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公开(公告)号：US06225606B1
公开(公告)日：2001-05-01
申请号：US09222223
申请日：1998-12-29
IPC分类号： H05B368
CPC分类号： H05B3/74 , H05B3/283 , H05B2203/014
摘要： A ceramic heater includes a ceramic substrate having a heating surface, and a resistance heating element buried inside the ceramic substrate, wherein at least a part of the resistance heating element is constituted by a conductive network member, and a ceramic material constituting the ceramic substrate is filled in meshes of the network member.
摘要翻译： 陶瓷加热器包括具有加热面的陶瓷基板和埋在陶瓷基板内的电阻加热元件，其中电阻加热元件的至少一部分由导电网络构件构成，构成陶瓷基板的陶瓷材料为 填充网络成员的网格。
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2.发明授权Ceramic susceptor with embedded metal electrode and brazing material connection 失效陶瓷感受器带有嵌入式金属电极和钎焊材料连接
公开(公告)号：US5817406A
公开(公告)日：1998-10-06
申请号：US591333
申请日：1996-01-24
申请人： David W. Cheung , Mark A. Fodor , Christopher Lane , Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： David W. Cheung , Mark A. Fodor , Christopher Lane , Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： C23C16/458 , H01L21/683 , H05B6/10 , B32B3/00
CPC分类号： C23C16/4586 , H01L21/6831 , Y10T428/24926
摘要： A ceramic susceptor with an embedded metal electrode. The metal electrode has multiple apertures, and the ceramic material is cross-linked through the apertures. An electrical connection to the electrode protects the electrode from the environment in the processing chamber. The ceramic may be aluminum nitride, and the metal electrode may be a mesh of molybdenum wires. To form the electrical connection, the susceptor may be heated until an eutectic forms between a conductive connector and the metal electrode. Alternately, a brazing material may be placed between the metal layer and a conductive connector.
摘要翻译： 具有嵌入式金属电极的陶瓷感受体。 金属电极具有多个孔，陶瓷材料通过孔交联。 与电极的电连接保护电极免受处理室中的环境的影响。 陶瓷可以是氮化铝，金属电极可以是钼丝网。 为了形成电连接，基座可以被加热直到在导电连接器和金属电极之间形成共晶体。 或者，钎焊材料可以放置在金属层和导电连接器之间。
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公开(公告)号：US5794838A
公开(公告)日：1998-08-18
申请号：US679286
申请日：1996-07-12
IPC分类号： C04B37/00 , C04B37/02 , B23K31/02 , B23K103/16
CPC分类号： C04B37/006 , C04B37/026 , C04B2237/08 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/126 , C04B2237/127 , C04B2237/343 , C04B2237/366 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/592 , C04B2237/62 , C04B2237/72 , C04B2237/76 , C04B2237/80 , C04B2237/84 , C04B2237/86
摘要： Novel method of joining ceramics containing aluminum nitride and another member made of a metal or a ceramic is provided having an improved joining strength and a corrosion-resistant property by joining a first member made of a ceramics consisting of an aluminum compound. The second member is made of a ceramics or a metal, forming a metal film directly on a surface to be joined of the first member interposing a metallic joining material which is made of a different material from the metal film. The metallic joining material is between the metal film and the second member, and by heating at least the metallic joining material and the metal film in such an interposed state to form a joining layer made of the metallic joining material and an intermetallic compound between the first and second members, so as to join the two members.
