摘要:
Provided is a process of producing a liquid discharge head having a substrate, a passage-forming member, and a patterned layer. The process includes providing a resin layer on a substrate; providing a resist pattern on the resin layer for patterning the resin layer; forming a patterned layer by patterning the resin layer using the resist pattern as a mask; providing a layer for forming a passage pattern having a shape of passage on the resist pattern lying on the patterned layer; forming a passage pattern by patterning the layer for forming a passage pattern; removing the resist pattern; providing a passage-forming member so as to cover the passage pattern and the patterned layer; and removing the passage pattern to give the passage.
摘要:
Provided is a process of producing a liquid discharge head having a substrate, a passage-forming member, and a patterned layer. The process includes providing a resin layer on a substrate; providing a resist pattern on the resin layer for patterning the resin layer; forming a patterned layer by patterning the resin layer using the resist pattern as a mask; providing a layer for forming a passage pattern having a shape of passage on the resist pattern lying on the patterned layer; forming a passage pattern by patterning the layer for forming a passage pattern; removing the resist pattern; providing a passage-forming member so as to cover the passage pattern and the patterned layer; and removing the passage pattern to give the passage.
摘要:
The present invention provides an ink jet recording head which includes a substrate, an energy generating element which is disposed on the substrate and generates energy for discharging a liquid, an electrode which is disposed on the substrate and is electrically connected to the energy generating element, a passage-forming member which is disposed on the substrate, an adhesion layer which is disposed on the substrate and facilitates adhesion between the passage-forming member and the substrate, and a bump disposed on the electrode. The area of an upper surface of the bump is larger than the area of a lower surface of the bump, the lower surface being located on the substrate side, the upper surface being located opposite the lower surface, and a side face of the bump is covered with the adhesion layer. Thereby, a protective film is formed around the bump.
摘要:
A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.
摘要:
A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.
摘要:
The present invention provides an ink jet recording head which includes a substrate, an energy generating element which is disposed on the substrate and generates energy for discharging a liquid, an electrode which is disposed on the substrate and is electrically connected to the energy generating element, a passage-forming member which is disposed on the substrate, an adhesion layer which is disposed on the substrate and facilitates adhesion between the passage-forming member and the substrate, and a bump disposed on the electrode. The area of an upper surface of the bump is larger than the area of a lower surface of the bump, the lower surface being located on the substrate side, the upper surface being located opposite the lower surface, and a side face of the bump is covered with the adhesion layer. Thereby, a protective film is formed around the bump.
摘要:
A method for processing a silicon substrate includes preparing a first silicon substrate including an etching mask layer including first and second opening portions; forming a first recess in a portion of the silicon substrate corresponding to a region in the first opening portion; etching the silicon substrate by crystal anisotropic etching through the etching mask layer with an etching apparatus and an etchant, the etching proceeding in the first and second opening portions to form a through hole in a position corresponding to the first opening portion and to form a second recess in a position corresponding to the second opening portion; calculating an etching rate of the silicon substrate in terms of the etchant by using the second recess; and determining, by using the calculated etching rate, an etching condition for etching another silicon substrate with the etching apparatus after the etching of the first silicon substrate.
摘要:
Provided is a process for producing a liquid ejection head including an ejection orifice member having a plurality of ejection orifices for ejecting liquid provided along an arrangement direction, the process including preparing a substrate provided with a resin layer which contains a photocurable resin;carrying out a first exposure treatment and a second exposure treatment which are each of an exposure treatment of subjecting the resin layer to exposure; and forming the ejection orifices of the resin layer subjected to the first exposure treatment and the second exposure treatment. An inclination angle of a side wall of the ejection orifices formed by the first exposure treatment with respect to the substrate differs from an inclination angle of a side wall of the ejection orifices formed by the second exposure treatment with respect to the substrate.
摘要:
Provided is a liquid ejection head, including: a flow path forming member including: an ejection orifice for ejecting liquid therefrom; and a liquid flow path communicated with the ejection orifice; a silicon substrate including a supply port for supplying the liquid to the liquid flow path; and a protective film which is formed on a wall surface of the supply port and which is formed of an organic resin which is the same as a material of a member forming the flow path forming member.
摘要:
Provided is a process for producing a liquid ejection head including an ejection orifice member having a plurality of ejection orifices for ejecting liquid provided along an arrangement direction, the process including preparing a substrate provided with a resin layer which contains a photocurable resin; carrying out a first exposure treatment and a second exposure treatment which are each of an exposure treatment of subjecting the resin layer to exposure; and forming the ejection orifices of the resin layer subjected to the first exposure treatment and the second exposure treatment. An inclination angle of a side wall of the ejection orifices formed by the first exposure treatment with respect to the substrate differs from an inclination angle of a side wall of the ejection orifices formed by the second exposure treatment with respect to the substrate.