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    Thermal transfer recording device
    1.
    发明授权
    Thermal transfer recording device 失效
    热转印记录装置

    公开(公告)号：US4851861A

    公开(公告)日：1989-07-25

    申请号：US147555

    申请日：1988-01-19

    申请人： Hiroshi Kikuchi ,  Jiro Tanuma ,  Kazuki Obara ,  Kazuyoshi Yoshida

    发明人： Hiroshi Kikuchi ,  Jiro Tanuma ,  Kazuki Obara ,  Kazuyoshi Yoshida

    IPC分类号： B41J17/04 ,  B41J2/355 ,  B41J2/36 ,  B41J17/36 ,  B41J35/16 ,  B41J35/22

    CPC分类号： B41J2/355

    摘要： In a thermal transfer recording device which performs thermal transfer recording by using an ink ribbon which applies monochrome or polychrome transfer of ink to a base film and moves the ink ribbon and paper holding them between a thermal head and a platen, a first control section outputs a signal for the control of the heat quantity of the thermal head based on input binary data, a second control section outputs a signal for the control of the heat quantity of the thermal head based on input multi-value data, a setting unit outputs setting results based on the setting of the binary data print mode or the multi-value data print mode, and a selection unit selects the output signal of the first control section or the second control section based on the above mentioned setting results and supplies it to the above-mentioned thermal head.

    Conductive composition and conductive cross-linked product, capacitor and production method thereof, and antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium
    2.
    发明授权
    Conductive composition and conductive cross-linked product, capacitor and production method thereof, and antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium 有权
    导电组合物和导电交联产物，电容器及其制备方法以及抗静电涂层材料，抗静电涂层，抗静电膜，滤光器和光学信息记录介质

    公开(公告)号：US08097184B2

    公开(公告)日：2012-01-17

    申请号：US12645022

    申请日：2009-12-22

    申请人： Kazuyoshi Yoshida ,  Tailu Ning ,  Yasushi Masahiro ,  Yutaka Higuchi ,  Rika Abe

    发明人： Kazuyoshi Yoshida ,  Tailu Ning ,  Yasushi Masahiro ,  Yutaka Higuchi ,  Rika Abe

    IPC分类号： H01B1/00 ,  H01G4/06 ,  H01G9/02

    CPC分类号： C08K5/3445 ,  C08K5/34 ,  H01G9/028 ,  H01G11/48 ,  H01G11/56 ,  Y02E60/13 ,  C08L25/18

    摘要： A conductive composition comprises a π conjugated conductive polymer, a dopant, and a nitrogen-containing aromatic cyclic compound. A capacitor comprises an anode composed of a porous material of valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a cathode provided on the dielectric layer and having a solid electrolyte layer containing a π conjugated conductive polymer, which comprises an electron donor compound containing an electron donor element provided between the dielectric layer and the cathode. Another capacitor is based on the above-described capacitor, wherein the solid electrolyte layer further comprises a dopant and a nitrogen-containing aromatic cyclic compound. An antistatic coating material comprises a π conjugated conductive polymer, a solubilizing polymer containing an anion group and/or an electron attractive group, a nitrogen-containing aromatic cyclic compound, and a solvent. An antistatic coating is formed by applying the antistatic coating material.

    摘要翻译： 导电组合物包括 共轭导电性聚合物，掺杂剂和含氮芳香族环状化合物。 电容器包括由阀金属的多孔材料构成的阳极，通过氧化阳极的表面形成的电介质层和设置在电介质层上的具有固体电解质层的阴极， 共轭导电聚合物，其包含电子给体化合物，其含有设置在介电层和阴极之间的电子给体元件。 另一电容器基于上述电容器，其中固体电解质层还包含掺杂剂和含氮芳族环状化合物。 抗静电涂层材料包括： 共轭导电性聚合物，含有阴离子基团的增溶聚合物和/或吸电子基团，含氮芳香族环状化合物和溶剂。 通过施加抗静电涂层材料形成抗静电涂层。

    Conductive composition and production method thereof, antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium, and capacitors and production method thereof
    3.
    发明授权
    Conductive composition and production method thereof, antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium, and capacitors and production method thereof 有权
    导电性组合物及其制造方法，抗静电涂层材料，抗静电涂层，抗静电膜，滤光器和光学信息记录介质，电容器及其制造方法

