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公开(公告)号：US07265035B2
公开(公告)日：2007-09-04
申请号：US10503972
申请日：2003-03-10
申请人： Hiroshi Honma , Noriyuki Ooroku , Hitoshi Odashima , Toru Mita , Chuichi Miyazaki , Takashi Wada
发明人： Hiroshi Honma , Noriyuki Ooroku , Hitoshi Odashima , Toru Mita , Chuichi Miyazaki , Takashi Wada
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L2221/68322 , H01L2221/68327
摘要： To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.
摘要翻译： 为了提高堆叠式闪速存储器所使用的薄型半导体器件的可靠性和产量，半导体器件通过使由半导体晶片从粘合片上切割得到的半导体芯片（半导体器件）从 通过使用施加了超声波振动的上推夹具，通过粘合片的背面，不会突破粘合片，并且拾取每个半导体芯片。
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公开(公告)号：US06916686B2
公开(公告)日：2005-07-12
申请号：US10342238
申请日：2003-01-15
IPC分类号： H01L23/29 , H01L21/52 , H01L23/12 , H01L23/31 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/83 , H01L23/3128 , H01L23/3164 , H01L23/5387 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/75 , H01L24/97 , H01L25/0657 , H01L2221/68336 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/92 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/3512 , H01L2224/13111 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A contact collect is provided to prevent damage to the top surface of a semiconductor chip at the time of die bonding the semiconductor chip. A protection tape is pasted to the top surface of the semiconductor chip before die bonding of the semiconductor chip is executed by pressing the back surface (underside) of the semiconductor chip sucked and securely held by the contact collect against respective chip-mounting regions of a multi-wiring board. The contact collect is, for example, substantially cylidrical in outside shape, and a bottom part (suction head) thereof is made of soft synthetic rubber, etc. The protection tape pasted to the top surface of the semiconductor chip prevents the top surface of the semiconductor chip from directly contacting with the contact collect even at the time of vacuum suction by pressing the suction head of the contact collect against the top surface of the semiconductor chip.
摘要翻译： 提供接触收集以防止在半导体芯片的芯片接合时损坏半导体芯片的顶表面。 将半导体芯片的裸片接合之前，通过将被触点收集并牢固地保持的半导体芯片的背面（下侧）按压到相应的芯片安装区域，将保护带粘贴到半导体芯片的顶表面 多线路板 接触收集体例如是外形大致圆形，其底部（吸头）由软质合成橡胶等构成。粘贴在半导体芯片的上表面的保护带防止了 即使在真空抽吸时，通过按压接触器的吸头将半导体芯片与接触件直接接触收集，也抵抗半导体芯片的顶表面收集。
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公开(公告)号：US08955253B2
公开(公告)日：2015-02-17
申请号：US13990989
申请日：2011-11-25
申请人： Hisayuki Kanki , Toru Iriba , Shinya Ikeda , Yasutaka Kanda , Kenji Nishigaki , Yasuteru Kitada , Takashi Wada
发明人： Hisayuki Kanki , Toru Iriba , Shinya Ikeda , Yasutaka Kanda , Kenji Nishigaki , Yasuteru Kitada , Takashi Wada
CPC分类号： E05F15/74 , B66B13/26 , E05F15/73 , E05F2015/765 , E05Y2900/104 , E05Y2900/132
摘要： A detecting unit (14) forms a plurality of detection spots arranged two-dimensionally on a floor surface near a door panel (12). Each detection spot is capable of detecting a human or an object by infrared light independently from other detection spots. Region distinguishing means (30) distinguishes a region formed by plural ones of the said detection spots that have detected the human or object. Person's movement judging means (44) judges the direction in which the distinguished region moves. A signal which causes a door panel (12) to be opened is supplied to a door controller (34) only when the direction of movement of the distinguished region is the direction toward the door panel.
