公开(公告)号：US06297530B1

公开(公告)日：2001-10-02

申请号：US09418181

申请日：1998-12-28

申请人： Hiroyuki Akatsu ,  Yujun Li ,  Jochen Beintner

发明人： Hiroyuki Akatsu ,  Yujun Li ,  Jochen Beintner

IPC分类号： H01L2976

CPC分类号： H01L29/66583 ,  H01L21/823412 ,  H01L29/105

摘要： A short channel insulated gate field effect transistor has within the semiconductor body that houses the transistor a buried layer of the same conductivity type as the body but of higher impurity concentration. The buried layer is below the channel region and essentially extends only the distance between the drain and source regions of the transistor. The process to form the device provides high concentration in the region under the gate to suppress lateral depletion region expansion, while keeping a gradual junction in the vertical direction.

摘要翻译： 短沟道绝缘栅场效应晶体管在半导体本体内部具有与晶体管相同的导电类型的掩埋层，但具有较高的杂质浓度。 掩埋层在沟道区下方，并且基本上只延伸晶体管的漏极和源极区之间的距离。 形成器件的过程在栅极下方的区域提供高浓度，以抑制横向耗尽区域膨胀，同时保持垂直方向上的逐渐连接。

公开(公告)号：US06329271B1

公开(公告)日：2001-12-11

申请号：US09588244

申请日：2000-06-06

申请人： Hiroyuki Akatsu ,  Yujun Li ,  Jochen Beintner

发明人： Hiroyuki Akatsu ,  Yujun Li ,  Jochen Beintner

IPC分类号： H01L21425

CPC分类号： H01L29/66583 ,  H01L21/823412 ,  H01L29/105

摘要： A short channel insulated gate field effect transistor has within the semiconductor body that houses the transistor a buried layer of the same conductivity type as the body but of higher impurity concentration. The buried layer is below the channel region and essentially extends only the distance between the drain and source regions of the transistor. The process to form the device provides high concentration in the region under the gate to suppress lateral depletion region expansion, while keeping a gradual junction in the vertical direction.

摘要翻译： 短沟道绝缘栅场效应晶体管在半导体本体内部具有与晶体管相同的导电类型的掩埋层，但具有较高的杂质浓度。 掩埋层在沟道区下方，并且基本上只延伸晶体管的漏极和源极区之间的距离。 形成器件的过程在栅极下方的区域提供高浓度，以抑制横向耗尽区域膨胀，同时保持垂直方向上的逐渐连接。

公开(公告)号：US06329704B1

公开(公告)日：2001-12-11

申请号：US09458530

申请日：1999-12-09

申请人： Hiroyuki Akatsu ,  Omer H. Dokumaci ,  Suryanarayan G. Hegde ,  Yujun Li ,  Rajesh Rengarajan ,  Paul A. Ronsheim

发明人： Hiroyuki Akatsu ,  Omer H. Dokumaci ,  Suryanarayan G. Hegde ,  Yujun Li ,  Rajesh Rengarajan ,  Paul A. Ronsheim

IPC分类号： H01L29167

CPC分类号： H01L21/2652 ,  H01L21/2254 ,  H01L21/2255 ,  H01L29/6659

摘要： A process for forming an ultra-shallow junction depth, doped region within a silicon substrate. The process includes forming a dielectric film on the substrate, then implanting an ionic dopant species into the structure. The profile of the implanted species includes a population implanted through the dielectric film and into the silicon substrate, and a peak concentration deliberately confined in the dielectric film in close proximity to the interface between the dielectric film and the silicon substrate. A high-energy, low-dosage implant process is used and produces a structure that is substantially free of dislocation loops and other defect clusters. An annealing process is used to drive the peak concentration closer to the interface, and some of the population of the originally implanted species from the dielectric film into the silicon substrate. A low thermal budget is maintained because of the proximity of the as-implanted peak concentration to the interface and the presence of species implanted through the dielectric film and into the substrate.

