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    Method of splicing optical fibers by CO.sub.2 -laser
    1.
    发明授权
    Method of splicing optical fibers by CO.sub.2 -laser 失效
    CO2激光器拼接光纤的方法

    公开(公告)号：US4263495A

    公开(公告)日：1981-04-21

    申请号：US924757

    申请日：1978-07-14

    申请人： Hiroyuki Fujita ,  Yasuzi Suzaki ,  Atsushi Tachibana

    发明人： Hiroyuki Fujita ,  Yasuzi Suzaki ,  Atsushi Tachibana

    IPC分类号： E04F11/16 ,  B23K26/02 ,  G02B6/255 ,  G02B6/28 ,  B23K27/00

    CPC分类号： B23K26/02 ,  B23K26/042 ,  G02B6/2551 ,  G02B6/2856

    摘要： A method of permanently joining or splicing optical fibers containing a fused silica or fused quartz fiber as a main component and having a high softening temperature by using a CO.sub.2 -laser with TEM.sub.oo mode in such a manner that laser power of about 1 watt may be applied to the optical fiber per unit area thereof. Two or more optical fibers are joined together through fusion with the end portions being positioned in opposition to one another, resulting in a joint having a low joint loss and an increased tensile strength.

    摘要翻译： 通过使用具有TEMoo模式的CO 2激光器，以使得可以施加大约1瓦的激光功率的方式永久地连接或拼接包含熔融二氧化硅或熔融石英纤维作为主要组分并且具有高软化温度的光纤的方法 到每单位面积的光纤。 两根以上的光纤通过熔接而接合在一起，端部彼此相对设置，导致具有低接头损耗和增加的拉伸强度的接头。

    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards
    3.
    发明授权
    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards 失效
    具有符合不兼容通信标准的无线通信功能的无线通信装置

    公开(公告)号：US08005504B2

    公开(公告)日：2011-08-23

    申请号：US11560170

    申请日：2006-11-15

    申请人： Eiichi Sano ,  Hiroyuki Fujita

    发明人： Eiichi Sano ,  Hiroyuki Fujita

    IPC分类号： H04M1/00

    CPC分类号： H04W52/42 ,  H04B7/0602 ,  H04B7/0805 ,  H04B7/0825 ,  H04M2250/02 ,  H04M2250/06

    摘要： A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.

    摘要翻译： 提供一种无线通信装置。 无线通信装置包括符合不兼容的第一和第二通信标准的无线通信功能。 无线通信装置包括执行符合第一通信标准的无线通信操作的第一收发器，并且包括第一发送/接收端口，执行符合第二通信标准的无线通信操作的第二收发器，并且包括第二发送/ 接收端口，由第一和第二收发器共享的共享天线，连接共享天线与第一和第二发送/接收端口的天线连接单元，以及控制单元，其控制第一和第二收发器中的通信操作 收发器

    ELECTROMAGNETIC RELAY
    9.
    发明申请
    ELECTROMAGNETIC RELAY 有权
    电磁继电器

    公开(公告)号：US20090096559A1

    公开(公告)日：2009-04-16

    申请号：US12297393

    申请日：2007-05-11

    申请人： Keisuke Yano ,  Masayuki Noda ,  Hiroshi Ono ,  Hiroyuki Fujita

    发明人： Keisuke Yano ,  Masayuki Noda ,  Hiroshi Ono ,  Hiroyuki Fujita

    IPC分类号： H01H50/54

    CPC分类号： H01H50/546 ,  H01H9/443 ,  H01H49/00 ,  H01H50/023 ,  H01H50/045 ,  H01H50/36 ,  H01H50/443 ,  H01H2050/025

    摘要： An electromagnetic relay has a solenoid formed from a wound coil, a movable iron core that is reciprocated upwardly and downwardly in an axial hole of the solenoid, and a movable contact point that reciprocates together with the movable iron core. The movable contact point is contacted and separated with and from a fixed contact point for opening and closing a contact point. An arc generated at a time of opening and closing of the contact point is flowed, in a predetermined direction, by the magnetic field of at least a single permanent magnet placed at a side of the fixed contact point and the movable contact point that are contacted and separated with and from each other. Coil terminals are connected to leader lines of the coil, at least at a single side of the flow of the arc.

    摘要翻译： 电磁继电器具有由绕线圈形成的螺线管，在螺线管的轴向孔中往复运动的可动铁芯和与可动铁芯往复运动的可动接点。 活动触点与固定触点接触和分离，用于打开和关闭触点。 在接触点的打开和关闭时产生的电弧在预定方向上通过放置在接触点的固定触点和可动触点的一侧的至少一个永磁体的磁场流动 并与彼此分离。 线圈端子连接到线圈的引线，至少在电弧流的单侧。

    System in-package test inspection apparatus and test inspection method
    10.
    发明授权
    System in-package test inspection apparatus and test inspection method 失效
    系统包装试验检验装置及试验检验方法

    公开(公告)号：US07414422B2

    公开(公告)日：2008-08-19

    申请号：US11108861

    申请日：2005-04-19

    申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

    发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

    摘要翻译： 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置， 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板， 连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。