摘要翻译： 检测单元（14）形成在门板（12）附近的地板表面上二维排列的多个检测点。 每个检测点能够独立于其他检测点，通过红外线检测人或物体。 区域识别装置（30）区分由检测到人或物体的所述检测点中的多个检测点形成的区域。 人的移动判断装置（44）判断识别区域移动的方向。 只有当不同区域的移动方向是朝向门板的方向时，才能将门板（12）打开的信号提供给门控制器（34）。
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公开(公告)号：US08586680B2
公开(公告)日：2013-11-19
申请号：US11994956
申请日：2007-06-26
申请人： Naomi Okamoto , Mitsuharu Anbe , Takashi Wada
发明人： Naomi Okamoto , Mitsuharu Anbe , Takashi Wada
CPC分类号： C08L9/00 , A63B37/0003 , A63B37/0094 , C08K5/0025 , C08K5/098 , C08K5/14
摘要： The object is to provide a rubber composition for a high-strength golf ball which has a high hardness, high resiliency, excellent processability and improved filler dispersibility, by adjusting each of the Mooney viscosity, the molecular weight distribution and the n value (the rate-dependent index for Mooney viscosity) of a high-cis-polybutadiene rubber using a cobalt catalyst to a value falling within a specific range. The rubber composition comprises 100 parts by weight of a high-cis-polybutadiene synthesized using a cobalt catalyst and 10 to 50 parts by weight of a co-crosslinking agent, wherein the high-cis-polybutadiene satisfies the following requirements (a) to (c): (a) the Mooney viscosity (ML) is 40 to 55; (b) the molecular weight distribution [a weight average molecular weight MW)/a number average molecular weight (Mn)] is 3.0 to 4.2; and (c) the rate-dependent index of Mooney viscosity (n value) is 2.3 to 3.0.
摘要翻译： 本发明的目的是提供一种高强度高尔夫球用橡胶组合物，其通过调节每个门尼粘度，分子量分布和n值（具有高的硬度，高回弹性，优异的加工性和改进的填料分散性） 使用钴催化剂的高顺式聚丁二烯橡胶的滞留指数为门尼粘度，其值落在特定范围内。 橡胶组合物包含100重量份使用钴催化剂合成的高顺式聚丁二烯和10至50重量份共交联剂，其中高顺式聚丁二烯满足以下要求（a）至（ c）：（a）门尼粘度（ML）为40〜55; （b）分子量分布[重均分子量MW] /数均分子量（Mn）]为3.0〜4.2; 和（c）门尼粘度（n值）的速率依赖指数为2.3〜3.0。
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公开(公告)号：US08291558B2
公开(公告)日：2012-10-23
申请号：US11962863
申请日：2007-12-21
申请人： Takao Ohnishi , Takashi Wada , Tomohiro Yamada , Makoto Tani
发明人： Takao Ohnishi , Takashi Wada , Tomohiro Yamada , Makoto Tani
CPC分类号： H01L41/0973 , H01L41/0475 , H01L41/257 , Y10T29/42 , Y10T29/49155 , Y10T29/49163
摘要： A method for manufacturing a piezoelectric/electrostrictive element includes a step of subjecting the piezoelectric/electrostrictive film to a heat treatment and a polarization treatment after the film is allowed to stand until the value of an electric constant has converged after the heat treatment. The piezoelectric/electrostrictive element manufactured in this method has small stress remaining in the piezoelectric/electrostrictive film, and predetermined performance regarding, for example, a displacement amount, a displacement-generating force, and an electric power efficiency (consumed electric power) as a piezoelectric/electrostrictive element (piezoelectric/electrostrictive film) is never spoiled.
