利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.018 秒)

    Remover solution for photoresist
    1.
    发明授权
    Remover solution for photoresist 失效
    去光剂溶液

    公开(公告)号：US5185235A

    公开(公告)日：1993-02-09

    申请号：US504070

    申请日：1990-03-30

    申请人： Hiromitsu Sato ,  Kenji Tazawa ,  Toshimi Aoyama

    发明人： Hiromitsu Sato ,  Kenji Tazawa ,  Toshimi Aoyama

    IPC分类号： C09D9/00 ,  G03F7/42

    CPC分类号： C09D9/005 ,  G03F7/425

    摘要： The remover solution of the invention comprises (A) from 35 to 80% by weight of an alcoholic solvent such as ethylene glycol monoethyl ether, (B) from 10 to 40% by weight of an organic solvent which is a halogenated hydrocarbon solvent, e.g., 1,2-dichlorobenzene and methylene chloride, an ether solvent, e.g., tetrahydrofuran, or an aromatic solvent, e.g., benzene and xylene, and (C) from 0.1 to 25% by weight of a quaternay ammonium compound such as tetramethyl ammonium hydroxide and trimethyl hydroxyethyl ammonium hydroxide. Different from conventional remover solutions which only can swell cured photoresist compositions, the inventive remover solution has a power to completely dissolve a cured photoresist layer to give a quite satisfactory result in the removing works of patterned photoresist layers in the manufacture of semiconductor devices.

    摘要翻译： 本发明的去除剂溶液包含（A）35至80重量％的醇溶剂如乙二醇单乙醚，（B）10至40重量％的作为卤代烃溶剂的有机溶剂，例如 ，1,2-二氯苯和二氯甲烷，醚溶剂，例如四氢呋喃或芳族溶剂，例如苯和二甲苯，和（C）0.1至25重量％的季铵化合物如四甲基氢氧化铵 和三甲基羟乙基铵氢氧化物。 与仅可以溶胀固化的光致抗蚀剂组合物的常规去除剂溶液不同，本发明的去除剂溶液具有完全溶解固化的光致抗蚀剂层的功能，以在半导体器件的制造中去除图案化的光致抗蚀剂层的工作方面给出相当令人满意的结果。

    Photosensitive resin composition
    2.
    发明授权
    Photosensitive resin composition 失效
    感光树脂组合物

    公开(公告)号：US5087552A

    公开(公告)日：1992-02-11

    申请号：US420961

    申请日：1989-10-13

    申请人： Tomoki Horigome ,  Kenji Tazawa ,  Toshimi Aoyama

    发明人： Tomoki Horigome ,  Kenji Tazawa ,  Toshimi Aoyama

    IPC分类号： G03F7/027 ,  C08F8/14 ,  C08F290/00 ,  C08F290/12 ,  C08F299/00 ,  C08L63/10 ,  G03F7/033

    CPC分类号： G03F7/033 ,  C08F290/126 ,  C08F8/14 ,  C08L63/10 ,  C08F2810/30

    摘要： The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.

    摘要翻译： 本发明提供了一种在印刷电路板的制造中用作阻焊剂，抗蚀剂或电镀抗蚀剂的光敏树脂组合物，以显示出优异的耐热和化学性能以及对基材表面的良好粘附性。 组合物基本上包含（a）α，β-不饱和二羧酸酐和烯键式不饱和可聚合化合物的共聚树脂，其中酸酐单元用不饱和醇和饱和醇部分酯化，和（b） 光聚合引发剂。 组合物还可以包含任选的成分，例如（c）可光聚合的单体化合物，（d）环氧基树脂和（e）芳族二胺化合物。

    Process for producing multilayer wiring boards
    3.
    发明授权
    Process for producing multilayer wiring boards 失效
    多层布线板的制造方法

    公开(公告)号：US06228465B1

    公开(公告)日：2001-05-08

    申请号：US09273265

    申请日：1999-03-22

    申请人： Yoshikazu Takiguchi ,  Hiroyuki Obiya ,  Toru Takahashi ,  Taisuke Shiroyama ,  Kenji Tazawa

