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公开(公告)号:US07977632B2
公开(公告)日:2011-07-12
申请号:US12253476
申请日:2008-10-17
申请人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
发明人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
IPC分类号: G21K7/00
CPC分类号: H01J37/28 , H01J37/026 , H01J2237/0045 , H01J2237/0048 , H01J2237/04735 , H01J2237/04756 , H01J2237/281 , H01J2237/31701
摘要: To make it possible to observe the bottom of a contact hole and internal wires, in observation of the contact hole 102, by scanning it at a predetermined acceleration voltage, the positive charge 106 is formed on the surface of the insulator 101, and the secondary electrons 104 are attracted in the hole by this electric field, and the hole is continuously scanned at an acceleration voltage different from the acceleration voltage, and the sample is observed. When the wires embedded in the insulator are to be observed, by observing the insulator at a predetermined acceleration voltage, an electron beam is allowed to enter the sample, and the sample is continuously scanned at an acceleration voltage different from the acceleration voltage, and hence the existence of wires is reflected as a change in the charge of the surface, and it is observed. In either case, the acceleration voltage before observation is different from the one during observation, and the sample surface is temporarily radiated at an acceleration voltage positively generating a positive or negative charge, and thereafter, the acceleration voltage is returned to a one suited to observation, and the sample is observed.
摘要翻译: 为了可以观察接触孔和内部电线的底部,在观察接触孔102时,通过以预定的加速电压扫描,正电荷106形成在绝缘体101的表面上,次级 电子104通过该电场被吸引在孔中,并且以与加速电压不同的加速电压连续地扫描孔,并且观察样品。 当要观察嵌入在绝缘体中的电线时,通过以预定的加速电压观察绝缘体,允许电子束进入样品,并且以不同于加速电压的加速电压连续扫描样品,因此 电线的存在被反映为表面电荷的变化,并且被观察。 在任一种情况下,观察前的加速电压与观察期间的加速电压不同,并且以正向或正负电荷的正电荷的加速电压暂时照射样品表面,然后将加速电压恢复为适合于观察的加速电压 ,并观察样品。
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公开(公告)号:US06635873B1
公开(公告)日:2003-10-21
申请号:US09477060
申请日:2000-01-03
申请人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
发明人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
IPC分类号: H01J3700
CPC分类号: H01J37/28 , H01J37/026 , H01J2237/0045 , H01J2237/0048 , H01J2237/04735 , H01J2237/04756 , H01J2237/281 , H01J2237/31701
摘要: A scanning electron microscope scans a sample using an accelerated electron beam, detects secondary electrons generated from the sample or reflected electrons or both of them, and forms images. After radiating the sample with the electron beam at a first acceleration voltage so as to charge the surface of the sample, where the electron beam is radiated at a predetermined potential, images are observed by scanning the charged sample surface at a second acceleration voltage different from the first acceleration voltage.
摘要翻译: 扫描电子显微镜使用加速电子束扫描样品,检测从样品产生的二次电子或反射的电子,或者二者形成图像。 在第一加速电压下用电子束照射样品以对电子束以预定电位辐射的样品的表面进行充电,通过以不同于第一加速电压的第二加速电压扫描带电样品表面来观察图像 第一加速电压。
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公开(公告)号:US07442923B2
公开(公告)日:2008-10-28
申请号:US11282645
申请日:2005-11-21
申请人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
发明人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
CPC分类号: H01J37/28 , H01J37/026 , H01J2237/0045 , H01J2237/0048 , H01J2237/04735 , H01J2237/04756 , H01J2237/281 , H01J2237/31701
摘要: To make it possible to observe the bottom of a contact hole and internal wires, in observation of the contact hole 102, by scanning it at a predetermined acceleration voltage, the positive charge 106 is formed on the surface of the insulator 101, and the secondary electrons 104 are attracted in the hole by this electric field, and the hole is continuously scanned at an acceleration voltage different from the acceleration voltage, and the sample is observed. When the wires embedded in the insulator are to be observed, by observing the insulator at a predetermined acceleration voltage, an electron beam is allowed to enter the sample, and the sample is continuously scanned at an acceleration voltage different from the acceleration voltage, and hence the existence of wires is reflected as a change in the charge of the surface, and it is observed. In either case, the acceleration voltage before observation is different from the one during observation, and the sample surface is temporarily radiated at an acceleration voltage positively generating a positive or negative charge, and thereafter, the acceleration voltage is returned to a one suited to observation, and the sample is observed.
摘要翻译: 为了可以观察接触孔和内部电线的底部,在观察接触孔102时,通过以预定的加速电压扫描,正电荷106形成在绝缘体101的表面上,次级 电子104通过该电场被吸引在孔中,并且以与加速电压不同的加速电压连续地扫描孔,并且观察样品。 当要观察嵌入在绝缘体中的电线时,通过以预定的加速电压观察绝缘体,允许电子束进入样品,并且以不同于加速电压的加速电压连续扫描样品,因此 电线的存在被反映为表面电荷的变化,并且被观察。 在任一种情况下,观察前的加速电压与观察期间的加速电压不同,并且以正向或正负电荷的正电荷的加速电压暂时照射样品表面,然后将加速电压恢复为适合于观察的加速电压 ,并观察样品。
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公开(公告)号:US20060071167A1
公开(公告)日:2006-04-06
申请号:US11282645
申请日:2005-11-21
申请人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
发明人: Hideo Todokoro , Makoto Ezumi , Yasutsugu Usami
IPC分类号: G21K7/00
CPC分类号: H01J37/28 , H01J37/026 , H01J2237/0045 , H01J2237/0048 , H01J2237/04735 , H01J2237/04756 , H01J2237/281 , H01J2237/31701
摘要: To make it possible to observe the bottom of a contact hole and internal wires, in observation of the contact hole 102, by scanning it at a predetermined acceleration voltage, the positive charge 106 is formed on the surface of the insulator 101, and the secondary electrons 104 are attracted in the hole by this electric field, and the hole is continuously scanned at an acceleration voltage different from the acceleration voltage, and the sample is observed. When the wires embedded in the insulator are to be observed, by observing the insulator at a predetermined acceleration voltage, an electron beam is allowed to enter the sample, and the sample is continuously scanned at an acceleration voltage different from the acceleration voltage, and hence the existence of wires is reflected as a change in the charge of the surface, and it is observed. In either case, the acceleration voltage before observation is different from the one during observation, and the sample surface is temporarily radiated at an acceleration voltage positively generating a positive or negative charge, and thereafter, the acceleration voltage is returned to a one suited to observation, and the sample is observed.