摘要翻译： 通过将由铝化合物构成的陶瓷构成的第一构件接合，提供了接合含有氮化铝的陶瓷和由金属或陶瓷制成的另一构件的新型方法，其具有改善的接合强度和耐腐蚀性。 第二构件由陶瓷或金属制成，在第一构件的待接合表面上直接形成金属膜，该金属接合材料由与金属膜不同的材料制成。 金属接合材料在金属膜和第二构件之间，并且通过在这种插入状态下至少加热金属接合材料和金属膜，以形成由金属接合材料制成的接合层和金属间化合物 和第二名成员，以加入两个成员。
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公开(公告)号：US5995357A
公开(公告)日：1999-11-30
申请号：US13045
申请日：1998-01-26
IPC分类号： H01L21/683 , H01R13/24 , H02N13/00
CPC分类号： H01J37/32577 , H01R13/24
摘要： A ceramic member-electric power supply connector coupling structure includes a ceramic member with a hole and is provided with a metallic member therein so as to be partially exposed to the hole. An electric power supply connector and a tubular atmosphere-shielding member are provided in the hole. Further, a stress-mitigating, low heat expansion conductor is provided inside the atmosphere-shielding member and the power supply connector is partially positioned therein. The atmosphere-shielding member is gas-tightly joined to the power supply connector, and the expansion conductor and the tubular atmosphere-shielding member are joined to the metallic member. The coupling structure has high heat and corrosion resistance, high joining strength, and remains highly conductive even at high temperature conditions in an oxidative or corrosive environment.
摘要翻译： 陶瓷构件 - 电源连接器联接结构包括具有孔的陶瓷构件，并且在其中设置有金属构件以部分地暴露于孔。 电源连接器和管状气氛屏蔽部件设置在孔中。 此外，在气氛屏蔽部件内部设置有减轻应力的低热膨胀导体，电源连接器部分地位于其中。 气密屏蔽构件气密地接合到电源连接器，并且膨胀导体和管状气氛屏蔽构件接合到金属构件。 连接结构具有高耐热腐蚀性，接合强度高，即使在氧化或腐蚀性环境的高温条件下也能保持高导电性。
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公开(公告)号：US06617514B1
公开(公告)日：2003-09-09
申请号：US09095157
申请日：1998-06-10
IPC分类号： H01R400
CPC分类号： H01L21/6833
摘要： The disclosed ceramics joint structure, in which a ceramics member having an oxidation resistance property and a metal member are joined via a joint layer, has a structure such that a part of the embedded member is exposed to a joint surface of the ceramics member, which is contacted with the joint layer to form a metal exposing portion, and the ceramics member and the metal exposing portion are joined via the joint layer to the metal member respectively. Moreover, the joint layer is mainly made of one or more metal selected from the group consisting of gold, platinum and palladium.
摘要翻译： 所公开的具有耐氧化性的陶瓷构件和金属构件的陶瓷接头结构通过接合层接合，具有使嵌入构件的一部分暴露于陶瓷构件的接合面的结构， 与接合层接触以形成金属暴露部分，并且陶瓷构件和金属暴露部分分别经由接合层接合到金属构件。 此外，接合层主要由选自金，铂和钯的一种或多种金属制成。
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6.发明授权Joint structure of metal member and ceramic member and method of producing the same 失效金属构件和陶瓷构件的接合结构及其制造方法
公开(公告)号：US6057513A
公开(公告)日：2000-05-02
申请号：US13199
申请日：1998-01-26
IPC分类号： C04B37/02 , H01L21/683 , H05K1/16
CPC分类号： H01L21/6833 , Y10T279/23 , Y10T29/49149
摘要： A joint structure having a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, in which an electrically conductive joint layer is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film having a given wettability by the electrically conductive joint layer is formed on at least a part of the side wall face of the metal member.
摘要翻译： 一种具有金属构件和陶瓷构件的接合结构，其具有用于容纳至少一部分金属构件的容纳孔，其中在金属构件的底面和底面之间形成导电接合层 在金属构件的侧壁面的至少一部分上形成有由导电性接合层赋予润湿性的膜的容纳孔和膜。
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公开(公告)号：US07022947B2
公开(公告)日：2006-04-04
申请号：US10884294
申请日：2004-07-02
IPC分类号： F27B5/14
CPC分类号： H01L21/67103 , F27B17/0025 , F27D5/0037 , H05B3/143
摘要： A support structure for supporting a ceramic susceptor in a chamber is provided. The support structure includes a supporting portion joined with a back face of the ceramic susceptor. The supporting portion includes an inner space that is separated from the atmosphere of the chamber. A cooling system is provided below the supporting portion 6. At least one thermal control portion is provided between the cooling system and the supporting portion for reducing thermal conduction from the susceptor to the cooling system.