    公开(公告)号：US07916455B2

    公开(公告)日：2011-03-29

    申请号：US12695898

    申请日：2010-01-28

    申请人： Kazuyoshi Yoshida ,  Tailu Ning ,  Yasushi Masahiro

    发明人： Kazuyoshi Yoshida ,  Tailu Ning ,  Yasushi Masahiro

    IPC分类号： H01G9/00

    CPC分类号： H01G9/028 ,  C08G61/124 ,  C08G61/126 ,  C09D5/24 ,  C09D165/00 ,  H01B1/122 ,  H01G9/042 ,  H01G9/0425 ,  H01G11/48 ,  H01G11/56 ,  Y02E60/13 ,  C08L2666/06

    摘要： A conductive composition comprises a π conjugated conductive polymer, a dopant composed of polyanion, and at least one crosslinking site forming compound selected from (a) compounds having a glycidyl group and (b) compounds having a hydroxyl group and one selected from the group consisting of allyl, vinyl ether, methacryl, acryl, methacrylamide, and acrylamide groups. An antistatic coating material comprises a π conjugated conductive polymer, polyanion, at least one crosslinking site forming compound selected form the above (a) and (b), and a solvent. An antistatic coating is formed by applying the above-mentioned antistatic coating material. In a capacitor comprising an anode composed of a valve metal porous body; a dielectric layer formed by oxidizing the surface of the anode; and a cathode formed on the dielectric layer, the cathode has a solid electrolyte layer formed by crosslinking complexes of a π conjugated conductive polymer and a dopant composed of a polyanion.

    摘要翻译： 导电组合物包括 共轭导电性聚合物，由聚阴离子构成的掺杂剂和至少一种选自（a）具有缩水甘油基的化合物的交联部位形成化合物，和（b）具有羟基的化合物和选自烯丙基，乙烯基醚， 甲基丙烯酰基，丙烯酰基，甲基丙烯酰胺和丙烯酰胺基。 抗静电涂层材料包括： 共轭导电聚合物，聚阴离子，至少一种选自上述（a）和（b）的交联部位形成化合物和溶剂。 通过施加上述抗静电涂层材料形成抗静电涂层。 在包括由阀金属多孔体构成的阳极的电容器中; 通过氧化阳极的表面形成的电介质层; 和形成在电介质层上的阴极，阴极具有通过交联复合物形成的固体电解质层。 共轭导电聚合物和由聚阴离子组成的掺杂剂。

    Method for manufacturing semiconductor device having via plug
    5.
    发明授权
    Method for manufacturing semiconductor device having via plug 有权
    具有通孔插头的半导体器件的制造方法

    公开(公告)号：US07842608B2

    公开(公告)日：2010-11-30

    申请号：US12192349

    申请日：2008-08-15

    申请人： Kazuyoshi Yoshida

    发明人： Kazuyoshi Yoshida

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76814 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/32136 ,  H01L21/76805

    摘要： A method for manufacturing a semiconductor device, including: forming a first conductive layer on a first insulating film; forming a second insulating film so as to cover the first conductive layer; forming a resist mask on the second insulating film; forming a hole reaching the first conductive layer in the second insulating film by a first etching using the resist mask; removing the resist mask; removing the first conductive layer exposed at the bottom of the hole by a second etching, so that the hole reaches the first insulating film and the first conductive layer exposes at a side surface within the hole; forming a conductive plug in contact with the first conductive layer exposed at the side surface within the hole by burying a conductive material in the hole; and forming a second conductive layer to be connected to the conductive plug on the second insulating film.

    摘要翻译： 一种制造半导体器件的方法，包括：在第一绝缘膜上形成第一导电层; 形成第二绝缘膜以覆盖第一导电层; 在所述第二绝缘膜上形成抗蚀剂掩模; 通过使用抗蚀剂掩模的第一蚀刻形成到达第二绝缘膜中的第一导电层的孔; 去除抗蚀剂掩模; 通过第二蚀刻去除在孔的底部暴露的第一导电层，使得孔到达第一绝缘膜，并且第一导电层在孔内的侧表面暴露; 通过在孔中埋入导电材料形成与在孔内的侧表面暴露的第一导电层接触的导电插塞; 以及形成与所述第二绝缘膜上的所述导电插塞连接的第二导电层。

