Relay apparatus
    6.
    发明授权
    Relay apparatus 失效
    继电器

    公开(公告)号:US07046960B2

    公开(公告)日:2006-05-16

    申请号:US10001759

    申请日:2001-10-24

    IPC分类号: H04B7/14

    摘要: While a spectrum waveform of an output signal from a subtracter (207) is visibly monitored, an operator controls a variable phases shifter (208) based upon a second control signal (CL2) so that a shape of a spectrum waveform of an output signal from a subtracter (207) is approximated to a spectrum waveform of a desirable wave to change a phase of a local oscillation frequency signal from a local oscillator (206). As a result, a phase of a duplicated loop signal is changed. Also, the operator controls a variable attenuator (209) based upon a first control signal (CL1) so that a shape of this spectrum waveform is approximated to a spectrum waveform of a desirable wave (20) to change a signal level of the duplicated loop signal.

    摘要翻译: 当可见地监视来自减法器(207)的输出信号的频谱波形时,操作员基于第二控制信号(CL 2)控制可变相移器(208),使得输出信号的频谱波形的形状 近似于从本地振荡器(206)改变本地振荡频率信号的相位的期望波的频谱波形。 结果,改变了重复的环路信号的相位。 另外,操作员根据第一控制信号(CL 1)控制可变衰减器(209),使得该频谱波形的形状近似于期望波(20)的频谱波形,以改变复制的信号的信号电平 回路信号。

    Resin-sealed chip stack type semiconductor device
    7.
    发明授权
    Resin-sealed chip stack type semiconductor device 失效
    树脂密封芯片堆叠型半导体器件

    公开(公告)号:US06545365B2

    公开(公告)日:2003-04-08

    申请号:US09781237

    申请日:2001-02-13

    IPC分类号: H01L2348

    摘要: A resin-sealed chip stack type semiconductor device comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each other, and a sealing resin which covers and protects all the components mounted on the substrate. The non-conductive bonding layer is provided by die bonding in such a manner that is at least covers the portion of the bottom chip where the corresponding wires are connected and does not allow generation of a gap between the two chips.

    摘要翻译: 一种树脂密封芯片堆叠型半导体器件,包括放置在许多球上的衬底,连接有导线的底部芯片,连接并且安装在底部芯片上方的导线的顶部芯片,非导电结合层,其功能于 将两个芯片彼此粘合并固定,以及密封树脂,其覆盖并保护安装在基板上的所有部件。 非导电结合层通过芯片接合以至少覆盖底部芯片的相应导线连接部分并且不允许在两个芯片之间产生间隙的方式提供。

    Optoelectronic memory, logic, and interconnection device including an
optical bistable circuit
    10.
    发明授权
    Optoelectronic memory, logic, and interconnection device including an optical bistable circuit 失效
    包括光学双稳态电路的光电存储器,逻辑和互连装置

    公开(公告)号:US5095200A

    公开(公告)日:1992-03-10

    申请号:US640278

    申请日:1991-01-11

    摘要: An optoelectronic memory, logic, and interconnection device having an optical bistable circuit as an essential element. The optical bistable circuit includes an optical bistable switch which is a light emitting device and a first phototransistor detecting the light emitted from the light emitting device, connected in series, a second phototransistor connected in parallel to the optical bistable switch which does not detect the light emitted from the light emitting device, and a load resistor connected in series to the optical bistable switch. The optoelectronic memory, logic, and interconnection device operates as an optoelectronic memory device turned on and off with the same light source, as an optoelectronic logic device executing exclusive OR operation, or as a light source for reconfigurable optical interconnection.

    摘要翻译: 具有光学双稳态电路作为必需元件的光电存储器,逻辑和互连器件。 光学双稳态电路包括光双稳态开关,其是发光器件和第一光电晶体管,其检测从串联连接的发光器件发射的光,并联连接到不检测光的光学双稳态开关的第二光电晶体管 从发光器件发射的负载电阻器和与光学双稳态开关串联连接的负载电阻器。 光电存储器,逻辑器件和互连器件作为光电存储器件工作,作为与执行异或运算的光电逻辑器件相同的光源,或作为用于可重构光互连的光源而导通和截止的光电存储器件。