利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

98 条记录 (耗时 0.024 秒)

    Method and apparatus for sputtering onto large flat panels
    1.
    发明授权
    Method and apparatus for sputtering onto large flat panels 有权
    用于溅射到大平板上的方法和装置

    公开(公告)号：US08500975B2

    公开(公告)日：2013-08-06

    申请号：US11484333

    申请日：2006-07-11

    申请人： Hien Minh Huu Le ,  Akihiro Hosokawa ,  Avi Tepman

    发明人： Hien Minh Huu Le ,  Akihiro Hosokawa ,  Avi Tepman

    IPC分类号： C25B9/00 ,  C25B11/00 ,  C25B13/00 ,  C23C14/00

    CPC分类号： C23C14/35 ,  H01J37/3408 ,  H01J37/3455

    摘要： A rectangular magnetron placed at the back of a rectangular sputtering target for coating a rectangular panel and having magnets of opposed polarities arranged to form a gap therebetween corresponding to a plasma track adjacent the target which extends in a closed serpentine or spiral loop. The spiral may have a large number of wraps and the closed loop may be folded before wrapping. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100 mm for a 2 m target corresponding to at least the separation of the gap between parallel portions of the loop. A central ferromagnetic shim beneath some magnets in the loop may compensate for vertical droop. The magnetron may be scanned in two alternating double-Z patterns rotated 90° between them.

    摘要翻译： 放置在矩形溅射靶的背面的矩形磁控管，用于涂覆矩形面板并且具有相对极性的磁体，所述磁体布置成在对应于邻近靶的等离子体轨道之间形成间隙，所述等离子体轨道以闭合的蛇形或螺旋形环路延伸。 螺旋可以具有大量的包装，并且闭合的环可以在包装之前折叠。 磁控管的尺寸仅稍低于目标的尺寸，并且在目标的两个垂直方向上扫描，对于对应于至少间隙间隔的2m靶的扫描长度例如为约100mm 在环路的平行部分之间。 环路中一些磁铁下方的中心铁磁垫片可以补偿垂直下垂。 磁控管可以以它们之间旋转90°的两个交替的双Z图案进行扫描。

    Ganged scanning of multiple magnetrons, especially two level folded magnetrons
    2.
    发明授权
    Ganged scanning of multiple magnetrons, especially two level folded magnetrons 有权
    组合扫描多个磁控管，特别是两个级别的磁控管

    公开(公告)号：US08961756B2

    公开(公告)日：2015-02-24

    申请号：US11780757

    申请日：2007-07-20

    申请人： Makoto Inagawa ,  Hien Minh Huu Le ,  Akihiro Hosokawa ,  Bradley O. Stimson ,  John M. White

    发明人： Makoto Inagawa ,  Hien Minh Huu Le ,  Akihiro Hosokawa ,  Bradley O. Stimson ,  John M. White

    IPC分类号： C23C14/35 ,  H01J37/34

    CPC分类号： H01J37/3408 ,  H01J37/3455

    摘要： A magnetron assembly including one or more magnetrons each forming a closed plasma loop on the sputtering face of the target. The target may include multiple strip targets on which respective strip magnetrons roll and are partially supported on a common support plate through a spring mechanism. The strip magnetron may be a two-level folded magnetron in which each magnetron forms a folded plasma loop extending between lateral sides of the strip target and its ends meet in the middle of the target. The magnets forming the magnetron may be arranged in a pattern having generally uniform straight portions joined by curved portion in which extra magnet positions are available near the corners to steer the plasma track. Multiple magnetrons, possibly flexible, may be resiliently supported on a scanned support plate and individually partially supported by rollers on the back of one or more targets.

    摘要翻译： 磁控管组件包括一个或多个磁控管，每个磁控管在靶的溅射面上形成封闭的等离子体环。 目标可以包括多个条带目标，相应的带状磁控管在其上滚动并且通过弹簧机构部分地支撑在公共支撑板上。 带状磁控管可以是两级折叠​​磁控管，其中每个磁控管形成在条带靶的侧面之间延伸的折叠等离子体环，并且其端部在目标的中间相遇。 形成磁控管的磁体可以布置成具有通过弯曲部分连接的具有大致均匀的直线部分的图案，其中在角附近提供额外的磁体位置以引导等离子体轨道。 多个可能是柔性的磁控管可以弹性地支撑在扫描的支撑板上，并且单独部分地由一个或多个靶的背面上的辊支撑。

    Bonding of target tiles to backing plate with patterned bonding agent
    3.
    发明授权
    Bonding of target tiles to backing plate with patterned bonding agent 失效
    目标瓦片与带有图案化粘合剂的背板接合

    公开(公告)号：US07644745B2

    公开(公告)日：2010-01-12

    申请号：US11146763

    申请日：2005-06-06

    申请人： Hien-Minh Huu Le ,  Akihiro Hosokawa

    发明人： Hien-Minh Huu Le ,  Akihiro Hosokawa

    IPC分类号： C23C14/35

    CPC分类号： C23C14/3407 ,  H01J37/3435 ,  Y10T29/49856 ,  Y10T29/49863 ,  Y10T29/49865 ,  Y10T29/49885

    摘要： A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.