摘要翻译： 压电/电致伸缩元件的制造方法包括在使膜静置直到电常数在热处理后收敛的状态下，对压电/电致伸缩薄膜进行热处理和极化处理的步骤。 通过该方法制造的压电/电致伸缩元件在压电/电致伸缩膜中残留的应力小，例如在位移量，位移产生力和电力效率（消耗电力）中作为 压电/电致伸缩元件（压电/电致伸缩膜）从未被破坏。
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公开(公告)号：US20120039972A1
公开(公告)日：2012-02-16
申请号：US13264134
申请日：2010-04-28
申请人： Yosuke Kobayashi , Akiyori Fujiwara , Takashi Wada , Atsushi Seto
发明人： Yosuke Kobayashi , Akiyori Fujiwara , Takashi Wada , Atsushi Seto
CPC分类号： A61Q19/001 , A61K8/37 , A61K8/442 , A61K8/88 , A61M35/003 , A61Q1/04 , A61Q1/06
摘要： An oily composition which gives a preparation for lip through solidification, characterized by comprising: (A) an N-acylamino acid derivative containing, for example, two N-acylglutamic acid dialkylamide; (B) a polyamide resin containing, for example, (dimer dilinoleic acid bisdioctadecylamide/ethylenediamine) copolymer; and (C) a liquid oil containing, for example, dimer acid esters; and which, upon solidification to give a preparation for lip, can exhibit sufficient transparency and further can give a satisfactory use feeling.
摘要翻译： 通过固化得到唇部制剂的油性组合物，其特征在于包含：（A）含有例如两个N-酰基谷氨酸二烷基酰胺的N-酰基氨基酸衍生物; （B）含有例如（二聚二亚油酸双十八烷基酰胺/乙二胺）共聚物的聚酰胺树脂; 和（C）含有例如二聚酸酯的液体油; 并且在固化以制备唇部时，可以显示出足够的透明度并进一步提供令人满意的使用感。
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公开(公告)号：US07787047B2
公开(公告)日：2010-08-31
申请号：US12359110
申请日：2009-01-23
申请人： Takashi Wada
发明人： Takashi Wada
IPC分类号： H04N11/20
CPC分类号： H04N7/0137 , G09G5/00 , G09G5/391 , G09G2320/02 , G09G2320/0261 , G09G2320/0606 , G09G2320/0626 , G09G2320/066 , G09G2320/0666 , G09G2340/16 , H04N7/0125 , H04N7/0132 , H04N9/73
摘要： According to one embodiment, an image processing apparatus includes a resolution increasing module and a moving-image improving module. The resolution increasing module performs, on receipt of a first video signal with first resolution, super resolution conversion on the first video signal to obtain a second video signal with second resolution that is higher than the first resolution by estimating an original pixel value from the first video signal and increasing pixels. The resolution increasing module also performs first correction on the second video signal obtained by the super resolution conversion. The moving-image improving module configured to perform, on the second video signal subjected to the first correction, second correction except for a correction process included in the first correction.
摘要翻译： 根据一个实施例，图像处理装置包括分辨率增加模块和运动图像改善模块。 分辨率增加模块在接收到具有第一分辨率的第一视频信号时，执行对第一视频信号的超分辨率转换，以通过从第一视频信号估计原始像素值来获得具有高于第一分辨率的第二分辨率的第二视频信号 视频信号和增加的像素。 分辨率增加模块还对通过超分辨率转换获得的第二视频信号执行第一校正。 运动图像改善模块被配置为对经过第一校正的第二视频信号执行除了包括在第一校正中的校正处理之外的第二校正。
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公开(公告)号：US20100117011A1
公开(公告)日：2010-05-13
申请号：US12450605
申请日：2008-04-04
申请人： Junichi Kitano , Takashi Wada , Takeshi Kusunoki
发明人： Junichi Kitano , Takashi Wada , Takeshi Kusunoki
IPC分类号： F16K7/04
CPC分类号： F16K7/068
摘要： A device for stopping a flow of fluid in a fixed length of tube with an actuator simple in construction is provided. The stopping device is free of direct touch with the fluid inside the tube, expected not to obstruct the flow in the tube as permitted as possible at normal condition, expected to perform both detection and control with a single device, and further invulnerable to kinds of fluids. The device for stopping a flow of fluid includes a tube holder to keep a tube in looped configuration, a movable part pressing the looped configuration of the tube. Pressing of the looped configuration of the tube make a snapped bent to stop the flow of fluid passed through the tube. Putting the movable part back into place results in the tube's returning from the configuration having the bent, allowing the fluid flowing again through the tube.