摘要翻译: 为了可以观察接触孔和内部电线的底部,在观察接触孔102时,通过以预定的加速电压扫描,正电荷106形成在绝缘体101的表面上,次级 电子104通过该电场被吸引在孔中,并且以与加速电压不同的加速电压连续地扫描孔,并且观察样品。 当要观察嵌入在绝缘体中的电线时,通过以预定的加速电压观察绝缘体,允许电子束进入样品,并且以不同于加速电压的加速电压连续扫描样品,因此 电线的存在被反映为表面电荷的变化,并且被观察。 在任一种情况下,观察前的加速电压与观察期间的加速电压不同,并且以正向或正负电荷的正电荷的加速电压暂时照射样品表面,然后将加速电压恢复为适合于观察的加速电压 ,并观察样品。
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5.
公开(公告)号:US08604430B2
公开(公告)日:2013-12-10
申请号:US13366874
申请日:2012-02-06
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: The inspection apparatus disclosed generates an electron beam, an acceleration electrode accelerates the electron beam, a convergence lens converges the electron beam, an electron beam deflector scans the beam over a sample, an objective lens converges the electron beam on the sample, a detector located between the sample and the objective lens detects charged particles emitted from the sample, a power supply applies a retarding voltage to the sample for decelerating the electron beam to the sample, an electrode is disposed between the objective lens and the sample, and a voltage is generated between the sample and the electrode by said electrode, the voltage being determined depending on the sample. The apparatus solves problems encountered in conventional inspection systems.
摘要翻译: 所公开的检查装置产生电子束,加速电极加速电子束,会聚透镜会聚电子束,电子束偏转器扫描样品上的光束,物镜会将电子束会聚在样品上,检测器位于 在样品和物镜之间检测从样品发射的带电粒子,电源向样品施加延迟电压以将电子束减速到样品,电极设置在物镜和样品之间,电压为 通过所述电极在样品和电极之间产生,电压根据样品确定。 该装置解决了常规检测系统遇到的问题。
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公开(公告)号:US07012252B2
公开(公告)日:2006-03-14
申请号:US11108877
申请日:2005-04-19
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
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7.
公开(公告)号:US20090057556A1
公开(公告)日:2009-03-05
申请号:US12211343
申请日:2008-09-16
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: G01N23/00
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译: 通过提供新颖的检查方法和采用这种新方法的检测装置,本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置,该方法能够提高扫描样本的速度 作为半导体晶片。 本发明提供的检验新颖方法包括以下步骤:产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子,并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。
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公开(公告)号:US06987265B2
公开(公告)日:2006-01-17
申请号:US10083481
申请日:2002-02-27
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
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9.
公开(公告)号:US06512227B2
公开(公告)日:2003-01-28
申请号:US09982965
申请日:2001-10-22
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Atsuko Takafuji , Hiroshi Toyama , Katsuya Sugiyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Atsuko Takafuji , Hiroshi Toyama , Katsuya Sugiyama
IPC分类号: G01N2300
CPC分类号: H01J37/28 , G01N23/04 , H01J2237/2817
摘要: An object of the present invention is to provide an inspection method using an electron beam and an inspection apparatus therefor, which are capable of enhancing the resolution, improving the inspection speed and reliability, and realizing miniaturization the apparatus. To achieve the above object, according to the present invention, there is provided an inspection method using an electron beam, including the steps of; applying a voltage on a sample via a sample stage; converging an electron beam on the sample; scanning the sample with the converged electron beam and simultaneously, continuously moving the sample stage; detecting charged particles generated from the sample; and detecting a defect on the sample on the basis of the detected charged particles; wherein a distance between the sample and the shield frame is determined on the basis of a critical discharge between the sample stage and the shield frame; coils of at least hexapoles for correcting the shape of an electron beam are provided; the electron beam is deflected for blanking during movement of the sample with the crossover of the electron beam taken as a fulcrum of blanking; or the magnitude of the voltage applied to the sample may be determined depending on the kind of sample.
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10.
公开(公告)号:US20120132801A1
公开(公告)日:2012-05-31
申请号:US13366874
申请日:2012-02-06
申请人: Yuko IWABUCHI , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko IWABUCHI , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
摘要翻译: 通过提供新颖的检查方法和采用这种新方法的检测装置,本发明通过使用电子束的本发明解决了常规检查方法中遇到的问题和采用该方法的传统装置,该方法能够提高扫描样本的速度 作为半导体晶片。 本发明提供的检验新颖方法包括以下步骤:产生电子束; 通过使用物镜将生成的电子束会聚在样品上; 使用会聚电子束扫描样品; 扫描期间连续移动样品; 检测在样本和物镜之间的位置处从样本发出的带电粒子,并将检测到的带电粒子转换成电信号; 存储由电信号传送的图像信息; 通过使用所存储的图像信息将图像与另一图像进行比较; 并检测样本的缺陷。
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