    摘要翻译： 包括通过粘合剂（例如铟或导电聚合物）粘合到背板的多个目标瓦片的目标组件填充到形成在每个目标瓦片下方的背板中的凹部中。 形成为矩形紧密带的唯一周边凹部可以形成在瓷砖周边内。 可以在周边凹部内部形成附加的凹槽，优选地围绕矩形瓦片的垂直平分线对称地布置。 可以改变凹部的深度和宽度以控制应力和应力方向的量。

    Multiple target tiles with complementary beveled edges forming a slanted gap therebetween
    4.
    发明授权
    Multiple target tiles with complementary beveled edges forming a slanted gap therebetween 有权
    具有互补的倾斜边缘的多个目标瓦片在它们之间形成倾斜的间隙

    公开(公告)号：US07316763B2

    公开(公告)日：2008-01-08

    申请号：US11137262

    申请日：2005-05-24

    申请人： Akihiro Hosokawa ,  Hien-Minh Huu Le

    发明人： Akihiro Hosokawa ,  Hien-Minh Huu Le

    IPC分类号： C23C14/35

    CPC分类号： C23C14/3407

    摘要： A target assembly composed of multiple target tiles bonded in an array to a backing plate of another material. The edges of the tile within the interior of the array are formed with complementary beveled edges to form slanted gaps between the tiles. The gaps may slant at an angle of between 10° and 55°, preferably 15° and 45°, with respect to the target normal. The facing sides of tiles may be roughened by bead blasting, for both perpendicular and sloping gaps. The area of the backing plate underlying the gap may be roughened or may coated or overlain with a region of the material of the target, for both perpendicular and sloping gaps.

    摘要翻译： 由多个靶阵列组成的目标组件，其以阵列的形式结合到另一材料的背板上。 在阵列内部的瓦片的边缘形成有互补的斜边以在瓦片之间形成倾斜的间隙。 间隙可以相对于目标法线在10°至55°之间，优选15°和45°的角度倾斜。 对于垂直和倾斜的间隙，瓷砖的面对侧可以通过珠粒喷砂粗糙化。 对于垂直和倾斜的间隙，在间隙下面的背板的区域可以被粗糙化或者可以涂覆或覆盖靶材料的区域。

    Sputtering target tiles having structured edges separated by a gap
    5.
    发明申请
    Sputtering target tiles having structured edges separated by a gap 审中-公开
    具有由间隙分隔的结构化边缘的溅射靶砖

    公开(公告)号：US20060266639A1

    公开(公告)日：2006-11-30

    申请号：US11414016

    申请日：2006-04-28

    申请人： Hien-Minh Huu Le ,  Bradley Stimson ,  Akihiro Hosokawa

    发明人： Hien-Minh Huu Le ,  Bradley Stimson ,  Akihiro Hosokawa

    IPC分类号： C23C14/32 ,  C23C14/00

    CPC分类号： C23C14/3407 ,  H01J37/3423 ,  H01J37/3435 ,  H01J37/3491

    摘要： A target assembly composed of multiple target tiles bonded in an array to a backing plate of another material. The edges of the tile within the interior of the array are formed with complementary structure edges to form a gap between the tiles having at least a portion that is inclined to the target normal. The gap may be simply beveled and slant at an angle of between 10° and 55°, preferably 15° and 50°, with respect to the target normal or they may be convolute with one portion horizontal or otherwise inclined to prevent a line of sight from the bottom to top. The area of the backing plate underlying the gap may be coated or overlain with a foil of the material of the target, for both perpendicular and sloping gaps, and have a polymeric foil adjacent an elastomeric bonding layer to exclude bonding material from the gap.