摘要翻译： 一种用于在硅衬底内形成超浅结深度掺杂区的工艺。 该方法包括在衬底上形成电介质膜，然后将离子掺杂剂物质注入结构中。 植入物种的轮廓包括通过电介质膜注入硅衬底中的群体，以及刻意限制在电介质膜中的接近于介电膜和硅衬底之间界面的峰值浓度。 使用高能量，低剂量的植入工艺，并且产生基本上不含位错环和其它缺陷簇的结构。 使用退火工艺来驱动更接近界面的峰值浓度，以及从电介质膜到硅衬底的最初注入物质的一些群体。 由于植入的峰浓度与界面的接近以及通过电介质膜注入并进入衬底的物质的存在，维持了低热量预算。

公开(公告)号：US06387782B2

公开(公告)日：2002-05-14

申请号：US09875072

申请日：2001-06-06

申请人： Hiroyuki Akatsu ,  Omer H. Dokumaci ,  Suryanarayan G. Hegde ,  Yujun Li ,  Rajesh Rengarajan ,  Paul A. Ronsheim

发明人： Hiroyuki Akatsu ,  Omer H. Dokumaci ,  Suryanarayan G. Hegde ,  Yujun Li ,  Rajesh Rengarajan ,  Paul A. Ronsheim

IPC分类号： H01L21336

CPC分类号： H01L21/2652 ,  H01L21/2254 ,  H01L21/2255 ,  H01L29/6659

摘要： A process for forming an ultra-shallow junction depth, doped region within a silicon substrate. The process includes forming a dielectric film on the substrate, then implanting an ionic dopant species into the structure. The profile of the implanted species includes a population implanted through the dielectric film and into the silicon substrate, and a peak concentration deliberately confined in the dielectric film in close proximity to the interface between the dielectric film and the silicon substrate. A high-energy, low-dosage implant process is used and produces a structure that is substantially free of dislocation loops and other defect clusters. An annealing process is used to drive the peak concentration closer to the interface, and some of the population of the originally implanted species from the dielectric film into the silicon substrate. A low thermal budget is maintained because of the proximity of the as-implanted peak concentration to the interface and the presence of species implanted through the dielectric film and into the substrate.

摘要翻译： 一种用于在硅衬底内形成超浅结深度掺杂区的工艺。 该方法包括在衬底上形成电介质膜，然后将离子掺杂剂物质注入结构中。 植入物种的轮廓包括通过电介质膜注入硅衬底中的群体，以及刻意限制在电介质膜中的接近于介电膜和硅衬底之间界面的峰值浓度。 使用高能量，低剂量的植入工艺，并且产生基本上不含位错环和其它缺陷簇的结构。 使用退火工艺来驱动更接近界面的峰值浓度，以及从电介质膜到硅衬底的最初注入物质的一些群体。 由于植入的峰浓度与界面的接近以及通过电介质膜注入并进入衬底的物质的存在，维持了低热量预算。

公开(公告)号：US20100332444A1

公开(公告)日：2010-12-30

申请号：US12825830

申请日：2010-06-29

申请人： Hiroyuki Akatsu ,  Hisashi Miyashita ,  Hiroaki Nakamura ,  Takashi Nerome

发明人： Hiroyuki Akatsu ,  Hisashi Miyashita ,  Hiroaki Nakamura ,  Takashi Nerome

IPC分类号： G06N5/02 ,  G06G7/48

CPC分类号： G06N5/025 ,  G06F17/5095

摘要： An automatic designing system includes: a rule storage unit storing sets of rewrite rules for rewriting variable nodes of a hierarchically structured graph in a design architecture for the system; a search unit sequentially determining variable nodes as application targets for the rewrite rules by searching the graph, including components in the design architecture for the system to be designed, using a search tree; a judgment unit judging whether the rewrite rule is applicable to the determined variable node; and a rule application unit replacing the determined variable node with a partial graph, including at least one of fixed and variable nodes, according to the rewrite rule, in response to a judgment that the rewrite rule is applicable. The search unit performs the searching until an undefined variable node no longer exists in the graph to be designed, and performs backtracking on condition that no variable node is found.