    发明人： Yoshikazu Takiguchi ,  Hiroyuki Obiya ,  Toru Takahashi ,  Taisuke Shiroyama ,  Kenji Tazawa

    IPC分类号： B32B300

    CPC分类号： H05K3/0044 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2203/025 ,  Y10S428/901 ,  Y10T428/24917

    摘要： An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

    摘要翻译： 一种改进的制造多层布线板的方法，该多层布线板在衬底的至少一个表面上具有多个导体图案和层间电介质层，在所述层间电介质层的特定位置设置通孔或沟槽状沟道，以建立 所述导体图案之间的电互连，其中在提供所述通孔或沟槽状通道之前，在层间电介质层上以图案形成具有耐喷砂性的涂层，然后进行喷砂以除去层间介电层 在选择的区域中形成通孔或沟槽状通道，然后除去具有耐喷砂性的涂层，然后提供导电层。

    Heat-resistant photosensitive resin composition
    4.
    发明授权
    Heat-resistant photosensitive resin composition 失效
    耐热感光性树脂组合物

    公开(公告)号：US4786579A

    公开(公告)日：1988-11-22

    申请号：US38124

    申请日：1987-04-14

    申请人： Kenji Tazawa ,  Akihiko Saito

    发明人： Kenji Tazawa ,  Akihiko Saito

    IPC分类号： C08G59/18 ,  C08F299/02 ,  C08G59/00 ,  C08G59/08 ,  C08G59/16 ,  C08G59/40 ,  C08L31/08 ,  C08L63/10 ,  G03F7/032 ,  G03F7/038 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  G03C1/68 ,  G03C5/16

    CPC分类号： H05K3/184 ,  C08F299/028 ,  C08G59/1461 ,  C08L63/10 ,  G03F7/032 ,  H05K3/287 ,  H05K2203/0783 ,  H05K3/0076

    摘要： The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.

    摘要翻译： 本发明的感光性树脂组合物具有优异的耐热性，与基材表面的粘合性和光敏性，并且适合作为印刷电路板上的阻焊剂或电镀抗蚀剂的材料。 除了光聚合引发剂和环氧树脂用固化剂之外，树脂组合物还包含由邻苯二甲酸二烯丙酯树脂，作为甲酚酚醛清漆型环氧树脂的反应产物的第一酯化树脂和每摩尔0.2-0.8摩尔的树脂成分 的烯键式不饱和羧酸的环氧基和第二酯化树脂作为酚和/或甲酚酚醛清漆型环氧树脂的反应产物和0.9-1.1摩尔/摩尔烯键式不饱和羧酸的环氧树脂的有限比例。

    Process for producing multilayer wiring boards
    6.
    发明授权
    Process for producing multilayer wiring boards 失效
    多层布线板的制造方法

    公开(公告)号：US6010956A

    公开(公告)日：2000-01-04

    申请号：US807504

    申请日：1997-02-27

    申请人： Yoshikazu Takiguchi ,  Hiroyuki Obiya ,  Toru Takahashi ,  Taisuke Shiroyama ,  Kenji Tazawa

    发明人： Yoshikazu Takiguchi ,  Hiroyuki Obiya ,  Toru Takahashi ,  Taisuke Shiroyama ,  Kenji Tazawa

    IPC分类号： H05K3/00 ,  H05K3/46 ,  H01L21/4763

    CPC分类号： H05K3/0044 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2203/025 ,  Y10S428/901 ,  Y10T428/24917

    摘要： An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

    摘要翻译： 一种改进的制造多层布线板的方法，该多层布线板在衬底的至少一个表面上具有多个导体图案和层间电介质层，在所述层间电介质层的特定位置设置通孔或沟槽状沟道，以建立 所述导体图案之间的电互连，其中在提供所述通孔或沟槽状通道之前，在层间电介质层上以图案形成具有耐喷砂性的涂层，然后进行喷砂以除去层间介电层 在选择的区域中形成通孔或沟槽状通道，然后除去具有耐喷砂性的涂层，然后提供导电层。