    Method for manufacturing a semiconductor device having a stepped contact hole
    6.
    发明申请
    Method for manufacturing a semiconductor device having a stepped contact hole 审中-公开
    一种具有阶梯式接触孔的半导体器件的制造方法

    公开(公告)号：US20070077774A1

    公开(公告)日：2007-04-05

    申请号：US11529328

    申请日：2006-09-29

    申请人： Kazuyoshi Yoshida

    发明人： Kazuyoshi Yoshida

    IPC分类号： H01L21/31

    CPC分类号： H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/76816 ,  H01L27/10855 ,  H01L2221/1057

    摘要： A process for forming a stepped contact hole includes: dry-etching a portion of a silicon oxide film using a mixed gas including carbon-rich fluorocarbon gas to form a first contact hole, forming a specific film on the sidewall of the first contact hole; dry-etching the remaining portion of the silicon oxide film at the bottom of the first contact hole by using the specific film as a mask to form a second contact hole extending from the first contact hole; and removing the specific film.

    摘要翻译： 一种形成台阶式接触孔的方法包括：使用包含富碳氟碳气体的混合气体对一部分氧化硅膜进行干蚀刻以形成第一接触孔，在第一接触孔的侧壁上形成特定的膜; 通过使用特定的膜作为掩模，在第一接触孔的底部干蚀刻氧化硅膜的剩余部分，以形成从第一接触孔延伸的第二接触孔; 并去除特定的胶片。

    Heat-sealable connector and method for the preparation thereof
    8.
    发明授权
    Heat-sealable connector and method for the preparation thereof 失效
    热封连接器及其制备方法

    公开(公告)号：US5484648A

    公开(公告)日：1996-01-16

    申请号：US105731

    申请日：1993-08-11

    申请人： Satoshi Odashima ,  Kazuyoshi Yoshida

    发明人： Satoshi Odashima ,  Kazuyoshi Yoshida

    IPC分类号： H01R4/04 ,  H05K1/00 ,  H05K3/12 ,  H05K3/32 ,  H05K3/38 ,  B32B9/00

    CPC分类号： H01R4/04 ,  H05K3/12 ,  H05K1/0393 ,  H05K2203/0783 ,  H05K3/323 ,  H05K3/386 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/2813 ,  Y10T428/2817

    摘要： Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

    摘要翻译： 提出了一种改进的可热封连接器，其具有通过丝网印刷在柔性基板的表面上形成的导电浆料的对准线。 与传统的可热密封连接器不同，导电线不直接形成在基板的表面上，而是首先提供一层溶剂吸收材料的基板表面，并且通过屏幕在溶剂吸收层上形成导电线 印刷，使得糊状物的丝网印刷线不会导致运行，从而通过立即将糊料中的溶剂吸收到溶剂吸收层中来扩大线宽，不仅有助于生产率，而且有助于提高生产率 产品连接器。

    Heat-sealable connector and method for the preparation thereof
    9.
    发明授权
    Heat-sealable connector and method for the preparation thereof 失效
    热封连接器及其制备方法

    公开(公告)号：US5470607A

    公开(公告)日：1995-11-28

    申请号：US342223

    申请日：1994-11-18

    申请人： Satoshi Odashima ,  Kazuyoshi Yoshida

    发明人： Satoshi Odashima ,  Kazuyoshi Yoshida

    IPC分类号： H01R4/04 ,  H05K1/00 ,  H05K3/12 ,  H05K3/32 ,  H05K3/38 ,  B05D3/00 ,  B05D5/00

    CPC分类号： H01R4/04 ,  H05K3/12 ,  H05K1/0393 ,  H05K2203/0783 ,  H05K3/323 ,  H05K3/386 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/2813 ,  Y10T428/2817

    摘要： Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent-absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

    摘要翻译： 提出了一种改进的可热封连接器，其具有通过丝网印刷在柔性基板的表面上形成的导电浆料的对准线。 与传统的可热密封连接器不同，导电线不直接形成在基板的表面上，而是基板表面首先设置有一层溶剂吸收材料，并且导电线由溶剂吸收层形成在溶剂吸收层上 丝网印刷，使得糊状物的丝网印刷线不会因为立即吸附到溶剂吸收层中而导致线宽变宽，从而不仅有助于提高生产率，还有助于质量 产品连接器。