摘要翻译： 自动设计系统包括：规则存储单元，用于存储用于重构用于系统的设计架构中用于重写分层结构化图形的可变节点的重写规则; 搜索单元使用搜索树通过搜索包括要设计的系统的设计架构中的组件的图来顺序地将变量节点确定为重写规则的应用目标; 判断单元判断所述重写规则是否适用于所确定的变量节点; 以及规则应用单元，响应于可重写规则的判断，根据重写规则，用包括固定节点和可变节点中的至少一个的部分图替换确定的变量节点。 搜索单元执行搜索，直到要设计的图中不再存在未定义的变量节点，并且在没有找到变量节点的条件下执行回溯。

公开(公告)号：US20080052144A1

公开(公告)日：2008-02-28

申请号：US11776151

申请日：2007-07-11

申请人： Hiroyuki Akatsu ,  Kenji Eda ,  Yo Murai ,  Teruaki Okano ,  Yasuharu Yada ,  Masao Yamada

发明人： Hiroyuki Akatsu ,  Kenji Eda ,  Yo Murai ,  Teruaki Okano ,  Yasuharu Yada ,  Masao Yamada

IPC分类号： G06F9/46

CPC分类号： G06Q10/06 ,  G06Q10/063 ,  G06Q10/0633

摘要： A system and method for managing a workflow are provided. A system for managing a workflow in accordance with an embodiment of the invention includes: a storage unit for storing, as an access history for each of at least one artifact, identification information of a business process that has accessed the artifact; a request reception unit for receiving an access request to an artifact from a user; a first notification unit for retrieving an access history corresponding to a first artifact from the storage unit on a condition that a first access request received from the user corresponding to a first business process is an update request of the first artifact, and for notifying a user corresponding to the business process that is identified in the retrieved access history that the first artifact is to be updated; and a history adding unit for adding identification information of the first business process to the access history corresponding to the first artifact in response to an accessing of the first artifact based on the first access request.

摘要翻译： 提供了一种用于管理工作流的系统和方法。 根据本发明的实施例的用于管理工作流的系统包括：存储单元，用于存储已访问所述工件的业务处理的识别信息作为至少一个工件中的每一个的访问历史; 请求接收单元，用于从用户接收对工件的访问请求; 第一通知单元，用于在从与第一业务处理对应的用户接收到的第一访问请求是第一伪像的更新请求的条件下从存储单元检索与第一伪像相对应的访问历史，并且用于通知用户 对应于在检索的访问历史中识别出的第一个工件将被更新的业务流程; 以及历史添加单元，用于响应于基于第一访问请求访问第一伪像，将第一业务处理的标识信息添加到与第一伪像相对应的访问历史。

公开(公告)号：US07190046B2

公开(公告)日：2007-03-13

申请号：US10708860

申请日：2004-03-29

申请人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Marwan Khater ,  Christopher M. Schnabel ,  William Tonti

发明人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Marwan Khater ,  Christopher M. Schnabel ,  William Tonti

IPC分类号： H01L27/082 ,  H01L21/331

CPC分类号： H01L29/66242 ,  H01L29/0649 ,  H01L29/0692 ,  H01L29/0821

摘要： Structure and method are provided for forming a bipolar transistor. As disclosed, an intrinsic base layer is provided overlying a collector layer. A low-capacitance region is disposed laterally adjacent the collector layer. The low-capacitance region includes at least one of a dielectric region and a void disposed in an undercut underlying the intrinsic base layer. An emitter layer overlies the intrinsic base layer, and a raised extrinsic base layer overlies the intrinsic base layer.

摘要翻译： 提供了用于形成双极晶体管的结构和方法。 如所公开的，提供覆盖在集电极层上的本征基层。 低电容区域横向设置在集电极层附近。 低电容区域包括设置在本征基层下面的底切中的电介质区域和空穴中的至少一个。 发射极层覆盖本征基极层，凸起的非本征基极层覆盖本征基极层。

公开(公告)号：US20050212087A1

公开(公告)日：2005-09-29

申请号：US10708860

申请日：2004-03-29

申请人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Marwan Khater ,  Christopher Schnabel ,  William Tonti

