Dielectric resonant component with resist film on the mount substrate
    2.
    发明授权
    Dielectric resonant component with resist film on the mount substrate 失效
    在安装基板上具有抗蚀剂膜的介电谐振元件

    公开(公告)号:US5760666A

    公开(公告)日:1998-06-02

    申请号:US694647

    申请日:1996-08-09

    摘要: A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

    摘要翻译: 电介质谐振元件包括至少一个电介质多级谐振器,其包括一个介质块,形成在一个介质块中的多个内导体形成孔,形成在每个内导体形成孔的内表面上的内导体, 导电体覆盖一个介质块的基本上整个的外表面,电介质多级谐振器在该介电块中构成多个介质谐振器; 以及固定地安装在电介质多级谐振器上的安装基板,用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号,当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极,并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

    Method of manufacturing a dielectric resonant apparatus
    3.
    发明授权
    Method of manufacturing a dielectric resonant apparatus 失效
    制造介质谐振装置的方法

    公开(公告)号:US5764117A

    公开(公告)日:1998-06-09

    申请号:US677925

    申请日:1996-07-10

    摘要: A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

    摘要翻译: 一种制造介质谐振元件的方法包括至少一个电介质多级谐振器,其包括一个介电块,形成在一个介质块中的多个内导体形成孔,形成在每个内导体形成孔的内表面上的内导体 以及覆盖所述一个介质块的大致整个外表面的外导体,所述介质多级谐振器在所述一个介质块中构成多个介质谐振器; 以及固定安装在电介质多级谐振器上的安装基板,用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号,当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极,并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

    Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part
    5.
    发明授权
    Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part 有权
    电子部件,介质滤波器,介质双工器,以及电子部件的制造方法

    公开(公告)号:US06683790B1

    公开(公告)日:2004-01-27

    申请号:US09606963

    申请日:2000-06-29

    IPC分类号: H05K702

    摘要: An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board; a terminal electrode disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; a soldering-resistant film disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; wherein the distance between the major surface of the terminal electrode and the second major surface of the printed circuit board is substantially equal to or larger than the distance between the major surface of the soldering-resistant film in the vicinity of the terminal electrode and the second major surface of the printed circuit board.

    摘要翻译: 一种电子部件,包括:印刷电路板,包括第一主表面和第二主表面; 设置在印刷电路板的第一主表面上的电路元件; 端子电极,设置在印刷电路板的第二主表面上并且包括与印刷电路板的第二主表面相对的主表面; 设置在印刷电路板的第二主表面上并包括与印刷电路板的第二主表面相对的主表面的耐焊膜; 其中端子电极的主表面和印刷电路板的第二主表面之间的距离基本上等于或大于端接电极附近的耐焊膜的主表面与第二 印刷电路板的主表面。

    High frequency circuit device, antenna-sharing device, and communication apparatus having spaced apart ground electrodes
    8.
    发明授权
    High frequency circuit device, antenna-sharing device, and communication apparatus having spaced apart ground electrodes 有权
    高频电路装置,天线共用装置以及具有间隔开的接地电极的通信装置

    公开(公告)号:US06351195B1

    公开(公告)日:2002-02-26

    申请号:US09511450

    申请日:2000-02-23

    IPC分类号: H01P1202

    摘要: In an antenna-sharing device, a transmission filter is electrically connected between a transmission terminal and an antenna terminal, and a reception filter is electrically connected between a reception terminal and the antenna terminal. A signal pattern and a ground electrode are formed on a resonator-mounting surface of a circuit substrate. On the ground electrodes, the resonators constituting the transmission filter are integrally soldered and the resonators constituting the reception filter are integrally soldered. On the mounting surface of the circuit substrate, a transmission filter ground electrode and a reception filter ground electrode are formed. Both ground electrodes are isolated from each other by a gap (slit), and are disconnected from each other.

    摘要翻译: 在天线共享装置中,发送滤波器电连接在发送终端和天线端子之间,并且接收滤波器电连接在接收终端和天线端子之间。 信号图案和接地电极形成在电路基板的谐振器安装面上。 在接地电极上,构成发送滤波器的谐振器被整体焊接,构成接收滤波器的谐振器被整体焊接。 在电路基板的安装面上形成透光滤光片接地电极和接收滤波器接地电极。 两个接地电极通过间隙(狭缝)彼此隔离,并且彼此断开。