速度加热无定形热塑性树脂，热固性树脂和颗粒状导电填料的未固化混合物来固化组合物 C. /分钟到治愈温度。
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公开(公告)号：US06306323B1
公开(公告)日：2001-10-23
申请号：US08891757
申请日：1997-07-14
申请人： Edward F. Chu , Susan M. Jordan , John Lahlouh
发明人： Edward F. Chu , Susan M. Jordan , John Lahlouh
IPC分类号： B29C4772
CPC分类号： B29C47/367 , B29C47/0014 , B29C47/0021 , B29C47/364 , B29C47/38 , B29C47/92 , B29C2947/92019 , B29C2947/9238 , B29C2947/9239 , B29C2947/92514 , B29C2947/92809 , B29C2947/92876 , B29C2947/92885
摘要： Processes and apparatus for melt extrusion of polymeric compositions, particularly conductive polymers, in which a gear pump delivers molten polymeric composition to an extrusion orifice. Overfeeding of the composition due to pressure variations is avoided by means of a polymer relief means, preferably a second, smaller gear pump, which removes a portion of the molten composition when the pressure exceeds a selected level.
摘要翻译： 用于熔融挤出聚合物组合物，特别是导电聚合物的方法和设备，其中齿轮泵将熔融聚合物组合物输送到挤出孔。 通过聚合物释放装置，优选第二较小的齿轮泵避免由于压力变化引起的组合物的过度进料，当压力超过所选择的水平时，其移除熔融组合物的一部分。
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公开(公告)号：US06104587A
公开(公告)日：2000-08-15
申请号：US900887
申请日：1997-07-25
申请人： Ann Banich , Edward F. Chu
发明人： Ann Banich , Edward F. Chu
CPC分类号： H01L27/0248 , H01C1/1406 , H01C7/027
摘要： An electrical device which includes a resistive element which exhibits PTC behavior, is composed of a conductive polymer composition, has a planar shape with first and second major surfaces, and has a thickness of at most 0.64 mm . The resistive element is sandwiched between first and second metal foil electrodes, at least one of which has a thickness of at least 0.055 mm, so that the ratio of the resistive element thickness to electrode thickness is 1:1 to 16:1. The device can be used as a circuit protection device in an electrical circuit.
摘要翻译： 包括具有PTC性能的电阻元件的电气装置由导电聚合物组合物构成，具有第一和第二主表面的平面形状，并且具有至多0.64mm的厚度。 电阻元件夹在第一和第二金属箔电极之间，其中至少一个具有至少0.055mm的厚度，使得电阻元件厚度与电极厚度之比为1:1至16:1。 该装置可以用作电路中的电路保护装置。
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公开(公告)号：US5801612A
公开(公告)日：1998-09-01
申请号：US910865
申请日：1997-08-13
CPC分类号： H01M2/348 , H01C7/027 , H01C7/13 , H01M2/34 , H01M2200/106
摘要： A circuit protection device for protecting batteries is formed from a resistive element composed of a PTC conductive polymer composition and two electrodes. The device has a resistive element thickness of 0.025 to 0.20 mm; a crosslinking level equivalent to 1 to 20 Mrads; a surface area of at most 120 mm.sup.2 ; a resistance at 20.degree. C., R.sub.20, of at most 0.030 ohm; and a resistivity at 20.degree. C., .rho..sub.20, of at most 2.0 ohm-cm. Devices of the invention are sufficiently small to be easily inserted into an assembly comprising a battery, particularly a rechargeable battery, and the device. Such assemblies are used for powering portable electronic equipment such as cellular telephones.
摘要翻译： 用于保护电池的电路保护装置由由PTC导电聚合物组合物和两个电极构成的电阻元件形成。 该器件的电阻元件厚度为0.025至0.20mm; 交联水平相当于1至20Mrad; 表面积至多120mm2; 在20℃，R20，最高为0.030欧姆的电阻; 并且在20℃，rho 20处的电阻率最大为2.0ohm-cm。 本发明的装置足够小以便容易地插入到包括电池，特别是可充电电池和装置的组件中。 这样的组件用于为诸如蜂窝电话的便携式电子设备供电。
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公开(公告)号：US5582770A
公开(公告)日：1996-12-10
申请号：US255497
申请日：1994-06-08
IPC分类号： C08K3/00 , C08K3/04 , C08L23/04 , C08L23/06 , C08L23/08 , H01B1/12 , H01B1/20 , H01B1/22 , H01B1/24 , H01C7/02 , H01M2/34 , H01M4/66 , H01M6/50 , H01M10/30 , H01M10/42 , H01M10/48 , C08L33/08
CPC分类号： H01M10/48 , C08L23/0869 , H01B1/12 , H01B1/20 , H01B1/22 , H01B1/24 , H01C7/027 , H01M10/42 , H01M10/425 , H01M2/348 , H01M4/668 , C08L2203/202 , C08L23/06 , H01M2200/106 , H01M2200/20 , Y10T428/31504
摘要： A conductive polymer composition containing a particulate conductive filler dispersed in a polymeric component. The polymeric component comprises a first polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) is polyethylene, and a second polymer which (i) is present in an amount 25 to 75% by weight of the total polymeric component, and (ii) comprises units derived from a first monomer which is ethylene and a second monomer which is an alkyl acrylate having the formula --CH.sub.2 .dbd.CHCOOC.sub.m H.sub.2m+1 --, where m is at least 4. The resulting composition is useful in preparing electrical devices, e.g. circuit protection devices, which have lower resistivities, higher PTC anomalies, and better thermal and electrical stability than devices comprising conventional conductive polymer compositions.
摘要翻译： 一种含有分散在聚合物组分中的颗粒状导电填料的导电聚合物组合物。 聚合物组分包含第一聚合物，其中（i）以总聚合物组分的25至75重量％的量存在，和（ii）是聚乙烯，和第二聚合物，其中（i）以25至 75重量％的总聚合物组分，和（ii）包含衍生自乙烯的第一单体的单元和具有式-CH 2 = CHCOOC m H 2 m + 1的丙烯酸烷基酯的第二单体，其中m为至少4 所得组合物可用于制备电气装置，例如 电路保护装置，其具有比包含常规导电聚合物组合物的装置更低的电阻率，更高的PTC异常以及更好的热和电稳定性。
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公开(公告)号：US5382384A
公开(公告)日：1995-01-17
申请号：US85698
申请日：1993-06-29
申请人： Stephen Baigrie , Edward F. Chu , George B. Park , Vijay N. Reddy , James A. Rinde , Robert P. Saltman
发明人： Stephen Baigrie , Edward F. Chu , George B. Park , Vijay N. Reddy , James A. Rinde , Robert P. Saltman
摘要： A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.
摘要翻译： 一种导电聚合物组合物，其中颗粒状导电填料在基本上无定形的热塑性树脂和热固性树脂的混合物的聚合物组分中破裂。 在优选的组合物中，无定形热塑性树脂和热固性树脂基本相互溶解。 为了提高组合物暴露于连续热循环的热稳定性，优选通过以至少15℃的速度加热无定形热塑性树脂，热固性树脂和颗粒状导电填料的未固化混合物来固化组合物 C. /分钟到治愈温度。
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