发明人： Hiroyuki Akatsu ,  Rama Divakaruni ,  Marwan Khater ,  Christopher Schnabel ,  William Tonti

IPC分类号： H01L21/331 ,  H01L27/102 ,  H01L29/06 ,  H01L29/08

CPC分类号： H01L29/66242 ,  H01L29/0649 ,  H01L29/0692 ,  H01L29/0821

摘要： Structure and method are provided for forming a bipolar transistor. As disclosed, an intrinsic base layer is provided overlying a collector layer. A low-capacitance region is disposed laterally adjacent the collector layer. The low-capacitance region includes at least one of a dielectric region and a void disposed in an undercut underlying the intrinsic base layer. An emitter layer overlies the intrinsic base layer, and a raised extrinsic base layer overlies the intrinsic base layer.

摘要翻译： 提供了用于形成双极晶体管的结构和方法。 如所公开的，提供覆盖在集电极层上的本征基层。 低电容区域横向设置在集电极层附近。 低电容区域包括设置在本征基层下面的底切中的电介质区域和空穴中的至少一个。 发射极层覆盖本征基极层，凸起的非本征基极层覆盖本征基极层。

公开(公告)号：US06893938B2

公开(公告)日：2005-05-17

申请号：US10419588

申请日：2003-04-21

申请人： Munir D. Naeem ,  Hiroyuki Akatsu ,  Byeong Kim ,  Rolf Weis ,  David Mark Dobuzinksy ,  Johnathan E. Faltermeier

发明人： Munir D. Naeem ,  Hiroyuki Akatsu ,  Byeong Kim ,  Rolf Weis ,  David Mark Dobuzinksy ,  Johnathan E. Faltermeier

IPC分类号： H01L21/308 ,  H01L21/762 ,  H01L21/76

CPC分类号： H01L21/76232 ,  H01L21/3081

摘要： A method for forming shallow trench isolation (STI) for semiconductor devices. A first hard mask is deposited over a semiconductor wafer, and a second hard mask is deposited over the first hard mask. The semiconductor wafer includes a first etching zone and at least a second etching zone disposed beneath the first etching zone. The etch process for the first etching zone and the etch process for the at least one second etching zone are selected such that smooth sidewall surface structures are formed within the semiconductor device. The etch processes for each subsequent etching zone may alternate between non-selective and selective etch processes to preserve at least the first hard mask material.

摘要翻译： 一种用于形成用于半导体器件的浅沟槽隔离（STI）的方法。 第一硬掩模沉积在半导体晶片上，并且第二硬掩模沉积在第一硬掩模上。 半导体晶片包括第一蚀刻区和设置在第一蚀刻区下方的至少第二蚀刻区。 选择用于第一蚀刻区域的蚀刻工艺和用于至少一个第二蚀刻区域的蚀刻工艺，使得在半导体器件内形成平滑的侧壁表面结构。 每个后续蚀刻区域的蚀刻工艺可以在非选择性和选择性蚀刻工艺之间交替，以至少保留第一硬掩模材料。

公开(公告)号：US06809027B2

公开(公告)日：2004-10-26

申请号：US10165264

申请日：2002-06-06

申请人： Jay W. Strane ,  Hiroyuki Akatsu ,  David M. Dobuzinsky

发明人： Jay W. Strane ,  Hiroyuki Akatsu ,  David M. Dobuzinsky

IPC分类号： H01L214763

CPC分类号： H01L21/76897

摘要： A method for forming high-density self-aligned contacts and interconnect structures in a semiconductor device. A dielectric layer thick enough to contain both interconnect and contact structures is formed on a substrate. A patterned hardmask is formed on the dielectric layer to define both the interconnect and contact structures. The openings for interconnect features are first formed by partially etching the dielectric layer selective to the hardmask. A second mask (e.g., a resist) is used to define the contact openings, and the dielectric layer is etched through the second mask, also selective to the hardmask, to expose the diffusion regions to be contacted. The patterned hardmask is used to help define the contact openings. Conductive material is then deposited in the openings which results in contacts and interconnects that are self-aligned. By first forming the openings for both interconnect and contacts, savings in processing steps may be obtained.