公开(公告)号：US20080031083A1

公开(公告)日：2008-02-07

申请号：US11882402

申请日：2007-08-01

申请人： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

发明人： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC分类号： B01F15/02

CPC分类号： B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

摘要翻译： 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药液混合装置。 首先，内部容器10填充有硫酸，并且允许从内部容器10溢出的硫酸流入外部容器12。 然后，将过氧化氢溶液供给到内罐10中，并使过氧化氢溶液流入外罐12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。 同时当过氧化氢溶液流入外罐12时，返回泵16被启动。

公开(公告)号：US09099502B2

公开(公告)日：2015-08-04

申请号：US11882402

申请日：2007-08-01

申请人： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

发明人： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC分类号： B01F15/02 ,  H01L21/67 ,  B01F3/08 ,  B01F5/10 ,  B01F15/00 ,  B01F15/04 ,  C01B15/08 ,  C11D3/39 ,  C11D11/00

CPC分类号： B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

摘要翻译： 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药液混合装置。 首先，用硫酸填充内箱10，使从内箱10溢出的硫酸流入外箱12.然后，将过氧化氢溶液供给至内箱10，将氢 使过氧化物溶液流入外槽12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。同时当过氧化氢溶液流入外罐12时，返回泵 16被激活。

公开(公告)号：US08475668B2

公开(公告)日：2013-07-02

申请号：US12902721

申请日：2010-10-12

申请人： Hiroshi Tanaka ,  Teruomi Minami ,  Yosuke Kawabuchi ,  Norihiro Ito ,  Fumihiro Kamimura ,  Takashi Yabuta ,  Kazuki Kosai ,  Takeshi Uno ,  Kenji Sekiguchi ,  Yasushi Fujii

发明人： Hiroshi Tanaka ,  Teruomi Minami ,  Yosuke Kawabuchi ,  Norihiro Ito ,  Fumihiro Kamimura ,  Takashi Yabuta ,  Kazuki Kosai ,  Takeshi Uno ,  Kenji Sekiguchi ,  Yasushi Fujii

IPC分类号： H01B13/00

CPC分类号： H01L21/02057 ,  H01L21/67051

摘要： Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate.

摘要翻译： 提供一种基板液体处理装置，基板液体处理方法以及其中存储有基板液体处理程序的计算机可读存储介质，其可以防止由基板中的电荷放电引起的静电破坏的发生。 基板液体处理装置用化学液体处理基板的电路形成表面。 此外，在用化学液体处理基板之前，基板液体处理装置通过防静电液体对与基板的电路形成面相反的表面进行防静电处理，从而将电荷 基质。

公开(公告)号：US08303723B2

公开(公告)日：2012-11-06

申请号：US12634942

申请日：2009-12-10

申请人： Teruomi Minami ,  Fumihiro Kamimura ,  Kazuki Kosai ,  Takashi Yabuta ,  Kenji Yokomizo ,  Shogo Mizota

发明人： Teruomi Minami ,  Fumihiro Kamimura ,  Kazuki Kosai ,  Takashi Yabuta ,  Kenji Yokomizo ,  Shogo Mizota

IPC分类号： B08B3/04

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

摘要翻译： 在一种液体处理装置中，配置为从包括第一膜的第一膜和在第一膜上形成的第二膜的基板上除去第一膜和第二膜，第一药液供给部向基板W供给第一膜 用于溶解第一膜的液体，第二药液供给部供给用于削弱第二膜的第二药液，还用作冲击赋予部的流体供给部对第二膜产生物理冲击，从而破坏第二膜 并且提供用于洗涤破碎的第二膜的碎屑的流体。 控制装置控制各部分，使得在第二液体被供应之后，然后从流体供应部分供应流体，供应第一化学液体。

公开(公告)号：US20100319734A1

公开(公告)日：2010-12-23

申请号：US12634942

申请日：2009-12-10

申请人： Teruomi MINAMI ,  Fumihiro Kamimura ,  Kazuki Kosai ,  Takashi Yabuta ,  Kenji Yokomizo ,  Shogo Mizota

发明人： Teruomi MINAMI ,  Fumihiro Kamimura ,  Kazuki Kosai ,  Takashi Yabuta ,  Kenji Yokomizo ,  Shogo Mizota

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

摘要翻译： 在一种液体处理装置中，配置为从包括第一膜的第一膜和在第一膜上形成的第二膜的基板上除去第一膜和第二膜，第一药液供给部向基板W供给第一膜 用于溶解第一膜的液体，第二药液供给部供给用于削弱第二膜的第二药液，还用作冲击赋予部的流体供给部对第二膜产生物理冲击，从而破坏第二膜 并且提供用于洗涤破碎的第二膜的碎屑的流体。 控制装置控制各部分，使得在第二液体被供应之后，然后从流体供应部分供应流体，供应第一化学液体。