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公开(公告)号：US06784533B2
公开(公告)日：2004-08-31
申请号：US10212104
申请日：2002-08-06
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L2352
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
摘要翻译： 提供了一种高度可靠并且以高速度和低噪声操作的半导体器件。 在该半导体装置中，在一个层上形成有电力配线部1003a，接地配线部1003b以及信号配线部1003c。 功率配线部或接地配线部形成在信号配线部的至少一部分的两侧上。
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公开(公告)号：US06211576B1
公开(公告)日：2001-04-03
申请号：US09397853
申请日：1999-09-17
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
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公开(公告)号：US07119446B2
公开(公告)日：2006-10-10
申请号：US11348351
申请日：2006-02-07
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which includes a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential, and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof. Power bumps for outside connection are connected with the power pad by power wiring sections, ground bumps for outside connection are connected with the ground pad by ground wiring sections, and signal bumps for outside connection are connected with the signal pad by signal wiring sections. The power wiring sections or the ground wiring sections are respectively located adjacently on both sides of the signal wiring sections and the power wiring sections are respectively located adjacently on sides of the ground wiring sections.
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公开(公告)号：US20060125078A1
公开(公告)日：2006-06-15
申请号：US11348351
申请日：2006-02-07
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L23/52
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which includes a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential, and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof. Power bumps for outside connection are connected with the power pad by power wiring sections, ground bumps for outside connection are connected with the ground pad by ground wiring sections, and signal bumps for outside connection are connected with the signal pad by signal wiring sections. The power wiring sections or the ground wiring sections are respectively located adjacently on both sides of the signal wiring sections and the power wiring sections are respectively located adjacently on sides of the ground wiring sections.
摘要翻译： 提供了一种半导体器件，其包括具有用于提供电位的电源焊盘的半导体元件，用于提供接地电位的接地焊盘以及用于输入和输出信号的信号焊盘，所述信号焊盘都形成在其一个主表面上。 用于外部连接的电源凸块通过电源接线部分与电源焊盘连接，用于外部连接的接地凸块通过接地布线部分与接地焊盘连接，并且用于外部连接的信号凸块通过信号接线部分与信号焊盘连接。 功率配线部或接地配线部分别分别设置在信号配线部的两侧，电力配线部分别分别位于接地配线部的侧面。
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公开(公告)号：US06882039B2
公开(公告)日：2005-04-19
申请号：US10909402
申请日：2004-08-03
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L21/3205 , H01L21/60 , H01L21/822 , H01L23/50 , H01L23/52 , H01L23/552 , H01L23/64 , H01L23/66 , H01L27/04 , H01L27/14
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a semiconductor element having external terminals at a first level and external electrodes at a second level, higher than the first level. The external terminals include power terminals, ground terminals and signal terminals formed on a main surface of the semiconductor element. The external electrodes include power electrodes connected to the power terminals via power connecting sections, ground electrodes connected to the ground terminals via ground connecting sections and signal electrodes connected to the signal terminals via signal connecting sections. One of the signal terminals, signal electrodes and corresponding signal connecting sections are surrounded by either the power connecting sections connecting the power terminals and power electrodes or by the ground connection sections connecting the ground terminals and ground electrodes.
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公开(公告)号：US07030478B2
公开(公告)日：2006-04-18
申请号：US11108735
申请日：2005-04-19
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a semiconductor element having external terminals at a first level and external electrodes at a second level, higher than the first level. The external terminals include power terminals, ground terminals and signal terminals formed on a main surface of the semiconductor element. The external electrodes include power electrodes connected to the power terminals via power connecting sections, ground electrodes connected to the ground terminals via ground connecting sections and signal electrodes connected to the signal terminals via signal connecting sections. One of the signal terminals, signal electrodes and corresponding signal connecting sections are surrounded by either the power connecting sections connecting the power terminals and power electrodes or by the ground connection sections connecting the ground terminals and ground electrodes.