摘要翻译： 提供一种用于在构造简单的致动器中停止固定长度的管中的流体流动的装置。 止动装置与管内的流体无直接接触，预期在正常状态下尽可能允许阻止管中的流动，预期用单个装置进行检测和控制，并且进一步不易受到各种 流体。 用于停止流体流动的装置包括管保持器以将管保持为环形构造，可动部分压缩管的环形构造。 按压管的环形构造使得卡扣弯曲以停止通过管的流体的流动。 将可移动部分放回原位导致管从具有弯曲的构造返回，允许流体再次流过管。
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公开(公告)号：US20100026890A1
公开(公告)日：2010-02-04
申请号：US12359110
申请日：2009-01-23
申请人： Takashi Wada
发明人： Takashi Wada
IPC分类号： H04N7/01
CPC分类号： H04N7/0137 , G09G5/00 , G09G5/391 , G09G2320/02 , G09G2320/0261 , G09G2320/0606 , G09G2320/0626 , G09G2320/066 , G09G2320/0666 , G09G2340/16 , H04N7/0125 , H04N7/0132 , H04N9/73
摘要： According to one embodiment, an image processing apparatus includes a resolution increasing module and a moving-image improving module. The resolution increasing module performs, on receipt of a first video signal with first resolution, super resolution conversion on the first video signal to obtain a second video signal with second resolution that is higher than the first resolution by estimating an original pixel value from the first video signal and increasing pixels. The resolution increasing module also performs first correction on the second video signal obtained by the super resolution conversion. The moving-image improving module configured to perform, on the second video signal subjected to the first correction, second correction except for a correction process included in the first correction.
摘要翻译： 根据一个实施例，图像处理装置包括分辨率增加模块和运动图像改善模块。 分辨率增加模块在接收到具有第一分辨率的第一视频信号时，执行对第一视频信号的超分辨率转换，以通过从第一视频信号估计原始像素值来获得具有高于第一分辨率的第二分辨率的第二视频信号 视频信号和增加的像素。 分辨率增加模块还对通过超分辨率转换获得的第二视频信号执行第一校正。 运动图像改善模块被配置为对经过第一校正的第二视频信号执行除了包括在第一校正中的校正处理之外的第二校正。
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公开(公告)号：US20090000720A1
公开(公告)日：2009-01-01
申请号：US12087333
申请日：2006-12-25
申请人： Hirokazu Ishida , Hirotoshi Otsuki , Takashi Wada
发明人： Hirokazu Ishida , Hirotoshi Otsuki , Takashi Wada
CPC分类号： C08L7/00 , C08L9/00 , C08L21/00 , C08L2666/08 , C08L2666/02
摘要： A rubber composition for a sidewall, in which balance between tip cut resistance and heat build-up property of a sidewall is enhanced, is provided. Namely, the present invention relates to a rubber composition for a sidewall, comprising a rubber component comprising 10 to 60% by weight of a butadiene rubber, wherein syndiotactic-1,2-polybutadiene having an average primary particle diameter of not more than 100 nm is dispersed in the butadiene rubber.
摘要翻译： 提供了一种用于侧壁的橡胶组合物，其中提高了顶端切断阻力和侧壁的发热性能之间的平衡。 即，本发明涉及一种侧壁用橡胶组合物，其包含橡胶成分，其含有10〜60重量％的丁二烯橡胶，其中平均一次粒径为100nm以下的间同立构1,2-聚丁二烯 分散在丁二烯橡胶中。
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