摘要翻译： 提供了用于在腔室中支撑陶瓷基座的支撑结构。 支撑结构包括与陶瓷基座的后表面连接的支撑部分。 支撑部分包括与腔室的气氛分离的内部空间。 冷却系统设置在支撑部分6的下方。至少一个热控制部分设置在冷却系统和支撑部分之间，用于减少从基座到冷却系统的热传导。
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公开(公告)号：US20050006374A1
公开(公告)日：2005-01-13
申请号：US10884294
申请日：2004-07-02
IPC分类号： H05B3/06 , F27B17/00 , F27D5/00 , H01L21/00 , H01L21/02 , H01L21/683 , H05B3/14 , H05B3/74 , F27D11/00 , H05B3/68
CPC分类号： H01L21/67103 , F27B17/0025 , F27D5/0037 , H05B3/143
摘要： An object of the present invention is to provide a practical and low-cost method of reducing cold spots generated on the heating face of a ceramic susceptor and the temperature distribution on the heating face when the supporting portion is joined with the susceptor at the back face and is fitted to a chamber through a cooling system. A supporting portion 6 is joined with the back face of a ceramic susceptor. An inner space 6f separated from atmosphere in a chamber is formed. A cooling system is provided between the supporting portion 6 and chamber. Thermal control portions 12A and 12B are provided between the cooling system and supporting body 6 for reducing thermal conduction from the susceptor to the cooling system.
摘要翻译： 本发明的目的是提供一种实用且低成本的方法，当将支撑部分与基座在背面接合时，减少在陶瓷基座的加热面上产生的冷点和加热面上的温度分布 并通过冷却系统安装到腔室。 支撑部6与陶瓷基座的背面接合。 形成与室内的气氛分离的内部空间6f。 在支撑部分6和室之间设置冷却系统。 热控制部12A和12B设置在冷却系统和支撑体6之间，用于减少从基座到冷却系统的热传导。
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公开(公告)号：US06608745B2
公开(公告)日：2003-08-19
申请号：US09756555
申请日：2001-01-08
IPC分类号： H02N1300
CPC分类号： H01L21/6833
摘要： An electrostatic chuck includes a chuck body, an insulating layer formed on a surface of the chuck body and having an installation surface on which a wafer is to be installed, an inner electrode installed inside the insulating-layer, and projections projecting from the installation surface and having contact surfaces to which the wafer is to contact. A back side gas is flown into a space defined by the installation surface, the projections and the wafer, heat is supplied to the wafer, and heat of the wafer is conducted to the electrostatic chuck through the projections and the back side gas. The total area of the contact surfaces of the projections is not more than 1% of the area of the inner electrode, and the height of the projections are not less than 1 &mgr;m and not more than 10 &mgr;m.
摘要翻译： 静电卡盘包括卡盘主体，形成在卡盘主体的表面上并具有安装表面的绝缘层，安装在其上的晶片的安装表面，安装在绝缘层内部的内部电极和从安装表面突出的突起 并具有与晶片接触的接触表面。 背面气体流入由安装表面，突起和晶片限定的空间中，将热量供应到晶片，并且通过突起和背侧气体将晶片的热量传导到静电卡盘。 突起的接触表面的总面积不大于内部电极的面积的1％，突起的高度不小于1mum且不大于10um。
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公开(公告)号：US07582184B2
公开(公告)日：2009-09-01
申请号：US11361177
申请日：2006-02-24
IPC分类号： H01L21/3065 , C23C16/50 , C23C16/503 , C23C16/509 , C23C16/46
CPC分类号： H01J37/32532 , H01J37/32009 , H01J37/32577 , H01J2237/0206
摘要： A plasma processing member includes a ceramic base, a plasma generating electrode embedded in the ceramic base, and an electrode power supply member connected to the plasma generating electrode. The impedance of the plasma processing member when plasma is generated using high frequency power at a frequency higher than 13.56 MHz is adjusted to 25Ω or less.
摘要翻译： 等离子体处理部件包括陶瓷基体，嵌入在陶瓷基体中的等离子体产生电极以及与等离子体产生电极连接的电极电源部件。 当使用高于13.56MHz的频率的高频功率产生等离子体时的等离子体处理部件的阻抗被调整为25Om以下。
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