    摘要翻译： 由多个靶阵列组成的目标组件，其以阵列的形式结合到另一材料的背板上。 在阵列内部的瓦片的边缘形成有互补的结构边缘，以在具有至少一部分倾斜于目标法线的瓦片之间形成间隙。 间隙可以简单地倾斜并相对于目标法线倾斜10°至55°，优选15°和50°之间的角度，或者它们可以与一部分水平或以其它方式倾斜以防止视线 从下到上。 在间隙下面的背板的区域可以对于垂直和倾斜的间隙进行涂覆或覆盖靶的材料的箔，并且具有邻近弹性体粘结层的聚合物箔，以从间隙排除粘合材料。

    Method and apparatus for sputtering onto large flat panels
    6.
    发明申请
    Method and apparatus for sputtering onto large flat panels 有权
    用于溅射到大平板上的方法和装置

    公开(公告)号：US20070012562A1

    公开(公告)日：2007-01-18

    申请号：US11484333

    申请日：2006-07-11

    申请人： Hien Minh Le ,  Akihiro Hosokawa ,  Avi Tepman

    发明人： Hien Minh Le ,  Akihiro Hosokawa ,  Avi Tepman

    IPC分类号： C23C14/00 ,  C23C14/32

    CPC分类号： C23C14/35 ,  H01J37/3408 ,  H01J37/3455

    摘要： A rectangular magnetron placed at the back of a rectangular sputtering target for coating a rectangular panel and having magnets of opposed polarities arranged to form a gap therebetween corresponding to a plasma track adjacent the target which extends in a closed serpentine or spiral loop. The spiral may have a large number of wraps and the closed loop may be folded before wrapping. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100 mm for a 2 m target corresponding to at least the separation of the gap between parallel portions of the loop. A central ferromagnetic shim beneath some magnets in the loop may compensate for vertical droop. The magnetron may be scanned in two alternating double-Z patterns rotated 90° between them.

    摘要翻译： 放置在矩形溅射靶的背面的矩形磁控管，用于涂覆矩形面板并且具有相对极性的磁体，所述磁体布置成在对应于邻近靶的等离子体轨道之间形成间隙，所述等离子体轨道以闭合的蛇形或螺旋形环路延伸。 螺旋可以具有大量的包装，并且闭合的环可以在包装之前折叠。 磁控管的尺寸仅稍低于目标的尺寸，并且在目标的两个垂直方向上扫描，对于对应于至少间隙间隔的2m靶的扫描长度例如为约100mm 在环路的平行部分之间。 环路中一些磁铁下方的中心铁磁垫片可以补偿垂直下垂。 磁控管可以以它们之间旋转90°的两个交替的双Z图案进行扫描。

    Dual substrate loadlock process equipment
    8.
    发明授权
    Dual substrate loadlock process equipment 有权
    双基板负载锁定工艺设备

    公开(公告)号：US07641434B2

    公开(公告)日：2010-01-05

    申请号：US10842079

    申请日：2004-05-10

    申请人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

    发明人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

    IPC分类号： C23C16/00 ,  H01L21/00

    CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

    摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

    摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。

    Chamber for uniform heating of large area substrates
    10.
    发明授权
    Chamber for uniform heating of large area substrates 失效
    用于均匀加热大面积基材的室

    公开(公告)号：US07442900B2

    公开(公告)日：2008-10-28

    申请号：US11396477

    申请日：2006-04-03

    申请人： Makoto Inagawa ,  Akihiro Hosokawa

    发明人： Makoto Inagawa ,  Akihiro Hosokawa

    IPC分类号： F27B5/14 ,  C23C16/00 ,  C23C16/54 ,  H01L21/324

    CPC分类号： H01L21/67109 ,  C23C16/54 ,  F27B17/0025

    摘要： Embodiments of the present invention generally provide an apparatus for providing a uniform thermal profile to a plurality of large area substrates during thermal processing. In one embodiment, an apparatus for thermal processing large area substrates includes a chamber having a plurality of processing zones disposed therein that are coupled to a lift mechanism. The lift mechanism is adapted to vertically position the plurality of processing zones within the chamber. Each processing zone further includes an upper heated plate, a lower heated plate adapted to support a first substrate thereon and an unheated plate adapted to support a second substrate thereon, wherein the unheated plate is disposed between the upper and lower heated plates.

    摘要翻译： 本发明的实施例通常提供一种用于在热处理期间向多个大面积基板提供均匀热分布的装置。 在一个实施例中，用于热处理大面积基板的装置包括具有设置在其中的多个处理区域的室，其联接到升降机构。 提升机构适于将多个处理区域垂直地定位在室内。 每个处理区还包括上加热板，适于在其上支撑第一基板的下加热板和适于在其上支撑第二基板的未加热板，其中未加热板设置在上加热板和下加热板之间。