摘要翻译： 一种半导体器件，包括具有第一电平的外部端子和高于第一电平的第二电平的外部电极的半导体元件。 外部端子包括形成在半导体元件的主表面上的电源端子，接地端子和信号端子。 外部电极包括通过电源连接部分连接到电源端子的电力电极，经由接地连接部分连接到接地端子的接地电极和经由信号连接部分连接到信号端子的信号电极。 信号端子，信号电极和相应的信号连接部分之一被连接电源端子和电源电极的电源连接部分或连接接地端子和接地电极的接地连接部分包围。
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公开(公告)号：US20050184391A1
公开(公告)日：2005-08-25
申请号：US11108735
申请日：2005-04-19
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L21/3205 , H01L21/60 , H01L21/822 , H01L23/50 , H01L23/52 , H01L23/552 , H01L23/64 , H01L23/66 , H01L27/04 , H01L27/14 , H01L23/495 , H01L23/48
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a semiconductor element having external terminals at a first level and external electrodes at a second level, higher than the first level. The external terminals include power terminals, ground terminals and signal terminals formed on a main surface of the semiconductor element. The external electrodes include power electrodes connected to the power terminals via power connecting sections, ground electrodes connected to the ground terminals via ground connecting sections and signal electrodes connected to the signal terminals via signal connecting sections. One of the signal terminals, signal electrodes and corresponding signal connecting sections are surrounded by either the power connecting sections connecting the power terminals and power electrodes or by the ground connection sections connecting the ground terminals and ground electrodes.
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公开(公告)号：US06531785B2
公开(公告)日：2003-03-11
申请号：US09988587
申请日：2001-11-20
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L2940
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
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公开(公告)号：US06326699B2
公开(公告)日：2001-12-04
申请号：US09731757
申请日：2000-12-08
申请人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Tosiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
摘要翻译： 提供了一种高度可靠并且以高速度和低噪声操作的半导体器件。 在该半导体装置中，在一个层上形成有电力配线部1003a，接地配线部1003b以及信号配线部1003c。 功率配线部或接地配线部形成在信号配线部的至少一部分的两侧上。
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公开(公告)号：US20050006751A1
公开(公告)日：2005-01-13
申请号：US10909402
申请日：2004-08-03
申请人： Hiroya Shimizu , Asao Nishimura , Toshiho Miyamoto , Hideki Tanaka , Hideo Miura
发明人： Hiroya Shimizu , Asao Nishimura , Toshiho Miyamoto , Hideki Tanaka , Hideo Miura
IPC分类号： H01L21/3205 , H01L21/60 , H01L21/822 , H01L23/50 , H01L23/52 , H01L23/552 , H01L23/64 , H01L23/66 , H01L27/04 , H01L27/14
CPC分类号： H01L24/10 , H01L23/50 , H01L23/5286 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a semiconductor element having external terminals at a first level and external electrodes at a second level, higher than the first level. The external terminals include power terminals, ground terminals and signal terminals formed on a main surface of the semiconductor element. The external electrodes include power electrodes connected to the power terminals via power connecting sections, ground electrodes connected to the ground terminals via ground connecting sections and signal electrodes connected to the signal terminals via signal connecting sections. One of the signal terminals, signal electrodes and corresponding signal connecting sections are surrounded by either the power connecting sections connecting the power terminals and power electrodes or by the ground connection sections connecting the ground terminals and ground electrodes.
摘要翻译： 一种半导体器件，包括具有第一电平的外部端子和高于第一电平的第二电平的外部电极的半导体元件。 外部端子包括形成在半导体元件的主表面上的电源端子，接地端子和信号端子。 外部电极包括通过电源连接部分连接到电源端子的电力电极，经由接地连接部分连接到接地端子的接地电极和经由信号连接部分连接到信号端子的信号电极。 信号端子，信号电极和相应的信号连接部分之一被连接电源端子和电源电极的电源连接部分或连接接地端子和接地电极的接地连接部分包围。
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