摘要:
First, a trench of a semiconductor substrate is filled with a polysilicon film deposited on the surface of the semiconductor substrate. A selective thin film having etching selectivity with respect to the polysilicon film is formed on the polysilicon film. Then, the selective thin film is etched (etched back) so that a part of the selective thin film remains in a depression of the polysilicon film, as a self-aligning mask. The polysilicon film is further etched with the self-aligning mask, thereby forming a polysilicon embedded layer in the trench with a flat surface.
摘要:
By improving profile of impurity concentration in a channel portion of an FET or an IGBT of a trench gate type, variation of threshold value is lessened, and a destruction caused by current concentration is prevented while suppressing deterioration of cut-off characteristics. An island of a base region of p-type is formed in a semiconductor substrate of n-type by carrying out high acceleration ion implantation twice followed by annealing, so that the impurity concentration profile in a channel portion changes gradually in a depth direction. Accordingly, it is possible to lessen variation of the threshold value and to reduce pinch resistance while at the same time improving sub-threshold voltage coefficient and conductance characteristics.
摘要:
A semiconductor substrate has a trench for forming a gate insulation film and a gate electrode therein, or an insulated isolation isolating a semiconductor element like a transistor from other elements. The trench is formed by anisotropic dry etching. After that, a shape of the trench is improved so that a bottom portion and an opening portion are rounded or tapered by a wet process using a mixed solution containing hydrofluoric acid and nitric acid. By modifying the shape of the trench, electrical characteristics of the trench are improved. For example, an oxide film formed in the trench has high quality, whereby a gate withstanding voltage is improved.
摘要:
Whether a job execution instruction has been issued or not is determined. When it is determined that the job execution instruction has been issued, a job ID is issued. Contents of the job in accordance with the job execution instruction are checked. Then, whether the job is a Scan to USB memory job in an emulation mode or not is determined. When it is determined that the job is the Scan to USB memory job in the emulation mode, a sub job ID brought in correspondence with the issued job ID is issued.
摘要:
Determination is made whether acceptance of a job on a USB memory is permitted or not. When in a USB memory job acceptance permitted state, a USB memory job selection display process is executed. When in a USB memory job acceptance prohibited state, a USB memory plural load prohibition display process is executed. When in a USB memory job acceptance prohibited state, the relevant display screen is continuously provided. Therefore, the user is provided with the relevant display screen to be prompted confirmation of the loading of a USB memory.
摘要:
A charging management server is informed of an ED number stored in an IC card, and a user charging table of the charging management server is read. A new user charging list is transmitted to an MFP. In the case where the MFP receives a cooperative job to be executed by a cooperative server, a sub charging list is generated. The generated new sub charging list is transmitted together with image data to the cooperative server. The cooperative server executes the job on the basis of charging a fee for the job. As the job is executed on the basis of charging, the sub charging list is updated. In parallel with the execution of the cooperative job by the cooperative server, the WP can perform a normal job according to the charging list.
摘要:
In manufacturing a semiconductor device including a substrate having a (111)-plane orientation and an off-set angle in a range between 3 degrees and 4 degrees, a capacitor, a transistor and a diffusion resistor are formed in the substrate, each of which are separated by a junction separation layer. A first silicon nitride film is formed by low pressure CVD over a surface of the substrate except a bottom portion of a contact hole and a portion over the junction separation layer, and a silicon oxide film is formed by low pressure CVD over the first silicon nitride film. A second silicon nitride film as a protecting film is formed by plasma CVD so as to cover the semiconductor device finally. Therefore, the semiconductor device having high reliability can be obtained.
摘要:
A radio-frequency-signal generator generates an RF signal. An optical monitor monitors a first intensity of a reference signal and a second intensity of a drop signal. A reference-frequency determining unit determines, based on the first intensity, a first frequency of an RF signal that causes the AOTF to output the reference signal. A temperature detecting unit detects a temperature of the AOTF. A frequency calculating unit calculates a second frequency of an RF signal that causes the AOTF to output a drop signal of a desired wavelength. A control unit controls the RF-signal generator to generate the RF signal of the second frequency calculated.
摘要:
A semiconductor device, which can prevent a current capability from deteriorating with time, is disclosed. A P-channel type LDMOS is formed in an N-type monocrystal silicon substrate. The P-channel type LDMOS includes: a P-type impurity diffusion layer formed in a well shape so as to reach a predetermined depth; a channel well layer formed by double-diffusing N-type impurities; a source diffusion layer; a potential fixing electrode; drain-contact electrode; a LOCOS oxide film; a gate electrode; a drain electrode; a source electrode; and so on. Especially, the gate electrode is formed so as to overlap onto the LOCOS oxide film, and its protrusion amount onto the LOCOS oxide film (gate overlap length O/L) is set to about 10 μm, which is substantially ½ of a width size of the LOCOS oxide film.
摘要:
An image communicating apparatus comprises:an input device to input image data;a dividing circuit to divide the input image data into a plurality of blocks each of which is constructed by a predetermined number of pixels, an encoder to encode the image data on a unit basis of the blocks divided by the dividing circuit;and a transmission unit for allocating the data divided and encoded by the dividing circuit and the encoder to an arbitrary channel among a plurality of information channels on a block unit basis.